ZBT SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, LQFP-100
| 参数名称 | 属性值 |
| 厂商名称 | NEC(日电) |
| 零件包装代码 | QFP |
| 包装说明 | LQFP, |
| 针数 | 100 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.B.2.A |
| 最长访问时间 | 3.8 ns |
| JESD-30 代码 | R-PQFP-G100 |
| 长度 | 20 mm |
| 内存密度 | 9437184 bit |
| 内存集成电路类型 | ZBT SRAM |
| 内存宽度 | 36 |
| 功能数量 | 1 |
| 端子数量 | 100 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX36 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LQFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.7 mm |
| 最大供电电压 (Vsup) | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | QUAD |
| 宽度 | 14 mm |
| Base Number Matches | 1 |
| UPD4381362GF-A67 | UPD4381182GF-A75 | UPD4381162GF-A75 | UPD4381162GF-A10 | UPD4381322GF-A67 | UPD4381362GF-A75 | UPD4381322GF-A75 | |
|---|---|---|---|---|---|---|---|
| 描述 | ZBT SRAM, 256KX36, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, LQFP-100 | ZBT SRAM, 512KX18, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, LQFP-100 | ZBT SRAM, 512KX16, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, LQFP-100 | ZBT SRAM, 512KX16, 5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, LQFP-100 | ZBT SRAM, 256KX32, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, LQFP-100 | ZBT SRAM, 256KX36, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, LQFP-100 | ZBT SRAM, 256KX32, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, LQFP-100 |
| 厂商名称 | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, |
| 针数 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 3.8 ns | 4.2 ns | 4.2 ns | 5 ns | 3.8 ns | 4.2 ns | 4.2 ns |
| JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
| 长度 | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
| 内存密度 | 9437184 bit | 9437184 bit | 8388608 bit | 8388608 bit | 8388608 bit | 9437184 bit | 8388608 bi |
| 内存集成电路类型 | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM |
| 内存宽度 | 36 | 18 | 16 | 16 | 32 | 36 | 32 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| 字数 | 262144 words | 524288 words | 524288 words | 524288 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 512000 | 512000 | 512000 | 256000 | 256000 | 256000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX36 | 512KX18 | 512KX16 | 512KX16 | 256KX32 | 256KX36 | 256KX32 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.7 mm | 1.7 mm | 1.7 mm | 1.7 mm | 1.7 mm | 1.7 mm | 1.7 mm |
| 最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
stm32/stm8
电源技术
FPGA/CPLD
创意市集
聊聊、笑笑、闹闹
淘e淘
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
