Cache SRAM, 256KX32, 2.6ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100
| 参数名称 | 属性值 |
| 厂商名称 | SAMSUNG(三星) |
| 零件包装代码 | QFP |
| 包装说明 | LQFP, |
| 针数 | 100 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.B.2.A |
| 最长访问时间 | 2.6 ns |
| 其他特性 | PIPELINED ARCHITECTURE |
| JESD-30 代码 | R-PQFP-G100 |
| 长度 | 20 mm |
| 内存密度 | 8388608 bit |
| 内存集成电路类型 | CACHE SRAM |
| 内存宽度 | 32 |
| 功能数量 | 1 |
| 端子数量 | 100 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256KX32 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LQFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大供电电压 (Vsup) | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | QUAD |
| 宽度 | 14 mm |
| Base Number Matches | 1 |
| K7A803209B-QI250 | K7A803609B-QI200 | K7A803609B-QC200 | K7A801809B-QC200 | K7A803209B-QI200 | K7A803609B-HC200 | K7A803209B-QC200 | K7A803209B-QC250 | K7A801809B-QI200 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Cache SRAM, 256KX32, 2.6ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | Cache SRAM, 256KX36, 3.1ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | Cache SRAM, 256KX36, 3.1ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | Cache SRAM, 512KX18, 3.1ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | Cache SRAM, 256KX32, 3.1ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | Cache SRAM, 256KX36, 3.1ns, CMOS, PBGA119, BGA-119 | Cache SRAM, 256KX32, 3.1ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | Cache SRAM, 256KX32, 2.6ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | Cache SRAM, 512KX18, 3.1ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP | BGA | QFP | QFP | QFP |
| 包装说明 | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, | BGA, | LQFP, | LQFP, | LQFP, |
| 针数 | 100 | 100 | 100 | 100 | 100 | 119 | 100 | 100 | 100 |
| Reach Compliance Code | unknown | unknown | unknown | compliant | unknown | unknown | unknown | unknown | compliant |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 2.6 ns | 3.1 ns | 3.1 ns | 3.1 ns | 3.1 ns | 3.1 ns | 3.1 ns | 2.6 ns | 3.1 ns |
| 其他特性 | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE |
| JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PBGA-B119 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
| 长度 | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 22 mm | 20 mm | 20 mm | 20 mm |
| 内存密度 | 8388608 bit | 9437184 bit | 9437184 bit | 9437184 bit | 8388608 bit | 9437184 bit | 8388608 bit | 8388608 bit | 9437184 bit |
| 内存集成电路类型 | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
| 内存宽度 | 32 | 36 | 36 | 18 | 32 | 36 | 32 | 32 | 18 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 100 | 100 | 100 | 100 | 100 | 119 | 100 | 100 | 100 |
| 字数 | 262144 words | 262144 words | 262144 words | 524288 words | 262144 words | 262144 words | 262144 words | 262144 words | 524288 words |
| 字数代码 | 256000 | 256000 | 256000 | 512000 | 256000 | 256000 | 256000 | 256000 | 512000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| 组织 | 256KX32 | 256KX36 | 256KX36 | 512KX18 | 256KX32 | 256KX36 | 256KX32 | 256KX32 | 512KX18 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | LQFP | LQFP | LQFP | LQFP | BGA | LQFP | LQFP | LQFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | GRID ARRAY | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | BALL | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | BOTTOM | QUAD | QUAD | QUAD |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
| 厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | - | - | - | - | SAMSUNG(三星) | SAMSUNG(三星) |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | - | 1.6 mm | 1.6 mm | 1.6 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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