Multiplexer, 2-Func, 4 Line Input, TTL, CDFP16,
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
包装说明 | DFP, FL16,.3 |
Reach Compliance Code | compliant |
JESD-30 代码 | R-XDFP-F16 |
JESD-609代码 | e0 |
逻辑集成电路类型 | MULTIPLEXER |
湿度敏感等级 | 2A |
功能数量 | 2 |
输入次数 | 4 |
端子数量 | 16 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | CERAMIC |
封装代码 | DFP |
封装等效代码 | FL16,.3 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | 250 |
电源 | 5 V |
认证状态 | Not Qualified |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
Base Number Matches | 1 |
74LS352FCQM | 54LS352DMQB | 74LS352DCQM | 74LS352DCQR | 74LS352PCQR | 74LS352SC | 74LS352PCQM | 74LS352FCQR | |
---|---|---|---|---|---|---|---|---|
描述 | Multiplexer, 2-Func, 4 Line Input, TTL, CDFP16, | Multiplexer, 2-Func, 4 Line Input, TTL, CDIP16, | Multiplexer, 2-Func, 4 Line Input, TTL, CDIP16, | Multiplexer, 2-Func, 4 Line Input, TTL, CDIP16, | Multiplexer, 2-Func, 4 Line Input, TTL, PDIP16, | Multiplexer, 2-Func, 4 Line Input, TTL, PDSO16, | Multiplexer, 2-Func, 4 Line Input, TTL, PDIP16, | Multiplexer, 2-Func, 4 Line Input, TTL, CDFP16, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 | DFP, FL16,.3 |
Reach Compliance Code | compliant | unknown | compliant | compliant | compliant | compliant | compliant | compliant |
JESD-30 代码 | R-XDFP-F16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-XDFP-F16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
输入次数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
封装代码 | DFP | DIP | DIP | DIP | DIP | SOP | DIP | DFP |
封装等效代码 | FL16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.25 | DIP16,.3 | FL16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | FLATPACK |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | NO | NO | YES | NO | YES |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | FLAT |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
湿度敏感等级 | 2A | - | 2A | 2A | 2A | 2A | 2A | 2A |
峰值回流温度(摄氏度) | 250 | - | 250 | 250 | 250 | 250 | 250 | 250 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | - |
处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | 30 | 30 | 30 | 30 |
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