Flash, 2MX16, 150ns, CDSO44, SOJ-44
参数名称 | 属性值 |
包装说明 | SOJ, |
Reach Compliance Code | compliant |
最长访问时间 | 150 ns |
备用内存宽度 | 8 |
JESD-30 代码 | R-CDSO-J44 |
长度 | 28.7 mm |
内存密度 | 33554432 bit |
内存集成电路类型 | FLASH |
内存宽度 | 16 |
功能数量 | 1 |
端子数量 | 44 |
字数 | 2097152 words |
字数代码 | 2000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 2MX16 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | SOJ |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | PARALLEL |
编程电压 | 5 V |
座面最大高度 | 3.96 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 10.92 mm |
Base Number Matches | 1 |
WF2M16-150DLC5 | WF2M16-120DAI5 | WF2M16-150DAI5 | WF2M16-120DLC5 | WF2M16-120DLI5 | WF2M16-150DLI5 | WF2M16-120DAM5 | WF2M16-150DAM5 | WF2M16-90DAI5 | WF2M16-90DAM5 | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Flash, 2MX16, 150ns, CDSO44, SOJ-44 | Flash Module, 2MX16, 120ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | Flash Module, 2MX16, 150ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | Flash, 2MX16, 120ns, CDSO44, SOJ-44 | Flash, 2MX16, 120ns, CDSO44, SOJ-44 | Flash, 2MX16, 150ns, CDSO44, SOJ-44 | Flash Module, 2MX16, 120ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | Flash Module, 2MX16, 150ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | Flash Module, 2MX16, 90ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | Flash Module, 2MX16, 90ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 |
包装说明 | SOJ, | 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | SOJ, | SOJ, | SOJ, | 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 | 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 |
Reach Compliance Code | compliant | unknown | unknown | compliant | compliant | compliant | unknown | unknown | unknown | unknow |
最长访问时间 | 150 ns | 120 ns | 150 ns | 120 ns | 120 ns | 150 ns | 120 ns | 150 ns | 90 ns | 90 ns |
备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 代码 | R-CDSO-J44 | R-CDSO-G56 | R-CDSO-G56 | R-CDSO-J44 | R-CDSO-J44 | R-CDSO-J44 | R-CDSO-G56 | R-CDSO-G56 | R-CDSO-G56 | R-CDSO-G56 |
内存密度 | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bi |
内存集成电路类型 | FLASH | FLASH MODULE | FLASH MODULE | FLASH | FLASH | FLASH | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 44 | 56 | 56 | 44 | 44 | 44 | 56 | 56 | 56 | 56 |
字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C | 125 °C |
最低工作温度 | - | -40 °C | -40 °C | - | -40 °C | -40 °C | -55 °C | -55 °C | -40 °C | -55 °C |
组织 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | SOJ | SSOP | SSOP | SOJ | SOJ | SOJ | SSOP | SSOP | SSOP | SSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | MILITARY |
端子形式 | J BEND | GULL WING | GULL WING | J BEND | J BEND | J BEND | GULL WING | GULL WING | GULL WING | GULL WING |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 10.92 mm | 12.96 mm | 12.96 mm | 10.92 mm | 10.92 mm | 10.92 mm | 12.96 mm | 12.96 mm | 12.96 mm | 12.96 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
ECCN代码 | - | 3A991.B.1.A | 3A991.B.1.A | - | - | - | 3A001.A.2.C | 3A001.A.2.C | 3A991.B.1.A | 3A001.A.2.C |
JESD-609代码 | - | e4 | e4 | - | - | - | e4 | e4 | e4 | e4 |
峰值回流温度(摄氏度) | - | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | - | Not Qualified | Not Qualified | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
端子面层 | - | GOLD | GOLD | - | - | - | GOLD | GOLD | GOLD | GOLD |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
类型 | - | NOR TYPE | NOR TYPE | - | - | - | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
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