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WF2M16-120DAI5

产品描述Flash Module, 2MX16, 120ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56
产品类别存储    存储   
文件大小737KB,共8页
制造商Mercury Systems Inc
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WF2M16-120DAI5概述

Flash Module, 2MX16, 120ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56

WF2M16-120DAI5规格参数

参数名称属性值
包装说明0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56
Reach Compliance Codeunknown
ECCN代码3A991.B.1.A
最长访问时间120 ns
备用内存宽度8
JESD-30 代码R-CDSO-G56
JESD-609代码e4
内存密度33554432 bit
内存集成电路类型FLASH MODULE
内存宽度16
功能数量1
端子数量56
字数2097152 words
字数代码2000000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织2MX16
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码SSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, SHRINK PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
编程电压5 V
认证状态Not Qualified
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层GOLD
端子形式GULL WING
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
类型NOR TYPE
宽度12.96 mm
Base Number Matches1

WF2M16-120DAI5相似产品对比

WF2M16-120DAI5 WF2M16-150DAI5 WF2M16-120DLC5 WF2M16-120DLI5 WF2M16-150DLC5 WF2M16-150DLI5 WF2M16-120DAM5 WF2M16-150DAM5 WF2M16-90DAI5 WF2M16-90DAM5
描述 Flash Module, 2MX16, 120ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 Flash Module, 2MX16, 150ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 Flash, 2MX16, 120ns, CDSO44, SOJ-44 Flash, 2MX16, 120ns, CDSO44, SOJ-44 Flash, 2MX16, 150ns, CDSO44, SOJ-44 Flash, 2MX16, 150ns, CDSO44, SOJ-44 Flash Module, 2MX16, 120ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 Flash Module, 2MX16, 150ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 Flash Module, 2MX16, 90ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 Flash Module, 2MX16, 90ns, CDSO56, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56
包装说明 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 SOJ, SOJ, SOJ, SOJ, 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56 0.520 INCH, HERMETIC SEALED, CERAMIC, SOP-56
Reach Compliance Code unknown unknown compliant compliant compliant compliant unknown unknown unknown unknow
最长访问时间 120 ns 150 ns 120 ns 120 ns 150 ns 150 ns 120 ns 150 ns 90 ns 90 ns
备用内存宽度 8 8 8 8 8 8 8 8 8 8
JESD-30 代码 R-CDSO-G56 R-CDSO-G56 R-CDSO-J44 R-CDSO-J44 R-CDSO-J44 R-CDSO-J44 R-CDSO-G56 R-CDSO-G56 R-CDSO-G56 R-CDSO-G56
内存密度 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bi
内存集成电路类型 FLASH MODULE FLASH MODULE FLASH FLASH FLASH FLASH FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE
内存宽度 16 16 16 16 16 16 16 16 16 16
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 56 56 44 44 44 44 56 56 56 56
字数 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
字数代码 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C 70 °C 85 °C 70 °C 85 °C 125 °C 125 °C 85 °C 125 °C
最低工作温度 -40 °C -40 °C - -40 °C - -40 °C -55 °C -55 °C -40 °C -55 °C
组织 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 SSOP SSOP SOJ SOJ SOJ SOJ SSOP SSOP SSOP SSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
编程电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL MILITARY MILITARY INDUSTRIAL MILITARY
端子形式 GULL WING GULL WING J BEND J BEND J BEND J BEND GULL WING GULL WING GULL WING GULL WING
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
宽度 12.96 mm 12.96 mm 10.92 mm 10.92 mm 10.92 mm 10.92 mm 12.96 mm 12.96 mm 12.96 mm 12.96 mm
ECCN代码 3A991.B.1.A 3A991.B.1.A - - - - 3A001.A.2.C 3A001.A.2.C 3A991.B.1.A 3A001.A.2.C
JESD-609代码 e4 e4 - - - - e4 e4 e4 e4
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED - - - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
认证状态 Not Qualified Not Qualified - - - - Not Qualified Not Qualified Not Qualified Not Qualified
端子面层 GOLD GOLD - - - - GOLD GOLD GOLD GOLD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED - - - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
类型 NOR TYPE NOR TYPE - - - - NOR TYPE NOR TYPE NOR TYPE NOR TYPE
Base Number Matches 1 1 1 1 1 1 1 - - -

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