RS1001FL~RS1008FL
SMALL SURFACE MOUNT FAST DIODES
VOLTAGE
FEATURES
• For surface mounted applications
• Low profile package
• Ideal for automated placement
• Glass Passivated Chip Junction
• High temperature soldering : 260
O
C / 10 seconds at terminals
•
Lead free in comply with EU RoHS 2002/95/EC directives.
• Green molding compound as per IEC61249 Std. . (Halogen Free)
0.075(1.90)
0.067(1.70)
0.115(2.90)
0.106(2.70)
100 to 800 Volts
CURRENT
1.0 Amperes
SOD-123FL
Unit
：
inch(mm)
MECHANICAL DATA
• Case : JEDEC SOD-123FL, Molded plastic over passivated junction
• Terminals : Solderable per MIL-STD-750, Method 2026
• Standard Packaging : 8mm tape (EIA-481)
• Apporx. Weight: 0.0006 ounces, 0.0173 grams
•
Polarity : Color band cathode
1
2
0.145(3.70)
0.137(3.50)
0.030(0.75)
0.017(0.45)
Cathode
Anode
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Rating
Marking Code
Maximum repetitve peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Derate above T
C
=110
O
C
Maximum instantaneous forward voltage
Peak Forward Surge Current : 8.3ms single half sine-wave
superimposed on rated load (JEDEC method)
Maximum DC reverse current at rated DC blocking voltage
Typical capacitance
T
J
=25
O
C
T
J
=125
O
C
4V,1MHz
I
F
=0.5A
I
R
=1A
I
rr
=0.25A
0.7A
1.0A
Test condition
Symbol
-
V
RRM
V
RMS
V
DC
I
F(AV)
V
F
I
FSM
I
R
C
J
t
rr
R
ϑJA
T
J
,T
STG
150
RS1001FL
RS1002FL
RS1004FL
RS1006FL
RS1008FL
0.008(0.20)
0.004(0.10)
0.044(1.10)
0.031(0.80)
0.043(1.08)
0.038(0.98)
Units
-
V
V
V
A
V
A
R1B
100
70
100
R1D
200
140
200
R1G
400
280
400
1.0
1.15
1.3
30
1.0
50
9
R1J
600
420
600
R1K
800
560
800
μA
pF
Reverse recovery time
Thermal resistance junction to ambient air
250
500
nS
180
-55 to +150
O
C/W
C
Operating junction and storage temperature range
O
August 02,2011-REV.02
PAGE . 1
RS1001FL~RS1008FL
10
15
C
J
,Junction
Capacitance
(pF)
1
13
10
8
5
3
0
0.1
1
10
100
I
F
[A]
0.1
0.01
Typical@25 C
O
0.001
0
0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80
V
F
[V]
V
R
,
Reverse Bias Voltage (V)
Fig.1-TYPICAL FORWARD CHARACTERISTICS
Fig.2-TYPICAL JUNCTION CAPACITANCE
FORWARD SURGE CURRENT, AMPERES pk
(HALF-SING WAVE)
1.5
I
F
, Forward Current [A]
35
30
25
20
15
10
5
1.25
1
0.75
0.5
0.25
0
0
25
50
75
100
125
150
Mounted on 5cm x 1.5cm PCB
Board
1
2
4
6
8 10
20
40 60 80 100
T
C
, Case Temperature [
O
C]
NUMBER OF CYCLES AT 60Hz
Fig.3-FORWARD CURRENT DERATING CURVE
Fig.4-MAXIMUM NON-REPEITIVE SURGE CURRENT
August 02,2011-REV.02
PAGE . 2
RS1001FL~RS1008FL
MOUNTING PAD LAYOUT
SOD-123FL
Unit
：
inch(mm)
0.167
(4.25)
0.106
(2.70)
0.031
(0.78)
ORDER INFORMATION
• Packing information
T/R - 10K per 13" plastic Reel
T/R - 3K per 7” plastic Reel
LEGAL STATEMENT
Copyright PanJit International, Inc 2012
The information presented in this document is believed to be accurate and reliable. The specifications and information herein are
subject to change without notice. Pan Jit makes no warranty, representation or guarantee regarding the suitability of its produ cts for
any particular purpose. Pan Jit products are not authorized for use in life support devices or systems. Pan Jit does not convey any
license under its patent rights or rights of others.
August 02,2011-REV.02
0.048
(1.22)
PAGE . 3
TI技术论坛
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
