Two-wire serial interface 32k EEPROM (4-kword 】 8-bit)/64k EEPROM (8-kword 】 8-bit)
HN58X2464SI | HN58X2432SI_05 | HN58X2432SFPIE | HN58X2464SFPIE | HN58X2464STIE | HN58X2432STIE | |
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描述 | Two-wire serial interface 32k EEPROM (4-kword 】 8-bit)/64k EEPROM (8-kword 】 8-bit) | Two-wire serial interface 32k EEPROM (4-kword 】 8-bit)/64k EEPROM (8-kword 】 8-bit) | Two-wire serial interface 32k EEPROM (4-kword 】 8-bit)/64k EEPROM (8-kword 】 8-bit) | Two-wire serial interface 32k EEPROM (4-kword 】 8-bit)/64k EEPROM (8-kword 】 8-bit) | Two-wire serial interface 32k EEPROM (4-kword 】 8-bit)/64k EEPROM (8-kword 】 8-bit) | Two-wire serial interface 32k EEPROM (4-kword 】 8-bit)/64k EEPROM (8-kword 】 8-bit) |
是否Rohs认证 | - | - | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | - | - | SOIC | SOIC | SOIC | SOIC |
包装说明 | - | - | SOP, SOP8,.25 | SOP, SOP8,.25 | LEAD FREE, PLASTIC, TSSOP-8 | LEAD FREE, PLASTIC, TSSOP-8 |
针数 | - | - | 8 | 8 | 8 | 8 |
Reach Compliance Code | - | - | compli | compliant | compliant | compli |
ECCN代码 | - | - | EAR99 | EAR99 | EAR99 | EAR99 |
最大时钟频率 (fCLK) | - | - | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
数据保留时间-最小值 | - | - | 10 | 10 | 10 | 10 |
耐久性 | - | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
I2C控制字节 | - | - | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR |
JESD-30 代码 | - | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
长度 | - | - | 4.89 mm | 4.89 mm | 4.4 mm | 4.4 mm |
内存密度 | - | - | 32768 bi | 65536 bit | 65536 bit | 32768 bi |
内存集成电路类型 | - | - | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | - | - | 8 | 8 | 8 | 8 |
功能数量 | - | - | 1 | 1 | 1 | 1 |
端子数量 | - | - | 8 | 8 | 8 | 8 |
字数 | - | - | 4096 words | 8192 words | 8192 words | 4096 words |
字数代码 | - | - | 4000 | 8000 | 8000 | 4000 |
工作模式 | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | - | - | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | - | - | 4KX8 | 8KX8 | 8KX8 | 4KX8 |
封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | - | SOP | SOP | TSSOP | TSSOP |
封装等效代码 | - | - | SOP8,.25 | SOP8,.25 | TSSOP8,.25 | TSSOP8,.25 |
封装形状 | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | - | - | SERIAL | SERIAL | SERIAL | SERIAL |
电源 | - | - | 2/5 V | 2/5 V | 2/5 V | 2/5 V |
认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | - | 1.73 mm | 1.73 mm | 1.1 mm | 1.1 mm |
串行总线类型 | - | - | I2C | I2C | I2C | I2C |
最大待机电流 | - | - | 0.000003 A | 0.000003 A | 0.000003 A | 0.000003 A |
最大压摆率 | - | - | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
最大供电电压 (Vsup) | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | - | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
标称供电电压 (Vsup) | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | - | - | YES | YES | YES | YES |
技术 | - | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | - | - | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | - | - | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm |
端子位置 | - | - | DUAL | DUAL | DUAL | DUAL |
宽度 | - | - | 3.9 mm | 3.9 mm | 3 mm | 3 mm |
最长写入周期时间 (tWC) | - | - | 15 ms | 15 ms | 15 ms | 15 ms |
写保护 | - | - | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
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