LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Features
* Low power consumption.
* High efficiency.
* Versatile mounting on p.c. board or panel.
* I.C. compatible/low current requirement.
* 3.1 mm diameter package.
Package Dimensions
Part No.
LTL1CHTGK
Lens
Water Clear
Source Color
InGaN Green
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm(.010") unless otherwise noted.
3. Protruded resin under flange is 1.0mm(.04") max.
4. Lead spacing is measured where the leads emerge from the package.
5. Specifications are subject to change without notice.
Part No. : LTL1CHTGK
BNS-OD-C131/A4
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Absolute Maximum Ratings at T
A
=25℃
Parameter
Power Dissipation
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
DC Forward Current
Reverse Voltage
Operating Temperature Range
Storage Temperature Range
Lead Soldering Temperature
[1.6mm(.063") From Body]
Maximum Rating
120
100
30
5
-25°C to + 80°C
-30°C to + 100°C
260°C for 5 Seconds
Unit
mW
mA
mA
V
Part No. : LTL1CHTGK
BNS-OD-C131/A4
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Electrical / Optical Characteristics at T
A
=25℃
Parameter
Luminous Intensity
Viewing Angle
Dominant Wavelength
Spectral Line Half-Width
Forward Voltage
Reverse Current
Symbol
I
V
2θ
1/2
λ
d
∆λ
V
F
I
R
Min.
800
Typ.
1900
30
525
35
3.5
4.0
100
Max.
Unit
mcd
deg
nm
nm
V
µA
I
F
= 20mA
V
R
= 5V
Test Condition
I
F
= 20mA
Note 1,5
Note 2 (Fig.6)
Note 3
NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
eye-response curve.
2.
θ
1/2
is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength,
λd
is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device.
4. Iv classification code is marked on each packing bag.
5. The Iv guarantee should be added ±15
﹪
tolerance.
6. Precautions in handling:
•
When soldering, leave 2mm of minimum clearance from the resin to the soldering point.
•
Dipping the resin to solder must be avoided.
•
Correcting the soldered position after soldering must be avoided.
•
In soldering, do not apply any stress to the lead frame particularly when heated.
•
When forming a lead, make sure not to apply any stress inside the resin.
•
Lead forming must be done before soldering.
•
It is necessary to cut the lead frame at normal temperature.
7. Caution in ESD:
Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic
glove when handling the LED. All devices, equipment and machinery must be properly grounded.
Part No. : LTL1CHTGK
BNS-OD-C131/A4
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Typical Electrical / Optical Characteristics Curves
(25
℃
Ambient Temperature Unless Otherwise Noted)
Part No. : LTL1CHTGK
BNS-OD-C131/A4
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Packing Spec
1000, 500 or 250 pcs per packing bag
10 packing bags per inner carton
total 10000 pcs per inner carton
8 Inner cartons per outer carton
total 80000 pcs per outer carton
In every shipping lot, only the last pack will be non-full packing
Part No. : LTL1CHTGK
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