RISC Microprocessor, 32-Bit, 25MHz, CMOS, PQFP208, CAVITY DOWN, MQUAD-208
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP |
| 包装说明 | CAVITY DOWN, MQUAD-208 |
| 针数 | 208 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.3 |
| Is Samacsys | N |
| 地址总线宽度 | 26 |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 50 MHz |
| 外部数据总线宽度 | 32 |
| 格式 | FIXED POINT |
| 集成缓存 | NO |
| JESD-30 代码 | S-PQFP-G208 |
| JESD-609代码 | e0 |
| 长度 | 28 mm |
| 低功率模式 | NO |
| DMA 通道数量 | 4 |
| 外部中断装置数量 | 5 |
| 串行 I/O 数 | 2 |
| 端子数量 | 208 |
| 片上数据RAM宽度 | |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FQFP |
| 封装等效代码 | QFP208,1.2SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, FINE PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 0 |
| 座面最大高度 | 4.07 mm |
| 速度 | 25 MHz |
| 最大压摆率 | 500 mA |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 28 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
| Base Number Matches | 1 |
| IDT79R3610025PF | IDT79R36100-20PF | IDT79RV3610025MS | IDT79RV36100-20MS | IDT79RV36100-20PF | IDT79RV36100-33MS | IDT79RV3610025PF | |
|---|---|---|---|---|---|---|---|
| 描述 | RISC Microprocessor, 32-Bit, 25MHz, CMOS, PQFP208, CAVITY DOWN, MQUAD-208 | RISC Microprocessor, 32-Bit, 20MHz, CMOS, PQFP208, CAVITY DOWN, MQUAD-208 | RISC Microprocessor, 32-Bit, 25MHz, CMOS, PQFP208, PLASTIC, QFP-208 | RISC Microprocessor, 32-Bit, 20MHz, CMOS, PQFP208, PLASTIC, QFP-208 | RISC Microprocessor, 32-Bit, 20MHz, CMOS, PQFP208, CAVITY DOWN, MQUAD-208 | RISC Microprocessor, 32-Bit, 33MHz, CMOS, PQFP208, CAVITY DOWN, MQUAD-208 | RISC Microprocessor, 32-Bit, 25MHz, CMOS, PQFP208, CAVITY DOWN, MQUAD-208 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | CAVITY DOWN, MQUAD-208 | CAVITY DOWN, MQUAD-208 | PLASTIC, QFP-208 | FQFP, | FQFP, | FQFP, | FQFP, |
| 针数 | 208 | 208 | 208 | 208 | 208 | 208 | 208 |
| Reach Compliance Code | not_compliant | not_compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A001.A.3 | 3A991.A.2 | 3A001.A.3 | 3A991.A.2 | 3A991.A.2 | 3A001.A.3 | 3A001.A.3 |
| 地址总线宽度 | 26 | 26 | 26 | 26 | 26 | 26 | 26 |
| 位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 边界扫描 | YES | YES | YES | YES | YES | YES | YES |
| 最大时钟频率 | 50 MHz | 40 MHz | 50 MHz | 40 MHz | 40 MHz | 66.67 MHz | 50 MHz |
| 外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 集成缓存 | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 28 mm | 28 mm | 27.69 mm | 27.69 mm | 28 mm | 27.69 mm | 28 mm |
| 低功率模式 | NO | NO | NO | NO | NO | NO | NO |
| DMA 通道数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 外部中断装置数量 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| 串行 I/O 数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 208 | 208 | 208 | 208 | 208 | 208 | 208 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FQFP | FQFP | FQFP | FQFP | FQFP | FQFP | FQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | 225 | 225 | 225 | 225 | 225 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.07 mm | 4.07 mm | 3.86 mm | 3.86 mm | 4.07 mm | 3.86 mm | 4.07 mm |
| 速度 | 25 MHz | 20 MHz | 25 MHz | 20 MHz | 20 MHz | 33 MHz | 25 MHz |
| 最大压摆率 | 500 mA | 400 mA | 270 mA | 210 mA | 210 mA | 360 mA | 270 mA |
| 最大供电电压 | 5.25 V | 5.25 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 | 4.75 V | 4.75 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 | 5 V | 5 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 28 mm | 28 mm | 27.69 mm | 27.69 mm | 28 mm | 27.69 mm | 28 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
FPGA/CPLD
微控制器 MCU
微控制器 MCU
模拟电子
TI技术论坛
传感器
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
