CRJF190N65GC
华润微电子(重庆)有限公司
Features
• CRM(CQ) Super_Junction technology
• Much lower Ron*A performance for On-state efficiency
• Much lower FOM for fast switching efficiency
VDS
R
DS(on)_typ
I
D
Applications
• LED/LCD/PDP TV and monitor Lighting
• Solar/Renewable/UPS-Micro Inverter System
• Charger
• Power Supply
650V
0.16Ω
20A
SJMOS N-MOSFET 650V, 0.16Ω, 20A
Product Summary
100% Avalanche Tested
Top view
Bottom view
Package Marking and Ordering Information
Part #
CRJF190N65GC
Marking
Package
TO220F
Packing
Tube
Reel Size
N/A
Tape Width
N/A
Qty
50pcs
-
Absolute Maximum Ratings
Parameter
Drain-source voltage
Continuous drain current
T
C
= 25°C
T
C
= 100°C
Pulsed drain current (T
C
= 25°C, t
p
limited by T
jmax
)
Avalanche energy, single pulse (L=60mH, Rg=30Ω)
Gate-Source voltage
Power dissipation (T
C
= 25°C)
Operating junction and storage temperature
I
D pulse
E
AS
V
GS
P
tot
T
j
,
T
stg
I
D
20
14.0
80
320
±30
43
-55...+150
A
mJ
V
W
°C
A
Symbol
V
DS
Value
650
Unit
V
©China Resources Microelectronics (Chongqing) Limited
Page 1
CRJF190N65GC
华润微电子(重庆)有限公司
Thermal Resistance
Parameter
Thermal resistance, junction – case. Max
Thermal resistance, junction – ambient. Max
Symbol
R
thJC
R
thJA
Value
2.93
89
Unit
°C/W
SJMOS N-MOSFET 650V, 0.16Ω, 20A
Electrical Characteristic
(at Tj = 25 °C, unless otherwise specified)
Parameter
Symbol
Value
min.
typ.
max.
Unit
Test Condition
Static Characteristic
Drain-source breakdown
voltage
Gate threshold voltage
Zero gate voltage drain
current
BV
DSS
V
GS(th )
650
3.2
-
3.7
-
4.2
V
V
V
GS
=0V, I
D
=250uA
V
DS
=V
GS
,I
D
=250uA
V
DS
=650V,V
GS
=0V
I
DSS
-
-
Gate-source leakage current
I
GSS
-
-
20
0.3
1
-
80
nA
µA
T
C
=25°C
T
C
=150°C
V
GS
=±30V,V
DS
=0V
V
GS
=10V, I
D
=10A,
Drain-source on-state
resistance
Transconductance
R
DS(on)
-
-
g
fs
-
0.16
0.43
24
0.19
-
-
S
Ω
T
C
=25°C
T
C
=150°C
V
DS
=20V,I
D
=10A
Dynamic Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Total Charge
Gate-Source charge
Gate-Drain charge
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Gate resistance
C
iss
C
oss
C
rss
Q
G
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
R
G
-
-
-
-
-
-
-
-
-
-
-
1750
71
35
49
11.5
20
39
26
156
48
0.9
-
-
-
-
-
-
-
-
-
-
-
Ω
V
GS
=0V, V
DS
=0V,
f=1MHz
ns
T
j
=25°C, V
GS
=10V,
I
D
=10A, V
DS
=400V,
R
g
=25Ω
nC
V
GS
=10V, V
DS
=480V,
I
D
=10A, f=1MHz
pF
V
GS
=0V, V
DS
=100V,
f=1MHz
©China Resources Microelectronics (Chongqing) Limited
Page 2
CRJF190N65GC
华润微电子(重庆)有限公司
Body Diode Characteristic
Parameter
Body Diode Forward Voltage
Body Diode Reverse Recovery
Time
Body Diode Reverse Recovery
Charge
Symbol
SJMOS N-MOSFET 650V, 0.16Ω, 20A
Value
min.
0.5
-
-
typ.
0.84
306
4.63
max.
1
-
-
Unit
V
ns
uC
Test Condition
V
GS
=0V,I
SD
=10A
Isd=10A
dI/dt=100A/us,Vds=5
0V
V
SD
t
rr
Q
rr
©China Resources Microelectronics (Chongqing) Limited
Page 3
CRJF190N65GC
华润微电子(重庆)有限公司
Typical Performance Characteristics
Fig 1. Output Characteristics (Tj=25℃)
℃
50
45
40
35
30
I
D
(A)
20
15
10
5
0
-5 0
5
10
V
DS
(V)
15
I
D
(A)
25
15
10
5
Fig 2. Output Characteristics (Tj=150℃)
℃
30
SJMOS N-MOSFET 650V, 0.16Ω, 20A
10V, 9V, 8V, 7V
25
20
10V, 9V, 8V, 7V,6V
5.5V
6.0V
5.0V
4.5V
V
GS
=4.0V
20
5.5V
5.0V
V
GS
=4V 4.5V
20
0
25
-5
V
DS
(V)
0
5
10
15
25
Fig 3: Transfer Characteristics
45
40
35
30
Fig 4: V
TH
Vs Tj Temperature
Characteristics
5
25°C
4
3
2
1
0
ID=250uA
I
D
(A)
20
15
10
5
0
-5
0
1
2
3
4
5
6
7
150°C
8
9
10
V
TH
(V)
25
0
25
50
75
100
125
150
V
GS
(V)
Fig 5: Rdson Vs Ids Characteristics(Tc=25℃)
℃
300
280
240
220
200
180
160
140
120
100
0
5
10
15
20
25
30
35
0.5
0
25
Temperature（
℃）
（
Fig 6: Rds(on) vs. Temperature
3.0
2.5
2.0
1.5
1.0
V
GS
=10V
V
GS
=20V
R
DS(on)
_Normalized
260
V
GS
=10V
I
D
=10A
R
DS(on)
(m )
50
75
100
125
150
175
I
D
(A)
Tj - Junction Temperature (°C)
©China Resources Microelectronics (Chongqing) Limited
Page 4
CRJF190N65GC
华润微电子(重庆)有限公司
SJMOS N-MOSFET 650V, 0.16Ω, 20A
Fig 7: BVDSS vs. Temperature
1.10
Fig 8: Rds(on) vs Gate Voltage
1100
1.08
900
I
D
=10A
BVdss (Nomalized)
1.06
1.04
1.02
1.00
0.98
0
25
50
75
100
125
150
175
R
DS(on)
(m )
700
500
300
150°C
25°C
100
4
5
6
7
8
9
10
Tj - Junction Temperature (°C)
V
GS
(V)
Fig 9: Body-diode Forward Characteristics
1000
Fig 10: Gate Charge Characteristics
12
10
I
S
- Diode Current(A)
V
DS
=480V
I
D
=10A
100
V
GS
(V)
10
1
8
6
4
2
150˚C
25˚C
0.1
0
0.3
0.6
0.9
1.2
1.5
1.8
0
0 2 4 6 810 14 18 22 26 30 34 38 42 46 50
12 16 20 24 28 32 36 40 44 48 52
V
SD
- Diode Forward Voltage(V)
Qg (nC)
Fig 12: Safe Operating Area
Fig 11: Capacitance Characteristics
100000
10000
1000
100
10
100
V
GS
=0V
f=1MHz
C - Capacitance (PF)
Ciss
I
D
(A)
10
Limited by
Rds(on)
1ms
10ms
Coss
Crss
1
0.1
1
0
0
100
200
300
400
500
600
0.01
Single pulse
Tc=25˚C
1
10
100
DC
V
DS
(V)
1000
V
DS
(V)
©China Resources Microelectronics (Chongqing) Limited
Page 5
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