CRTT029N06N
华润微电子(重庆)有限公司
Features
• Uses CRM(CQ) advanced Trench technology
• Extremely low on-resistance R
DS(on)
• Excellent Q
g
xR
DS(on)
product(FOM)
• Qualified according to JEDEC criteria
Applications
• Motor control and drive
• Battery management
• UPS (Uninterrupible Power Supplies)
Trench N-MOSFET 60V, 2.3mΩ, 160A
Product Summary
V
DS
R
DS(on) typ.
I
D
60V
2.3mΩ
160A
100% DVDS Tested
100% Avalanche Tested
Package Marking and Ordering Information
Part #
CRTT029N06N
Marking
CRTT029N06N
Package
TO-220
Packing
Tube
Reel Size
N/A
Tape Width
N/A
Qty
50pcs
Absolute Maximum Ratings
Parameter
Drain-source voltage
Continuous drain current
T
C
= 25°C (Silicon limit)
T
C
= 25°C (Package limit)
T
C
= 100°C (Silicon limit)
Pulsed drain current (T
C
= 25°C, t
p
limited by T
jmax
)
Avalanche energy, single pulse (L=0.5mH, Rg=25Ω)
Gate-Source voltage
Power dissipation (T
C
= 25°C)
Operating junction and storage temperature
Soldering temperature, wave soldering only allowed at leads
(1.6mm from case for 10s)
I
D pulse
E
AS
V
GS
P
tot
T
j
,
T
stg
T
sold
I
D
220
160
139
640
625
±25
254
-55...+150
260
A
mJ
V
W
°C
°C
A
Symbol
V
DS
Value
60
Unit
V
©China Resources Microelectronics (Chongqing) Limited
Page 1
CRTT029N06N
华润微电子(重庆)有限公司
Thermal Resistance
Parameter
Thermal resistance, junction – case.
Thermal resistance, junction – ambient(min. footprint)
Symbol
R
thJC
R
thJA
*
Max
0.49
84
Unit
°C/W
Trench N-MOSFET 60V, 2.3mΩ, 160A
Electrical Characteristic
(at Tj = 25 °C, unless otherwise specified)
Parameter
Symbol
Value
min.
typ.
max.
Unit
Test Condition
Static Characteristic
Drain-source breakdown
voltage
Gate threshold voltage
BV
DSS
V
GS(th )
60
2.4
-
3
-
3.6
V
V
V
GS
=0V, I
D
=250uA
V
DS
=V
GS
,I
D
=250uA
V
DS
=60V,V
GS
=0V
Zero gate voltage drain
current
Gate-source leakage
current
Drain-source on-state
resistance
Transconductance
I
DSS
-
-
I
GSS
-
0.1
-
±10
1
200
±100
nA
µA
T
j
=25°C
T
j
=150°C
V
GS
=±25V,V
DS
=0V
V
GS
=10V, I
D
=80A,
R
DS(on)
-
-
g
fs
-
2.3
3.9
211
2.9
5
-
S
mΩ
T
j
=25°C
T
j
=150°C
V
DS
=5V,I
D
=80A
Dynamic Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Gate Total Charge
Gate-Source charge
Gate-Drain charge
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Gate resistance
C
iss
C
oss
C
rss
Q
G
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
R
G
-
-
-
-
-
-
-
-
-
-
-
7830
1208
577
183
45
75
31
118
71
149
1.3
-
-
-
-
-
-
-
-
-
-
-
Ω
V
GS
=0V, V
DS
=0V,
f=1MHz
ns
V
GS
=10V, V
DD
=30V,
R
G_ext
=3Ω,I
D
=80A
nC
V
GS
=10V, V
DS
=30V,
I
D
=80A, f=1MHz
pF
V
GS
=0V, V
DS
=30V,
f=1MHz
©China Resources Microelectronics (Chongqing) Limited
Page 2
CRTT029N06N
华润微电子(重庆)有限公司
Body Diode Characteristic
Parameter
Body Diode Forward
Voltage
Body Diode Continuous
Forward Current
Body Diode Reverse
Recovery Time
Body Diode Reverse
Recovery Charge
Symbol
Trench N-MOSFET 60V, 2.3mΩ, 160A
Value
min.
-
typ.
0.9
max.
1.3
160
-
-
56
116
-
-
Unit
V
A
ns
nC
Test Condition
V
GS
=0V,I
SD
=80A
T
C
= 25°C
V
SD
I
S
t
rr
Q
rr
I
F
=80A, dI/dt=100A/µ
s
*The value of R
thJA
is measured by placing the device in a still air box which is one cubic foot.
©China Resources Microelectronics (Chongqing) Limited
Page 3
CRTT029N06N
华润微电子(重庆)有限公司
Trench N-MOSFET 60V, 2.3mΩ, 160A
Typical Performance Characteristics
Fig 1: Output Characteristics
400
500
Fig 2: Transfer Characteristics
T
j
=25°C
V
DS
=5V
400
10V
300
7.0V
6.0V
I
D
(A)
200
I
D
(A)
300
5.5V
100
200
150°C
100
V
GS
=5.0V
0
0
1
2
3
4
5
0
2
3
4
5
25°C
6
7
V
DS
(V)
V
GS
(V)
Fig 3: Rds(on) vs Drain Current and
Gate Voltage
5
Fig 4: Rds(on) vs Gate Voltage
12
T
j
=25°C
4
10
I
D
=80A
R
DS(on)
(mΩ)
R
DS(on)
(mΩ)
8
3
V
GS
=7V
V
GS
=10V
6
150°C
4
2
1
2
25°C
0
0
90
180
270
360
450
0
4
5
6
7
8
9
10
I
D
(A)
V
GS
(V)
Fig 5: Rds(on) vs. Temperature
2.0
1.8
Fig 6: Capacitance Characteristics
100000
R
DS(on)
_Normalized
1.6
1.4
1.2
1.0
0.8
0.6
0.4
-50
-25
0
25
50
75
100
125
150
C - Capacitance (PF)
V
GS
=10V
I
D
=80A
10000
Ciss
1000
Coss
V
GS
=0V
f=1MHz
Crss
100
0
10
20
30
40
50
60
Tj - Junction Temperature (°C)
V
DS
(V)
©China Resources Microelectronics (Chongqing) Limited
Page 4
CRTT029N06N
华润微电子(重庆)有限公司
Trench N-MOSFET 60V, 2.3mΩ, 160A
Fig 8: Body-diode Forward
Characteristics
Fig 7: Gate Charge Characteristics
10
1000
8
V
GS
(V)
V
DS
=30V
I
D
=80A
6
I
S
- Diode Current(A)
100
150˚C
25˚C
4
10
2
0
0
20
40
60
80
100
120
140
160
180
200
1
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
Qg (nC)
V
SD
- Diode Forward Voltage(V)
Fig 9: Power Dissipation
300
Fig 10: Drain Current Derating
180
160
250
140
200
120
P
tot
(W)
I
D
(A)
100
80
150
100
60
40
V
GS
≥10V
50
20
0
0
25
50
75
100
125
150
0
0
25
50
75
100
125
150
175
Tc - Case Temperature (°C)
Tc - Case Temperature (°C)
Fig 11: Safe Operating Area
1000
1us
10us
100
Limited by
Rds(on)
100us
I
D
(A)
10
1ms
10ms
DC
1
Single pulse
Tc=25˚C
0.1
0.1
1
10
100
V
DS
(V)
©China Resources Microelectronics (Chongqing) Limited
Page 5
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