CRST033N08N,CRSS031N08N
华润微电子(重庆)有限公司
Features
• Uses CRM(CQ) advanced SkyMOS1 technology
• Extremely low on-resistance R
DS(on)
• Excellent Q
g
xR
DS(on)
product(FOM)
• Qualified according to JEDEC criteria
Applications
• Synchronous Rectification for AC/DC Quick Charger
• Battery management
• UPS (Uninterrupible Power Supplies)
SkyMOS1 N-MOSFET 85V, 2.5mΩ, 160A
Product Summary
V
DS
R
DS(on)
I
D
85V
2.5mΩ
160A
100% Avalanche Tested
CRST033N08N
CRSS031N08N
Package Marking and Ordering Information
Part #
CRST033N08N
CRSS031N08N
Marking
Package
TO-220
TO-263
Packing
Tube
Tube
Reel Size
N/A
N/A
Tape Width
N/A
N/A
Qty
50pcs
50pcs
-
-
Absolute Maximum Ratings
Parameter
Drain-source voltage
Continuous drain current
T
C
= 25°C (Silicon limit)
T
C
= 25°C (Package limit)
T
C
= 100°C (Silicon limit)
Pulsed drain current (T
C
= 25°C, t
p
limited by T
jmax
)
Avalanche energy, single pulse (L=0.5mH, Rg=25Ω)
[1]
Gate-Source voltage
Power dissipation (T
C
= 25°C)
Operating junction and storage temperature
Notes:1.EAS was tested at Tj = 25℃, ID = 40A.
I
D pulse
E
AS
V
GS
P
tot
T
j
,
T
stg
I
D
208
160
131
640
400
±20
227
-55...+150
A
mJ
V
W
°C
A
Symbol
V
DS
Value
85
Unit
V
©China Resources Microelectronics (Chongqing) Limited
Page 1
CRST033N08N,CRSS031N08N
华润微电子(重庆)有限公司
Thermal Resistance
Parameter
Thermal resistance, junction – case.
Thermal resistance, junction – ambient(min. footprint)
Symbol
R
thJC
R
thJA
Max
0.55
62
Unit
°C/W
SkyMOS1 N-MOSFET 85V, 2.5mΩ, 160A
Electrical Characteristic
(at Tj = 25 °C, unless otherwise specified)
Parameter
Symbol
Value
min.
typ.
max.
Unit
Test Condition
Static Characteristic
Drain-source breakdown
voltage
Gate threshold voltage
BV
DSS
V
GS(th )
85
2.2
-
3
-
3.8
V
V
V
GS
=0V, I
D
=250uA
V
DS
=V
GS
,I
D
=250uA
V
DS
=80V,V
GS
=0V
Zero gate voltage drain
current
Gate-source leakage
current
Drain-source on-state
resistance
Transconductance
I
DSS
-
-
I
GSS
-
0.05
-
±10
1
10
±100
nA
µA
T
j
=25°C
T
j
=125°C
V
GS
=±20V,V
DS
=0V
V
GS
=10V, I
D
=80A
R
DS(on)
-
-
g
fs
-
2.5
2.3
144
3.0
2.8
-
mΩ
S
TO-220
TO-263
V
DS
=5V,I
D
=80A
Dynamic Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Gate Total Charge
Gate-Source charge
Gate-Drain charge
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Gate resistance
C
iss
C
oss
C
rss
Q
G
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
R
G
-
-
-
-
-
-
-
-
-
-
-
8930
1746
81
130
44
30
30
108
85
120
2.1
-
-
-
-
-
-
-
-
-
-
-
Ω
V
GS
=0V, V
DS
=0V,
f=1MHz
ns
V
GS
=10V, V
DD
=40V,
R
G_ext
=3.0Ω
nC
V
GS
=10V, V
DS
=40V,
I
D
=80A, f=1MHz
pF
V
GS
=0V, V
DS
=40V,
f=1MHz
©China Resources Microelectronics (Chongqing) Limited
Page 2
CRST033N08N,CRSS031N08N
华润微电子(重庆)有限公司
SkyMOS1 N-MOSFET 85V, 2.5mΩ, 160A
Body Diode Characteristic
Parameter
Body Diode Forward
Voltage
Body Diode Reverse
Recovery Time
Body Diode Reverse
Recovery Charge
Symbol
Value
min.
-
-
-
typ.
0.93
84
226
max.
1.4
-
-
Unit
V
ns
nC
Test Condition
V
GS
=0V,I
SD
=80A
I
F
=80A,
dI/dt=100A/µs
V
SD
t
rr
Q
rr
©China Resources Microelectronics (Chongqing) Limited
Page 3
CRST033N08N,CRSS031N08N
华润微电子(重庆)有限公司
SkyMOS1 N-MOSFET 85V, 2.5mΩ, 160A
Typical Performance Characteristics
Fig 1: Output Characteristics
400
360
320
280
350
Fig 2: Transfer Characteristics
V
DS
=5V
10V
8V
7V
300
6.5V
250
I
D
(A)
I
D
(A)
240
200
160
120
80
40
0
0
1
2
200
150
100
50
0
5.5V
125°C
25°C
4.5V
3.5V
3
4
5
0
1
2
V
DS
(V)
3
4
V
GS
(V)
5
6
7
Fig 3: Rds(on) vs Drain Current and
Gate Voltage
4.0
3.5
3.0
Fig 4: Rds(on) vs Gate Voltage
12
10
I
D
=80A
V
GS
=10V
R
DS(on)
(m )
8
R
DS(on)
(m )
2.5
2.0
1.5
1.0
6
125°C
4
2
0.5
0.0
0
20
40
60
80
100
120
140
160
0
3
4
5
6
7
8
25°C
9
10
I
D
(A)
V
GS
(V)
Fig 5: Rds(on) vs. Temperature
2.4
2.2
Fig 6: Capacitance Characteristics
10000
I
D
=80A
C - Capacitance (PF)
1000
Ciss
R
DS(on)
_Normalized
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0
25
50
75
100
125
150
175
V
GS
=10V
Coss
100
V
GS
=0V
f=1MHz
10
0
10
20
30
Crss
40
50
60
70
80
Tj - Junction Temperature (°C)
V
DS
(V)
©China Resources Microelectronics (Chongqing) Limited
Page 4
CRST033N08N,CRSS031N08N
华润微电子(重庆)有限公司
SkyMOS1 N-MOSFET 85V, 2.5mΩ, 160A
Fig 8: Body-diode Forward
Characteristics
100
Fig 7: Gate Charge Characteristics
10
8
I
S
- Diode Current(A)
V
DS
=40V
I
D
=80A
V
GS
(V)
10
6
1
125˚C
25˚C
4
0.1
2
0
0
30
60
90
120
150
0.01
0
0.2
0.4
0.6
0.8
1
1.2
Qg (nC)
V
SD
- Diode Forward Voltage(V)
Fig 9: Power Dissipation
250
Fig 10: Drain Current Derating
180
160
200
140
120
P
tot
(W)
150
I
D
(A)
100
80
60
100
50
40
20
V
GS
≥10V
0
0
25
50
75
100
125
150
0
0
25
50
75
100
125
150
175
Tc - Case Temperature (°C)
Tc - Case Temperature (°C)
Fig 11: Safe Operating Area
1000
1us
100
Limited by
Rds(on)
10us
100us
1ms
I
D
(A)
10
10ms
DC
1
Single pulse
Tc=25˚C
0.1
0.1
1
10
100
V
DS
(V)
©China Resources Microelectronics (Chongqing) Limited
Page 5
NXP MCU
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