CR8205A
华润微电子(重庆)有限公司
Features
• Uses CRM(CQ) advanced Trench MOS technology
• Extremely low on-resistance R
DS(on)
• Excellent Q
g
xR
DS(on)
product(FOM)
• Qualified according to JEDEC criteria
Applications
• Motor control and drive
• Battery management
• UPS (Uninterrupible Power Supplies)
Trench N-MOSFET 20V, 18mΩ, 10A
Product Summary
V
DS
R
DS(on) typ.
I
D
20V
18mΩ
10A
100% Avalanche Tested
Package Marking and Ordering Information
Part #
CR8205A
Marking
8205A
Package
TSSOP8
Packing
Reel
Reel Size
N/A
Tape Width
N/A
Qty
5000pcs
Absolute Maximum Ratings
Parameter
Drain-source voltage
Continuous drain current
T
C
= 25°C (Silicon limit)
T
C
= 25°C (Package limit)
T
C
= 100°C (Silicon limit)
Pulsed drain current (T
C
= 25°C, t
p
limited by T
jmax
)
Avalanche energy, single pulse (L=0.1mH, Rg=25Ω)
Gate-Source voltage
Power dissipation (T
C
= 25°C)
Operating junction and storage temperature
Soldering temperature, wave soldering only allowed at leads
(1.6mm from case for 10s)
I
D pulse
E
AS
V
GS
P
tot
T
j
,
T
stg
T
sold
I
D
10
10
6
40
4
±10
4
-55...+150
260
A
mJ
V
W
°C
°C
A
Symbol
V
DS
Value
20
Unit
V
©China Resources Microelectronics (Chongqing) Limited
Page 1
CR8205A
华润微电子(重庆)有限公司
Thermal Resistance
Parameter
Thermal resistance, junction – lead.
Thermal resistance, junction – ambient(min. footprint)
Symbol
R
thJL
R
thJA
*
Max
35.4
115
Unit
°C/W
Trench N-MOSFET 20V, 18mΩ, 10A
Electrical Characteristic
(at Tj = 25 °C, unless otherwise specified)
Parameter
Symbol
Value
min.
typ.
max.
Unit
Test Condition
Static Characteristic
Drain-source breakdown
voltage
Gate threshold voltage
Zero gate voltage drain
current
Gate-source leakage
current
BV
DSS
V
GS(th )
20
0.45
-
0.65
-
1
V
V
V
GS
=0V, I
D
=250uA
V
DS
=V
GS
,I
D
=250uA
V
DS
=20V,V
GS
=0V
I
DSS
-
-
I
GSS
-
0.05
-
-
1
50
±100
nA
µA
T
j
=25°C
T
j
=150°C
V
GS
=±10V,V
DS
=0V
V
GS
=4.5V, I
D
=4.5A,
Drain-source on-state
resistance
R
DS(on)
-
-
-
Transconductance
g
fs
-
18
28
23
30
25
35
30
-
S
mΩ
T
j
=25°C
T
j
=150°C
VGS=2.5V, I
D
=3.5A
V
DS
=5V,I
D
=4.5A
Dynamic Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Gate Total Charge
Gate-Source charge
Gate-Drain charge
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Gate resistance
C
iss
C
oss
C
rss
Q
G
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
R
G
-
-
-
-
-
-
-
-
-
-
-
568
77
61
14.9
1.3
1.7
8
35
23
37
1.3
-
-
-
-
-
-
-
-
-
-
-
Ω
V
GS
=0V, V
DS
=0V,
f=1MHz
ns
V
GS
=5V, V
DD
=10V,
R
G_ext
=2.7Ω, I
D
=4.5A
nC
V
GS
=10V, V
DS
=10V,
I
D
=4.5A, f=1MHz
pF
V
GS
=0V, V
DS
=10V,
f=1MHz
©China Resources Microelectronics (Chongqing) Limited
Page 2
CR8205A
华润微电子(重庆)有限公司
Body Diode Characteristic
Parameter
Body Diode Forward
Voltage
Body Diode Forward
Current
Body Diode Reverse
Recovery Time
Body Diode Reverse
Recovery Charge
Symbol
Trench N-MOSFET 20V, 18mΩ, 10A
Value
min.
-
typ.
0.8
max.
1.3
10
-
-
7
1.3
-
-
Unit
V
A
ns
nC
Test Condition
V
GS
=0V,I
SD
=4.5A
T
C
= 25°C
V
SD
I
S
t
rr
Q
rr
I
F
=4.5A, dI/dt=100A/µ
s
*The value of R
thJA
is measured by placing the device in a still air box which is one cubic foot.
©China Resources Microelectronics (Chongqing) Limited
Page 3
CR8205A
华润微电子(重庆)有限公司
Trench N-MOSFET 20V, 18mΩ, 10A
Typical Performance Characteristics
Fig 1: Output Characteristics
20
20
Fig 2: Transfer Characteristics
V
DS
=5V
16
4.5V 2.5V
16
1.8V
I
D
(A)
1.5V
8
I
D
(A)
12
12
8
150°C
4
4
25°C
0
0
1
2
V
GS
=1.0V
3
4
5
0
0.0
0.8
1.6
2.4
3.2
4.0
V
DS
(V)
V
GS
(V)
40
Fig 3: Rds(on) vs Drain Current and
Gate Voltage
Fig 4: Rds(on) vs Gate Voltage
60
I
D
=4.5A
34
50
R
DS(on)
(mΩ)
R
DS(on)
(mΩ)
28
V
GS
=2.5V
V
GS
=3.0V
40
22
30
150°C
16
V
GS
=4.5V
20
25°C
10
0
6
12
18
24
30
10
1
2
3
4
5
6
7
8
9
10
I
D
(A)
V
GS
(V)
Fig 5: Rds(on) vs. Temperature
1.7
Fig 6: Capacitance Characteristics
10000
R
DS(on)
_Normalized
C - Capacitance (PF)
1.5
V
GS
=4.5V
I
D
=4.5A
Ciss
1000
1.3
1.1
Coss
100
0.9
0.7
10
-50
-25
0
25
50
75
100
125
150
0
V
GS
=0V
f=1MHz
4
8
Crss
0.5
12
16
20
Tj - Junction Temperature (°C)
V
DS
(V)
©China Resources Microelectronics (Chongqing) Limited
Page 4
CR8205A
华润微电子(重庆)有限公司
Trench N-MOSFET 20V, 18mΩ, 10A
Fig 8: Body-diode Forward
Characteristics
Fig 7: Gate Charge Characteristics
10
100
8
I
S
- Diode Current(A)
V
GS
(V)
10
6
150˚C
25˚C
1
4
V
DS
=10V
I
D
=4.5A
2
0
0
3
6
9
12
15
0.1
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
Qg (nC)
V
SD
- Diode Forward Voltage(V)
Fig 9: Power Dissipation
4
4
3
Fig 10: Drain Current Derating
12
10
P
tot
(W)
I
D
(A)
3
2
2
1
1
0
0
25
50
75
100
125
150
8
6
4
V
GS
≥10V
2
0
0
25
50
75
100
125
150
175
Tc - Case Temperature (°C)
Tc - Case Temperature (°C)
Fig 11: Safe Operating Area
100
Limited by
Rds(on)
10
1us
10us
100us
I
D
(A)
1ms
1
10ms
Single pulse
Tc=25˚C
0.1
0.1
1
10
DC
V
DS
(V)
100
©China Resources Microelectronics (Chongqing) Limited
Page 5
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