ES2A thru ES2M
Super Fast Surface Mount Rectifiers
Reverse Voltage 50 to 1000 Volts Forward Current 2.0 Amperes
Features
Glass passivated junction chip
For surface mounted application
Low profile package
Built-in strain relief
Ideal for automated placement
Easy pick and place
Superfast recovery time for high efficiency
Glass passivated chip junction
High temperature soldering:
250
o
C/10 seconds at terminals
Plastic material used carries Underwriters Laboratory
Classification 94V-O
Mechanical Data
Cases: Molded plastic
Terminals: Solder plated
Polarity: Indicated by cathode band
Weight: 0.003 ounce, 0.093 gram
Maximum Ratings and Electrical Characteristics
Ratings at 25
o
C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Parameter
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
S ee F i g. 1
Peak forward surge current, 8.3ms single
half sine-wave superimposed on rated load
(JEDEC Method)
Maximum instantaneous forward voltage @ 2.0A
Maximum DC reverse current
at rated DC blocking voltage
@ T
A
=25 C
@ T
A
=100
o
C
o
Symbols
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
V
F
I
R
t
rr
C
J
R
θ
JA
R
θ
JL
T
J
T
STG
ES
2A
50
35
50
ES
2B
100
70
100
ES
2C
150
105
150
ES
2D
200
140
200
ES
2F
300
210
300
2.0
ES
2G
400
280
400
ES
2J
600
420
600
ES
2K
800
560
800
ES
2M
1000
700
1000
Units
Volts
Volts
Volts
Amps
50.0
0.95
10.0
350
35
25
75
20
-55 to +150
-55 to +150
20
1.3
1.7
Amps
Volts
uA
uA
nS
pF
o
Maximum reverse recovery time (Note 1)
Typical junction capacitance (Note 2)
Typical thermal resistance (Note 3)
Operating junction temperature range
Storage temperature range
Notes:
C/W
o
C
C
o
1. Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
2. Measured at 1 MHz and Applied V
R
=4.0 Volts
3. Units Mounted on P.C.B. 5.0 x 5.0mm (0.013mm thick) Pad Areas
239
详细参数
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