Form No:
XXXXX-7-0000-TBM03-150300373
Specification for Approval
Date:
2015/03/20
Customer :
深圳台慶
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
TMPC0312H-series(G)
pcs
REMARK:
Customer Approval Feedback
□ 西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148 FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
□ 東莞臺慶精密電子有限公司
DONGGUAN TAI-TECH ADVANCED ELECTRONICS CO., LTD
JITIGANG MANAGEMENT DISTRICT, HUANGJIANG, DONGGUAN,
GUANGDONG, CHINA
TEL: +86-769-3365488 FAX: +86-769-3366896
E-mail: sales@tai-tech.net
Sales Dep.
APPROVED
CHECKED
Office:
金亨國際有限公司
KAMHENG INTERNATIONAL LIMITED
TEL: +86-852-25772033
FAX: +86-852-28817778
管哲頎
Eric Kuan
曾詩涵
Angela Tseng
□ 臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: sales@tai-tech.cn
R&D Center
APPROVED
CHECKED
DRAWN
Office:
北欣國際有限公司
NORTH STAR INTERNATIONAL LIMITED
TEL: +86-512-57619396
FAX: +86-512-57619688
楊祥忠
Mike Yang
詹偉特
Jack Chan
½秦芝
Sharon Ho
■ 慶邦電子元器件(泗洪)有限公司
TAIPAQ ELECTRONICS (SIHONG) CO., LTD
JIN SHA JIANG ROAD , CONOMIC DEVELOPMENT ZONE SIHONG ,
JIANGSU , CHINA.
TEL: +86-527-88601191 FAX: +86-527-88601190
E-mail: sales@taipaq.cn
TA734003
TAI-TECH
P1
SMD Power Inductor
TMPC0312H-Series(G)
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
15/03/20
新 發 行
楊祥忠
詹偉特
½秦芝
備
注
TAI-TECH
P2
SMD Power Inductor
1. Features
1. Carbonyl Powder.
2. Compact design.
3. High current，low DCR，high efficiency.
4. Very low acoustic noise and very low leakage flux noise.
5. High reliability.
6.
100% Lead(Pb)-Free and RoHS compliant.
TMPC0312H-Series(G)
Halogen
Halogen-free
Pb
Pb-free
2. Applications
Note PC power system，incl. IMVP-6
DC/DC converter .
3. Dimensions
Dr. MOS application
A
C
D
Recommend PC Board Pattern
L
B
2.2
E
G
Series
TMPC0312H
A(mm)
3.5±0.2
B(mm)
3.2±0.2
C(mm)
1.0±0.2
D(mm)
0.7±0.2
E(mm)
1.2±0.2
L(mm)
4.1
G(mm)
1.9
H
H(mm)
1.45
4. Part Numbering
TMPC
A
0312
B
H
C
-
2R2
D
MG
E
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
BxC
Carbonyl Powder.
2R2=2.2uH
M=±20%,Y=±30%
印字:黑色,單向印字,2.2
中間打點.
.
5. Specification
Part Number
TMPC0312H-R47MG
TMPC0312H-R56MG
TMPC0312H-R68MG
TMPC0312H-R82MG
TMPC0312H-1R0MG
TMPC0312H-1R5MG
TMPC0312H-2R2MG
TMPC0312H-3R3MG
TMPC0312H-4R7MG
TMPC0312H-5R6MG
TMPC0312H-6R8MG
TMPC0312H-8R2MG
TMPC0312H-100MG
Note:
1. Test frequency :
L : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L/Q: HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately
Δt
of 40
℃
(keep 1min.).
5. Saturation Current (Isat) will cause L0
to drop
30%
typical.
(keep
quickly).
Inductance
L0 (uH)±20% @ 0 A
0.47
0.56
0.68
0.82
1.00
1.50
2.20
3.30
4.70
5.6
6.80
8.20
10.0
I rms (A)
Typ.
5.0
4.5
4.0
3.5
3.3
3.0
2.7
2.0
1.6
1.5
1.4
1.2
1.0
I sat (A)
Typ.
7.2
6.6
6.1
5.8
5.5
4.0
3.4
3.1
2.8
2.2
2.0
1.7
1.4
DCR(mΩ)
Typ.@25℃
25
31
34
41
50
71
98
191
266
310
360
420
498
DCR(mΩ)
Max.@25℃
30
36
40
48
60
85
115
210
293
360
400
463
550
6. The part temperature (ambient + temp rise) should not exceed 125
℃
under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
TAI-TECH
P3
6. Material List
NO
1
2
3
Items
Core
Wire
Solder Plating
Carbonyl Powder.
Polyester Wire or equivalent.
100% Pb free solder
Materials
7. Reliability and Test Condition
Item
Operating temperature
Storage temperature
-40~+125℃
-40~+125℃(on board)
Performance
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
Saturation Current (Isat)
△L≦30%
typical.
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation DC Current (Isat) will cause L0
to drop
△L(%)(keep
quickly).
Heat Rated Current (Irms) will cause the coil temperature
rise
△T(℃)
without core loss.
1.Applied the allowed DC current(keep 1 min.).
2.Temperature measured by digital surface thermometer
Heat Rated Current (Irms)
Approximately
△T≦40℃
Reliability Test
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles)
Temperature：125±2℃(Bead)
Temperature： 85±2℃(Inductor)
Applied current：rated current
Duration：1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Humidity：85±2﹪R.H,
Temperature：85℃±2℃
Duration：1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020DClassification
Reflow Profiles
Condition for 1 cycle
Step1：-40±2℃ 30±5min
Step2：25±2℃
≦0.5min
Step3：105±2℃ 30±5min
Number of cycles： 500
Measured at room temperature after placing for 24±2 hrs
Oscillation Frequency: 10½2K½10Hz for 20 minutes
Equipment： Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
Life Test
Load Humidity
Thermal
shock
Appearance：No damage.
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not
exceed the specification value
Vibration
Type
Shock
SMD
Lead
Peak
value
(g’s)
1500
100
Normal
duration (D)
(ms)
0.5
6
Wave
form
Half-sine
Half-sine
Velocity
change
(Vi)ft/sec
15.4
12.3
Bending
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805:40x100x1.2mm
<0805:40x100x0.8mm
Bending depth: >=0805:1.2mm
<0805:0.8mm
duration of 10 sec.
TAI-TECH
Item
Performance
Test Method and Remarks
Preheat: 150℃,60sec.。
Solder: Sn99.5%-Cu0. 5%。
Temperature: 245±5℃。
Flux for lead free: Rosin. 9.5%。
Dip time: 4±1sec。
Depth: completely cover the termination
Number of heat cycles: 1
Temperature
(°C)
260 ±5(solder
temp)
Temperature
ramp/immersion
and emersion rate
P4
Soderability
More than 95% of the terminal electrode should
be covered with solder。
Resistance
to Soldering
Heat
Time(s)
10 ±1
25mm/s ±6 mm/s
Appearance：No damage.
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not
exceed the specification value
Terminal
Strength
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020DClassification
Reflow Profiles
With the component mounted on a PCB with the device to
be tested, apply a force
(>0805:1kg , <=0805:0.5kg)to the side of a device being
tested. This force shall be
applied for 60 +1 seconds. Also the force shall be applied
gradually as not to apply a
shock to the component being tested.
8. Soldering and Mounting
(1) Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. TAI-TECHerminations are suitable for
re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air
soldering tools.
(2) Solder re-flow:
Recommended temperature profiles for re-flow soldering in Figure 1.
(3) Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
‧Preheat
circuit and products to 150℃
‧355℃
tip temperature (max)
‧Never
contact the ceramic with the iron tip
‧1.0mm
tip diameter (max)
‧Use
a 20 watt soldering iron with tip diameter of 1.0mm
‧Limit
soldering time to 4~5sec.
Reflow Soldering
Iron Soldering
PRE-HEATING
SOLDERING
NATURAL
COOLING
PRE-HEATING
SOLDERING
TP(260
℃
/ 10s max.)
TEMPERATURE(°C)
tp(245° C / 20~40s.)
217
200
150
within 4~5s
TEMPERATURE(°C)
350
NATURAL
COOLING
60~150s
60~180s
150
480s max.
25
TIME( sec.)
Over 60s
Gradual cooling
TIME(sec.)
Reflow times: 3 times max.
Fig.1
Iron Soldering times: 1 times max.
Fig.2
模拟与混合信号
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