Form No:
XXXXXX-7-0000-TBM02-160600546
Specification for Approval
Date:
2016/06/15
Customer :
深圳臺慶
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
HPC8040NF-Series
pcs
REMARK:
Customer Approval Feedback
□ 西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148 FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
Sales Dep.
□
Office:
深圳辦公室
11BC,Building B Fortune Plaza,NO.7002, Shennan Avenue, Futian
District Shenzhen
TEL: +86- 755-23972371
FAX: +86-755-23972340
APPROVED
CHECKED
□
臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: sales@tai-tech.cn
管哲頎
Eric Kuan
劉璦瑄
Aries Liu
Office:
北欣國際有限公司
NORTH STAR INTERNATIONAL LIMITED
TEL: +86-512-57619396
FAX: +86-512-57619688
R&D Center
APPROVED
CHECKED
DRAWN
■ 慶邦電子元器件(泗洪)有限公司
TAIPAQ ELECTRONICS (SIHONG) CO., LTD
Sihong development zone Suqian City, Jiangsu , CHINA.
TEL: +86-527-88601191 FAX: +86-527-88601190
E-mail: sales@taipaq.cn
楊祥忠
Mike Yang
詹偉特
Jack Chan
½秦芝
Sharon Ho
TAI-TECH
P2
SMD Power Inductor
1. Features
1. This specification applies Low Profile Power Inductors.
2. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
HPC8040NF-Series
Halogen
Halogen-free
Pb
Pb-free
2. Dimension
Recommended Land pattern
2R2
Series
A(mm)
B(mm)
B’(mm)
6.3±0.2
C(mm)
3.7±0.3
D(mm)
2.0±0.3
E(mm)
6.0±0.3
F(mm)
5.5±0.3
L(mm)
8.5
G(mm)
5.5
G1(mm)
2.5min
H(mm)
6.3
HPC8040NF 8.0±0.3 8.0±0.3
3. Part Numbering
HPC
A
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
8040
B
NF
C
-
2R2
D
Y
E
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
A/B*C
2R2=2.20uh 100=10uh,101=100uh,102=1000uh
K=±10%,M=±20%,Y=±30%.
marking direction cannot decide polarity. Color: Black, unidirectional
magnetic shielding
.
TAI-TECH
P3
4. Specification
Rated current
Part Number
Inductance
L0 (uH)
@0A
K
HPC8040NF-1R0
HPC8040NF-1R2
HPC8040NF-1R4
HPC8040NF-1R5
HPC8040NF-1R6
HPC8040NF-2R0
HPC8040NF-2R2
HPC8040NF-2R7
HPC8040NF-3R3
HPC8040NF-4R7
HPC8040NF-5R6
HPC8040NF-6R8
HPC8040NF-100
HPC8040NF-150
HPC8040NF-220
HPC8040NF-330
HPC8040NF-470
HPC8040NF-560
HPC8040NF-680
HPC8040NF-820
HPC8040NF-101
HPC8040NF-121
HPC8040NF-151
HPC8040NF-181
HPC8040NF-221
HPC8040NF-331
HPC8040NF-471
Note:
1. All test data referenced to 25℃ ambient .
2. Testing Instrument : HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH502BC MICRO OHMMETER.
3. Heat Rated Current (Irms) will cause the coil temperature rise approximately
Δt
of 40℃
4. Saturation Current (Isat) will cause L0
to drop approximately
30%.
5. The part temperature (ambient + temp rise) should not exceed 125
℃
under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
6. Special inquiries besides the above common used types can be met on your requirement.
Tolerance
L
/
/
/
/
/
/
/
/
/
±15%
±15%
±15%
±15%
±15%
±15%
±15%
±15%
±15%
±15%
±15%
±15%
±15%
±15%
±15%
±15%
±15%
±15%
Frequency
Y
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
±30%
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
1MHz/1V
100KHz/1V
100KHz/1V
Temperature
current
I rms (A)
Typ
8.50
8.30
8.20
8.00
8.00
7.50
7.40
7.00
6.60
5.80
5.40
5.10
4.60
3.60
2.90
2.30
2.00
1.75
1.65
1.40
1.20
1.10
0.98
0.91
0.85
0.70
0.63
Saturation
current
I sat (A)
Typ
13.80
12.80
11.80
11.50
11.50
10.20
9.80
9.00
8.00
6.70
6.20
5.60
5.00
4.00
3.10
2.60
2.20
1.90
1.75
1.60
1.45
1.30
1.20
1.04
0.99
0.75
0.60
DCR
(mΩ)
@25℃
±20%.
8.2
8.2
10.0
10.0
10.0
11.0
11.5
13.0
15.0
19.5
22.0
25.0
33.0
50.0
73.0
100
135
160
205
230
300
350
410
490
610
850
1300
M
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
Max
8.00
7.80
7.80
7.70
7.70
7.10
6.90
6.50
6.20
5.30
5.20
5.00
4.20
3.20
2.45
2.10
1.70
1.60
1.50
1.30
1.10
1.00
0.90
0.83
0.76
0.66
0.58
Max
13.00
11.50
11.20
11.00
11.00
9.60
9.20
8.20
7.50
6.00
5.80
5.10
4.30
3.60
2.80
2.10
1.90
1.60
1.50
1.40
1.20
1.10
1.03
0.94
0.90
0.70
0.55
1.00
1.20
1.40
1.50
1.60
2.0
2.20
2.70
3.30
4.70
5.60
6.80
10.0
15.0
22.0
33.0
47.0
56.0
68.0
82.0
100
120
150
180
220
330
470
/
/
/
/
/
/
/
/
/
/
/
/
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
TAI-TECH
P4
5. Material List
NO
Items
Core
Wire
Glue
Solder
Adhesive
Copper foil
ink
Materials
Ferrite Core
Copper Wire
Magnetic Resin
Lead free-Sn Cu
Epoxy
Pure Copper
Halogen-free ketone
b
g
a
c
a
b
c
d
e
f
e
d
f
g
6. Reliability and Test Condition
Item
Operating temperature
Storage temperature
Performance
-40~+125℃ (Including self - temperature rise)
1. -10~+40℃,50~60%RH (Product without taping)
2. -40~+125℃(on board)
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
Saturation Current (Isat)
Approximately
△L30%.
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation DC Current (Isat) will cause L0
to drop
△L(%)
Heat Rated Current (Irms) will cause the coil temperature rise
△T(℃)
without core loss.
1.Applied the allowed DC current
2.Temperature measured by digital surface thermometer
Heat Rated Current (Irms)
Approximately
△T40℃
Reliability Test
Preconditioning:
Run
through
IR
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles)
Temperature： 125±2℃(Inductor)
Applied current：rated current
Duration：1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Preconditioning:
Run
through
IR
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Humidity：85±2﹪ R.H,
Temperature：85℃±2℃
Duration：1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
Preconditioning:
Run
through
IR
reflow
for
2
times.( IPC/JEDEC J-STD-020DClassification Reflow
Profiles
1. Baked at50℃ for 25hrs, measured at room temperature
after placing for 4 hrs.
2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25℃ 80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning:
Run
through
IR
reflow
times.( IPC/JEDEC J-STD-020DClassification
Reflow Profiles
Condition for 1 cycle
Step1：-40±2℃ 30±5min
Step2：25±2℃
≦0.5min
Step3：125±2℃ 30±5min
Number of cycles： 500
Measured at room temperature after placing for 24±2 hrs
Oscillation Frequency: 10½2K½10Hz for 20 minutes
Vibration
Equipment： Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
for
2
reflow
for
2
reflow
for
2
Life Test
Load Humidity
Moisture Resistance
Appearance：No damage.
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not
exceed the specification value
Thermal
shock
意法半导体-低功耗射频
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