Form No:
T00755-7-0000-PBM02-180700072
Specification for Approval
Date:
2018/07/05
Customer :
銀河
TMPA0605S-150MN-D
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
pcs
REMARK:
Customer Approval Feedback
□西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148
FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
Sales Dep.
APPROVED
CHECKED
□Office:
深圳辦公室
11BC,Building B Fortune Plaza,NO.7002, Shennan Avenue, Futian
District Shenzhen
TEL: +86- 755-23972371 FAX: +86-755-23972340
管哲頎
Eric Kuan
曾詩涵
Angela Tseng
□臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: sales@tai-tech.cn
R&D Center
APPROVED
CHECKED
DRAWN
■慶邦電子元器件(泗洪)有限公司
TAIPAQ ELECTRONICS (SIHONG) CO., LTD
JIN SHA JIANG ROAD , CONOMIC DEVELOPMENT ZONE SIHONG ,
JIANGSU , CHINA.
TEL: +86-527-88601191 FAX: +86-527-88601190
E-mail: sales@taipaq.cn
羅宜春
梁周虎
許靜
TAI-TECH
SMD Power Inductor
TMPA0605S-150MN-D
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
18/07/05
新發行
羅宜春
梁周虎
許靜
備
注
TAI-TECH
SMD Power Inductor
1. Features
1. Shielded construction.
2. Capable of corresponding high frequency (5MHz).
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6.
100% Lead(Pb)-Free and RoHS compliant.
TMPA0605S-150MN-D
Halogen
Halogen-free
Pb
Pb-free
2. Applications
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
3. Dimensions
A
C
D
Recommend PC Board Pattern
L
150
2R2
1730
1526
B
E
G
Series
TMPA0605
Unit:mm
A
B
C
D
E
3.0±0.2
7.3±0.3 6.6±0.3 4.8±0.2 1.6±0.3
L(mm)
G(mm)
H
H(mm)
4. Part Numbering
TMPA
A
0605
B
S
C
-
150
D
MN
E
-
8.0
3.5
3.4
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
F
D
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F: Code
BxC
Standard.
150=15.0uH
M=±20%
Marking: Black.1501730(17YY, 30 WW,follow production date).
5. Specification
Part Number
TMPA0605S-150MN-D
Inductance
L0 A(uH)
±20%
15.0
Heat Rating
Current DC
( A ) Irms.
Typ
5.0
Saturation
Current DC
(A)I sat
Typ
4.0
DCR
(mΩ)Typ
73
DCR
(mΩ)Max
85
Q(1MHz)
min
30
Agelient4284
Max
4.0
Max
3.2
Note:
1. Test frequency :
Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately
ΔT
of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately
30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
TAI-TECH
6. Material List
NO
1
2
3
4
Items
Core
Wire
Clip
Ink
Alloy Powder .
Polyester Wire or equivalent.
100% Pb free solder(Ni+Sn---Plating)
Halogen-free ketone
Materials
7. Reliability and Test Condition
Item
Operating temperature
Storage temperature
Performance
-40~+125℃ (Including self - temperature rise)
1. -10~+40℃,50~60%RH (Product with taping)
2. -40~+125℃(on board)
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
Saturation Current (Isat)
Approximately
△L30%.
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation DC Current (Isat) will cause L0
to drop
△L(%)
Heat Rated Current (Irms) will cause the coil temperature rise
△T(℃).
1.Applied the allowed DC current
2.Temperature measured by digital surface thermometer
Heat Rated Current (Irms)
Approximately
△T40℃
Reliability Test
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
Temperature： 125±2℃(Inductor)
Applied current：rated current
Duration：1000±12hrs
Measured at room temperature after placing for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
Humidity：85±2﹪R.H,
Temperature：85℃±2℃
Duration：1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
1. Baked at50℃ for 25hrs, measured at room temperature after
placing for 4 hrs.
2. Raise temperature to 65
±
2
℃
90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65
±
2
℃
90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25
℃
80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
Condition for 1 cycle
Step1：-40±2℃ 30±5min
Step2：25±2℃
≦0.5min
Step3：125±2℃ 30±5minNumber of cycles： 500
Measured at room fempraturc after placing for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
Oscillation Frequency: 10½2K½10Hz for 20 minutes
Equipment： Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
Life Test
Load Humidity
Moisture Resistance
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within
±15%
of initial value and shall not
exceed the specification value
Thermal shock
Vibration
TAI-TECH
Item
Bending
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within
±15%
of initial value and shall not
exceed the specification value
Performance
Test Condition
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805 inch(2012mm):40x100x1.2mm
<0805 inch(2012mm):40x100x0.8mm
Bending depth: >=0805 inch(2012mm):1.2mm
<0805 inch(2012mm):0.8mm
duration of 10 sec.
Type
SMD
Lead
Peak
value
(g’s)
50
50
Normal
duration (D)
(ms)
11
11
Wave
form
Half-sine
Half-sine
Velocity
change
(Vi)ft/sec
11.3
11.3
Shock
Solder ability
More than 95% of the terminal electrode should
be covered with solder。
Preheat: 150℃,60sec.。
Solder: Sn96.5% Ag3% Cu0.5%
Temperature: 245±5℃。
Flux for lead free: Rosin. 9.5%。
Dip time: 4±1sec。
Depth: completely cover the termination
Depth: completely cover the termination
Temperature(°C) Time(s)
Temperature
ramp/immersion Number of
and emersion rate heat cycles
25mm/s ±6 mm/s
1
Resistance to Soldering Heat
260 ±5
(solder temp)
10 ±1
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within
±15%
of initial value and shall not
exceed the specification value e
Terminal
Strength
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
With the component mounted on a PCB with the device to be
tested, apply a force(>0805:1kg , <=0805:0.5kg)to the side of a
device being tested. This force shall be applied for 60 +1
seconds. Also the force shall be applied gradually as not to
apply a shock to the component being tested.
Note : When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours of recovery under the standard
condition.
Microchip MCU
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