Form No:
T00303-1-0000-TBM03-121200034
Specification for Approval
Date:
2012/12/07
Customer :
天河
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
SDSL10D50F-220M
pcs
REMARK:
Customer Approval Feedback
西 北 臺 慶 科 技 股 ½ 有 限 公 司
TAI-TECH Advanced Electronics Co., Ltd
■ 西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148 FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
Sales Dep.
APPROVED
CHECKED
□ 東莞臺慶精密電子有限公司
DONGGUAN TAI-TECH ADVANCED ELECTRONICS CO., LTD
JITIGANG MANAGEMENT DISTRICT, HUANGJIANG, DONGGUAN,
GUANGDONG, CHINA
TEL: +86-769-3365488 FAX: +86-769-3366896
E-mail: sales@tai-tech.net
管哲頎
Eric Kuan
曾詩涵
Angela Tseng
Office:
金亨國際有限公司
KAMHENG INTERNATIONAL LIMITED
TEL: +86-852-25772033
FAX: +86-852-28817778
R&D Center
APPROVED
CHECKED
DRAWN
□ 臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: sales@tai-tech.cn
許智良
Chig-liang Shu
張榮泉
Nick Chang
徐允珮
Shelly Hsu
Office:
北欣國際有限公司
NORTH STAR INTERNATIONAL LIMITED
TEL: +86-512-57619396
FAX: +86-512-57619688
BSDLAA50220M020
TA734003
TAI-TECH
P1
SMD Type Power Inductor
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
SDSL10D50F-220M
CHECKED
DRAWN
1.0
12/12/07
新 發 行
許智良
張榮泉
徐允珮
備
註
www.tai-tech.com.tw
TAI-TECH
P2
SMD Type Power Inductor
1. Features
1.Low profile very effective in space-conscious applications.
2.Low resistance and high energy storage.
3.100% Lead(Pb) & Halogen-Free and RoHS compliant.
SDSL10D50F-220M
Halogen
Halogen-free
Pb
Pb-free
2. Dimension
Series
A(mm)
B(mm)
C(mm)
D(mm)
3.0 ref.
E(mm)
1.2±0.15
F(mm)
7.7±0.3
220
SDSL10D50F 10.5 max. 10.3 max. 5.0 max.
Units: mm
3. Part Numbering
SDSL 10D50
A
B
A: Series
B: Dimension
C: Lead free type
D: Inductance
E: Inductance Tolerance
F
C
-
220
D
M
E
220=22uH
M=±20%
4. Specification
TAI-TECH
Part Number
SDSL10D50F-220M
Inductance
(uH)
22±20%
Test Frequency
(Hz)
0.1V/100K
DCR
(mΩ) max.
61.0
I sat
(A) max.
2.90
I rms
(A) typ.
2.95
5. Schematic Diagram
6. Materials
a
b
c
e
d
No.
a.
b.
c.
d.
e.
Description
Core
Core
Wire
Terminal
Adhesive
Specification
Ferrite DR Core
Ferrite RI Core
Enamelled Copper Wire
Tinned Copper Plate
Epoxy
www.tai-tech.com.tw
TAI-TECH
P3
7. Reliability and Test Condition
Item
Operating Temperature
Storage temperature
Rated Current
Temperature Rise Test
Performance
-40~+125℃
-40~+85℃(For products in unopened tape package, less than 40℃)
Base on temp. rise &
△L/LOA=35%
typ.
40℃ max. (Δt)
Test Condition
Preheat:150℃,60sec.
Preheating Dipping Natural cooling
Solder heat Resistance
Appearance: No significant abnormality.
Inductance change: Within
±
20%.
260°C
Solder : Sn-Ag3.0-Cu0.5
Solder tamperature:260±5℃
Flux: rosin
60
second
10±0.5
second
150°C
Dip time:10±0.5sec.
Preheat:125±25℃,60sec.
Preheating Dipping Natural cooling
Solder : Sn-Ag3.0-Cu0.5
Solder tamperature:245±5℃
Flux: rosin
Solderability
More than 90% of the terminal
electrode should be covered with
solder.
245° C
150° C
60
second
4±1
second
Dip time:4±1sec.
Phase
1
Temperature(℃) Time(min)
-25±2℃
Room Temp.
+85±2℃
Room Temp.
30±3
15
30±3
15
For SDSL
Condition for 1 cycle
Step1:-25±2℃
Step3:+85±5℃
30±3 min.
30±3 min.
Step2:Room temperature 15 min.
Appearance: no damage.
Thermal shock
Inductance: within±20%of initial value.
2
3
4
Step4: Room temperature 15 min.
Number of cycles:50
Measured:50 times
Temperature:40±2℃.
Humidity Resistance Test
Appearance: no damage.
Inductance: within±20%of initial value.
Applied current:rated current.
Duration:500 hrs.
Humidity:90~95%
High Temperature
Resistance Test
Appearance: no damage.
Inductance: within±20%of initial value.
Temperature:85±2℃.
Applied current:rated current.
Duration:500 hrs.
Random Vibration Test
Appearance: Cracking, shipping and any other defects harmful to the
characteristics should not be allowed.
Inductance: within±20%of initial value.
Frequency: 10-55-10Hz for 1 min.
Amplitude: 1.52mm
Directions and times: X, Y, Z directions for 2 hours.
A period of 2 hours in each of 3 mutually
perpendicular directions (Total 6 hours).
8. Recommended PC Board Pattern
Reflow soldering Condition
L
5sec max.
260℃ max.
H
230℃
G
SDSL
L
G
H
Units: mm
10D50F
10.5
7.3
3.2
150~180℃
30sec
max.
90~120sec
Reflow times: 2 times max
www.tai-tech.com.tw
TAI-TECH
P4
9. Packaging Information
9-1. Reel Dimension & Tape Dimension
Type
13”x24mm
A(mm)
330
B(mm)
100
C(mm)
13±0.5
W(mm)
24.5
16.0mm
4.0mm
XXX
XXX
XXX
XXX
XXX
220
9-2. Packaging Quantity
SDSL
Chip / Reel
Carton
Reel Style
10D50F
750
4500
13”x24mm
9-3. Tearing Off Force
The force for tearing off cover tape is 10 to 130 grams in
the arrow direction under the following
conditions(referenced ANSI/EIA-481-C-2003 of 4.11
stadnard).
Room Temp.
Room Humidity
(%)
45~85
Room atm
(hPa)
860~1060
Tearing Speed
mm/min
300
F
Top cover tape
165° to180°
Base tape
(℃)
5~35
Application Notice
‧Storage
Conditions
To maintain the solderability of terminal electrodes:
1. Temperature and humidity conditions: Less than 40℃ and 60% RH.
2. Recommended products should be used within 12 months form the time of delivery.
3. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
www.tai-tech.com.tw
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