Form No:
T00303-7-0000-TBM03-121100183
Specification for Approval
Date:
2012/11/16
Customer :
天河
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
TMPC0512HP-1R0MG-D
50
pcs
REMARK:
Customer Approval Feedback
□ 西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148 FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
□ 東莞臺慶精密電子有限公司
DONGGUAN TAI-TECH ADVANCED ELECTRONICS CO., LTD
JITIGANG MANAGEMENT DISTRICT, HUANGJIANG, DONGGUAN,
GUANGDONG, CHINA
TEL: +86-769-3365488 FAX: +86-769-3366896
E-mail: sales@tai-tech.net
Sales Dep.
APPROVED
CHECKED
Office:
金亨國際有限公司
KAMHENG INTERNATIONAL LIMITED
TEL: +86-852-25772033
FAX: +86-852-28817778
管哲頎
Eric Kuan
魏½娟
Donna Wei
□ 臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: sales@tai-tech.cn
R&D Center
APPROVED
CHECKED
DRAWN
Office:
北欣國際有限公司
NORTH STAR INTERNATIONAL LIMITED
TEL: +86-512-57619396
FAX: +86-512-57619688
許智良
Chig-liang Shu
張榮泉
Nick Chang
徐允珮
Shelly Hsu
■ 慶邦電子元器件(泗洪)有限公司
TAIPAQ ELECTRONICS (SIHONG) CO., LTD
JIN SHA JIANG ROAD , CONOMIC DEVELOPMENT ZONE SIHONG ,
JIANGSU , CHINA.
TEL: +86-527-88601191 FAX: +86-527-88601190
E-mail: sales@taipaq.cn
BTMC55101R0M05
TA734003
TAI-TECH
P1
SMD Power Choke Coil
TMPC0512HP-1R0MG-D
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
12/11/16
新 發 行
許智良
張榮泉
徐允珮
備
註
TAI-TECH
P2
SMD Power Choke Coil
1. Features
1. Carbonyl powder inductor.
2. Compact design.
3. High current，low DCR，high efficiency.
4. Very low acoustic noise and very low leakage flux noise.
5. High reliability.
6. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
TMPC0512HP-1R0MG-D
Halogen
Halogen-free
Pb
Pb-free
2. Applications
Note PC power system，incl. IMVP-6
DC/DC converter.
3. Dimensions
Dr. MOS application
Recommend PC Board Pattern
C
A
1R0
1R0
1151
1150
D
L
L(mm)
E
H
G(mm)
2.2
H(mm)
2.8
B
6.2
G
Series
TMPC0512HP
A(mm)
5.7±0.3
B(mm)
5.2±0.2
C(mm)
1.0±0.2
D(mm)
1.1±0.3
E(mm)
2.5±0.3
4. Part Numbering
TMPC
A
0512
B
HP
C
-
1R0
D
MG -
E
D
F
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F: D/C
BxC
H: Carbonyl powder, P: PAD broaden
1R0=1.0uH
M=±20%
印字:黑色,
1R0
及
D/C 1150 (D/C
前二碼是年½,後二碼是週期,依實際生產週期而定)
5. Specification
Part Number
TMPC0512HP-1R0MG-D
Note:
1. Test frequency : L : 100KHz /1.0V
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L/Q: HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately
Δt≦40
℃
(keep 1min.).
5. Saturation Current (Isat) will cause L0
to drop
≦
20% typical.
(keep
quickly).
Inductance
L0 (uH) ±20% @ 0 A
1.00
I rms
(A) typ.
5.0
I sat
(A) typ.
6.0
DCR
DCR
(mΩ) typ. @25℃ (mΩ) max. @25℃
26
30
6. The part temperature (ambient + temp rise) should not exceed 125
℃
under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
TAI-TECH
P3
6. Material List
NO
1
2
3
Items
Core
Wire
Solder Plating
Carbonyl powder or equ.
Polyester Wire or equivalent.
100% Pb free solder
Materials
7. Reliability and Test Condition
Item
Operating temperature
Storage temperature and
Humidity range
-40~+125℃
-40~+125℃ (For products in unopened tape package, less than 40℃)
50~60%RH (Product without taping)
Performance
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
Saturation Current (Isat)
△L≦20%
typical.
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation DC Current (Isat) will cause L0
to drop
△L(%)(keep
quickly).
Heat Rated Current (Irms) will cause the coil temperature
rise
△T(℃)
without core loss.
1.Applied the allowed DC current(keep 1 min.).
2.Temperature measured by digital surface thermometer
Heat Rated Current (Irms)
Approximately
△T≦40℃
Reliability Test
High Temperature Exposure Test
Temperature:125±2
℃
.
Duration:1000±12hrs.
Measured at room temperature after placing for 2 to 3hrs.
(MIL-PRF-27)
Temperature:-40±2
℃
.
Duration:500±12hrs.
Measured at room temperature after placing for 2 to 3hrs.
Humidity:85±3%RH.
Temperature:85±2
℃
.
Duration:1000±12hrs.
Measured at room temperature after placing for 2 to 3hrs
(AEC-Q200-REV C)
Condition for 1 cycle
Step1:-40+0 / -2
℃
15±1 min.
Step2:Room temperature within
≦0.2
min.
Step3:+125+2 / -0
℃
15±1min.
Number of cycles:300
Measured at room temperature after placing for 2 to 3 hrs.
(AEC-Q200-REV C)
Frequency: 10-2000-10Hz for 20 min.
Amplitude: Parts mounted within 2" from any secure point.
Directions and times: X, Y, Z directions for 20 min.
This cycle shall be performed 12 times in each of three
mutually perpendicular directions
(Total 12hours).
(MIL-STD-202 Method 204 D Test condition B)
Pre-heat：150±5℃
Duration：5 minutes
Temperature：260±5℃，20~40 seconds
(IPC/JEDEC J-STD-020C)
After dip into flux，dip into solder
235±5℃，4±1seconds
Flux
、solder
for lead free
(ANSI /J-STD-002C Method B)
Low Temperature Life Test
Biased Humidity Test
Thermal shock test
Electric specifications should be satisfied
Vibration test
Reflow test
Solder test
Terminals should be covered by over 95% solder on visual inspection
TAI-TECH
P4
8. Soldering and Mounting
(1) Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. TAI-TECH terminations are suitable for
re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air
soldering tools.
(2) Solder re-flow:
Recommended temperature profiles for re-flow soldering in Figure 1.
(3) Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
‧Preheat
circuit and products to 150℃
‧355℃
tip temperature (max)
‧Never
contact the ceramic with the iron tip
‧1.0mm
tip diameter (max)
‧Use
a 20 watt soldering iron with tip diameter of 1.0mm
‧Limit
soldering time to 4~5sec.
Reflow Soldering
PRE-HEATING
SOLDERING
NATURAL
COOLING
Iron Soldering
PRE-HEATING
SOLDERING
NATURAL
COOLING
20~40s
)
TP(260° C / 40s max.)
217
200
150
within 4~5s
TEMPERATURE(°C)
350
(
60~150s
60~180s
150
480s max.
25
TIME( sec.)
Over 60s
Gradual cooling
TIME(sec.)
Reflow times: 3 times max.
Fig.1
Iron Soldering times: 1 times max.
Fig.2
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