TAI-TECH
P1
SMD Power Inductor
1. Features
1. Shielded construction.
2. Capable of corresponding high frequency (5MHz).
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6. 100% Lead(Pb)-Free and RoHS compliant.
TMPA1004S-Series(N)-D
Halogen
Halogen-free
Pb
Pb-free
2. Applications
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
3. Dimensions
A
A`
C
D
2R2
1537
B
leadframe
A
A`
C
E
T
D
Recommend PC Board Pattern
L
T
G
non‐leadframe
Series
A
A`
B
C
D
T
0~0.2
E
Inductance
L(mm)
G(mm)
H(mm)
2.5±0.3 0.56~1.50uH among
TMPA1004 11.0±0.3 10.0±0.3 10.0±0.3 3.8±0.2 2.0±0.3
Unit:mm
12.5
5.4
3.5
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
0.47uH and
below
3.0±0.3
2.00uH and
above
4. Part Numbering
TMPA
A
1004
B
S
C
-
1R0
D
MN
E
-
D
F
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F: Code
BxC
Standard.
R10=0.1uh，1R0=1.0uh，100=10uh，101=100uh，102=1000uh.
K=±10%，L=±15%，M=±20%，N=±25%，Y=±30%
Marking: Black.1R0 and 1537(15 YY, 37 WW,follow production date).
H
1R0
1537
B
E
TAI-TECH
P2
5. Specification
Part Number
Inductance
L0 A(uH)
±20%
0.15±30%
0.22
0.36
0.42
0.45
0.47
0.56
0.68
0.82
0.90
1.00
1.50
1.80
2.00
2.20
3.30
4.70
5.60
6.80
8.20
10.0
15.0
22.0
33.0
47.0
68.0
82.0
100
Heat Rating
Current DC
I rms.(A)
Typ
44.0
36.0
33.0
32.5
32.5
32.0
25.0
23.0
22.0
21.0
20.0
17.5
16.5
16.0
15.0
11.0
8.8
8.0
7.8
7.6
7.5
6.25
5.0
4.4
3.5
2.6
2.3
2.0
Saturation
Current DC
I sat. (A)
Typ
82.0
70.0
51.0
50.0
48.0
46.0
34.0
31.0
30.0
29.5
29.0
26.0
23.0
21.0
20.0
17.5
15.2
14.1
12.2
9.5
8.6
7.0
6.2
5.5
4.0
3.2
3.0
2.7
DCR
(mΩ)Typ
0.5
0.72
1.05
1.15
1.2
1.3
1.6
1.9
2.1
2.2
2.9
3.7
5.1
5.3
5.8
10.5
15.8
19
22
25
27
41
58
84
125
184
240
270
DCR
(mΩ)Max
0.6
0.83
1.18
1.3
1.4
1.5
1.8
2.2
2.5
2.6
3.25
4.2
5.7
6.1
6.7
11.8
19
22.8
24.5
28
30
45
66
91
143
210
270
310
Type
Max
38.0
33.0
29.0
28.5
28.5
28.0
23.0
20.0
19.0
19.0
18.0
16.0
15.0
14.5
13.0
10.0
8.0
7.2
6.8
6.5
6.1
5.0
4.1
3.5
3.0
2.4
2.1
1.8
Max
75.0
60.0
45.0
42.0
42.0
40.0
29.0
28.0
27.0
27.0
26.0
22.0
20.5
18.0
16.0
14.0
13.0
11.5
11.0
8.5
7.5
6.0
5.5
5.0
3.7
3.0
2.8
2.4
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
TMPA1004S-R15YN-D
TMPA1004S-R22MN-D
TMPA1004S-R36MN-D
TMPA1004S-R42MN-D
TMPA1004S-R45MN-D
TMPA1004S-R47MN-D
TMPA1004S-R56MN-D
TMPA1004S-R68MN-D
TMPA1004S-R82MN-D
TMPA1004S-R90MN-D
TMPA1004S-1R0MN-D
TMPA1004S-1R5MN-D
TMPA1004S-1R8MN-D
TMPA1004S-2R0MN-D
TMPA1004S-2R2MN-D
TMPA1004S-3R3MN-D
TMPA1004S-4R7MN-D
TMPA1004S-5R6MN-D
TMPA1004S-6R8MN-D
TMPA1004S-8R2MN-D
TMPA1004S-100MN-D
TMPA1004S-150MN-D
TMPA1004S-220MN-D
TMPA1004S-330MN-D
TMPA1004S-470MN-D
TMPA1004S-680MN-D
TMPA1004S-820MN-D
TMPA1004S-101MN-D
Note:
1. Test frequency :
Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately
ΔT
of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately
30%.
6. The part temperature (ambient + temp rise) should not exceed 125
℃
under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
Microchip MCU
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