Form No:
T0000X-2-0000-KBM01-190100330
Specification for Approval
Date:
2019/1/16
Customer :
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
Halogen
Halogen-free
深圳臺慶
HCB3216KF-500T60
pcs
REMARK:
Customer Approval Feedback
西 北 臺 慶 科 技 股 ½ 有 限 公 司
TAI-TECH Advanced Electronics Co., Ltd
□西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148
FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
Sales Dep.
APPROVED
CHECKED
管哲頎
Eric Guan
曾詩涵
Angela Tseng
□Office:
深圳辦公室
11BC,Building B Fortune Plaza,NO.7002, Shennan Avenue, Futian
District Shenzhen
TEL: +86- 755-23972371
FAX: +86-755-23972340
■臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: sales@tai-tech.cn
R&D Center
APPROVED
CHECKED
DRAWN
□慶邦電子元器件(泗洪)有限公司
TAIPAQ ELECTRONICS (SIHONG) CO., LTD
JIN SHA JIANG ROAD , CONOMIC DEVELOPMENT ZONE SIHONG ,
JIANGSU , CHINA.
TEL: +86-527-88601191 FAX: +86-527-88601190
E-mail: sales@taipaq.cn
鄧福興
浦冬生
王俞琴
TAKQ-E4-001
TAI-TECH
KBM01-190100330
P1.
HCB3216KF-500T60
High Current Ferrite Chip Bead(Lead Free)
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
2.0
3.0
3.1
4.0
5.0
13/06/06
變更可靠度條件
14/01/24
變更電鍍錫層厚度
3.0um min.=>3.5um min.
楊祥忠
楊祥忠
楊祥忠
楊祥忠
楊祥忠
楊祥忠
羅培君
羅培君
羅培君
羅培君
詹偉特
詹偉特
張嘉玲
張嘉玲
張嘉玲
張嘉玲
張嘉玲
張嘉玲
14/08/01
變更
Reflow
圖示
14/08/01
修正包裝帶尺寸
16/01/26
增訂可靠度
Thermal shock:
(Bead) Step3：125±2℃ 30±5min
17/02/16
修訂
Recommended PC Board Pattern
備
註
www.tai-tech.com.tw
TAI-TECH
KBM01-190100330
P2.
HCB3216KF-500T60
High Current Ferrite Chip Bead(Lead Free)
1.Features
Halogen
1. Monolithic inorganic material construction.
Halogen-free
2. Closed magnetic circuit avoids crosstalk.
3. Suitable for reflow soldering.
4. Shapes and dimensions follow E.I.A. spec.
5. Available in various sizes.
6. Excellent solder ability and heat resistance.
7. High reliability.
8.100% Lead(Pb) & Halogen-Free and RoHS compliant.
9. Low DC resistance structure of electrode to prevent wasteful electric power consumption.
10. Operating Temperature：-55~+125℃(Including self-temperature rise)
2.Dimensions
Chip Size
A
B
C
D
Units: mm
3.20±0.20
1.60±0.20
1.10±0.20
0.50±0.30
3.Part Numbering
HCB
A
3216
B
KF
C
-
500
D
T
E
60
F
A: Series
B: Dimension
C: Material
D: Impedance
E: Packaging
F: Rated Current
LxW
Lead Free Material
500=50Ω
T=Taping and Reel, B=Bulk(Bags)
60=6000mA
4.Specification
Tai-Tech
Part Number
HCB3216KF-500T60
●
●
Impedance (Ω)
50±25%
Test Frequency
(Hz)
60mV/100M
DC Resistance
(Ω) max.
0.01
Rated Current
(mA) max.
6000
Rated current: based on temperature rise test
In compliance with EIA 595
Impedance-Frequency Characteristics
HCB3216KF-500T60
100
80
IMPEDANCE(Ohm)
60
Z
40
X
20
R
0
1
10
100
1000
FREQUENCY(MHz)
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TAI-TECH
KBM01-190100330
P3.
Performance
FCB
FCM
HCB
GHB
FCA
--
--
5. Reliability and Test Condition
Item
Series No.
Operating Temperature
Test Condition
-55~+125℃
(Including self-temperature rise)
-55~+125℃
(on board)
Transportation
Storage Temperature
For long storage conditions, please see the
Application Notice
Agilent4291
Impedance (Z)
Agilent E4991
Agilent4287
Refer to standard electrical characteristics list
DC Resistance
Rated Current
Agilent16192
Agilent 4338
DC Power Supply
Over Rated Current requirements, there will be
some risk
Temperature Rise Test
Rated Current < 1A ΔT 20
℃
Max
Rated Current
≧
1A ΔT 40
℃
Max
1. Applied the allowed DC current.
2. Temperature measured by digital surface
thermometer.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Temperature: 125±2℃
Applied current: rated current.
Duration: 1000±12hrs.
Measured at room temperature after placing
for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Humidity: 85±2%R.H.
Temperature: 85±2℃.
Duration: 1000hrs Min. with 100% rated
current.
Measured at room temperature after placing
for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Condition for 1 cycle
Step1: -55±2℃
30±5 min.
Step2: 25±2
℃
≦
0.5min
Step3: +125±2℃
30±5min.
Number of cycles: 500
Measured at room temperature after placing
for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Oscillation Frequency: 10½2K½10Hz for 20
minutes
Equipment： Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles
each of 3 orientations)。
Shall be mounted on a FR4 substrate of the
following dimensions:
>=0805inch(2012mm):40x100x1.2mm
<0805inch(2012mm):40x100x0.8mm
Bending depth:
>=0805inch(2012mm):1.2mm
<0805inch(2012mm):0.8mm
Duration of 10 sec for a min.
Life test
Appearance: no damage.
Impedance: within±15%of initial value.
Inductance: within±10%of initial value.
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Load Humidity
Appearance: no damage.
Thermal shock
Impedance: within±15%of initial value.
Inductance: within±10%of initial value.
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Vibration
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Bending
Appearance：No damage.
Impedance：within±10% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Test condition:
Appearance：No damage.
Impedance：within±10% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Peak
Type
Value
(g’s)
SMD
Lead
50
50
Normal
duration
(D) (ms)
11
11
Half-sine
Half-sine
Wave form
Velocity
change
(Vi)ft/sec
11.3
11.3
Shock
Solderability
More than 95% of the terminal electrode should be covered with solder.
Preheat: 150
℃
,60sec.
Solder: Sn96.5%-Ag3%-Cu0.5%
Solder temperature: 245±5℃
Flux for lead free: Rosin. 9.5%
Depth: completely cover the termination.
Dip time: 4±1sec.
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TAI-TECH
Item
Performance
KBM01-190100330
P4.
Test Condition
Number of heat cycles: 1
Resistance to Soldering
Heat
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Temperature
(°C)
260 ±5
(solder temp)
Time
(s)
10 ±1
Temperature
ramp/immersion
and emersion rate
25mm/s ±6 mm/s
Depth: completely cover the termination
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Component mounted on a PCB apply a force
>0805inch(2012mm):1kg
<=0805inch(2012mm):0.5kg
to the side of a device being tested. This force
shall be applied for 60 +1 seconds. Also the
force shall be applied gradually as not to shock
the component being tested.
Terminal strength
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not
exceed the specification value
**
Derating Curve
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85℃, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
6.Soldering and Mounting
6-1. Recommended PC Board Pattern
Chip Size
Series
FCB
FCM
HCB
GHB
FCI
FHI
FCH
HCI
2012
3216
3225
4516
4532
Land Patterns For
Reflow Soldering
0.30±0.03 0.15±0.05
0.50±0.10 0.25±0.10
0.80±0.15 0.30±0.20
0.85±0.20 0.50±0.30
1.25±0.20 0.50±0.30
1.10±0.20 0.50±0.30
1.30±0.20 0.50±0.30
1.60±0.20 0.50±0.30
1.50±0.20 0.50±0.30
1.05
1.05
1.05
1.05
2.20
2.20
3.30
3.30
1.80
2.70
1.80
3.40
0.35
0.50
0.80
1.05
0.30
0.40
0.85
1.00
0.40
0.60
0.95
0.8
Type
0603
1005
1608
A(mm) B(mm) C(mm) D(mm) E(mm) F(mm) G(mm)
0.6±0.03
1.0±0.10
1.6±0.15
2.0±0.20
2.0±0.20
3.2±0.20
3.2±0.20
4.5±0.20
4.5±0.20
0.30±0.03
0.50±0.10
0.80±0.15
1.25±0.20
1.25±0.20
1.60±0.20
2.50±0.20
1.60±0.20
3.20±0.20
FCA3216
2.8
Land
Solder Resist
1.45
2.2-2.6
0.8
Pitch
0.4
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
6-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
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