Form No:
XXXXXX-7-0000-PBM02-180100727
Specification for Approval
Date:
2018/01/22
Customer :
深圳臺慶
TMPA1205SP-Series(N)-D
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
pcs
REMARK:
Customer Approval Feedback
□西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148
FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
Sales Dep.
APPROVED
CHECKED
□Office:
深圳辦公室
11BC,Building B Fortune Plaza,NO.7002, Shennan Avenue, Futian
District Shenzhen
TEL: +86- 755-23972371 FAX: +86-755-23972340
管哲頎
Eric Kuan
曾詩涵
Angela Tseng
□臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: sales@tai-tech.cn
R&D Center
APPROVED
CHECKED
DRAWN
■慶邦電子元器件(泗洪)有限公司
TAIPAQ ELECTRONICS (SIHONG) CO., LTD
JIN SHA JIANG ROAD , CONOMIC DEVELOPMENT ZONE SIHONG ,
JIANGSU , CHINA.
TEL: +86-527-88601191 FAX: +86-527-88601190
E-mail: sales@taipaq.cn
羅宜春
梁周虎
卜文娟
TAI-TECH
SMD Power Inductor
TMPA1205SP-Series(N)-D
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
18/01/22
新發行
羅宜春
梁周虎
卜文娟
備
注
TAI-TECH
SMD Power Inductor
1. Features
1. Shielded construction.
2. Capable of corresponding high frequency .
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6.
100% Lead(Pb)-Free and RoHS compliant.
TMPA1205SP-Series(N)-D
Halogen
Halogen-free
Pb
Pb-free
2. Applications
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
3. Dimensions
A
C
D
100
1601
B
leadframe
A
C
E
D
Recommend PC Board Pattern
L
1R0
1601
B
E
G
non-leadframe
Series
TMPA1205
Unit:mm
A
B
C
D
2.3±0.3
E
4.0±0.3
4.7±0.3
Inductance
1.0uH and
below
1.5uH and
above
L(mm)
G(mm)
13.5±0.5 12.6±0.2 4.7±0.3
14.5
8.0
5.0
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
4. Part Numbering
TMPA
A
1205
B
SP
C
-
100
D
MN
E
-
D
F
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F: Code
BxC.
Standard.
R10=0.1uh，1R0=1.0uh，100=10uh，101=100uh，102=1000uh.
K=±10%，L=±15%，M=±20%，N=±25%，Y=±30%
Marking: Black.100 and 1601(16 YY, 01 WW,follow production date).
H
H(mm)
TAI-TECH
5. Specification
Part Number
TMPA1205SP-R47MN-D
TMPA1205SP-R68MN-D
TMPA1205SP-1R0MN-D
TMPA1205SP-1R5MN-D
TMPA1205SP-2R2MN-D
TMPA1205SP-3R3MN-D
TMPA1205SP-4R7MN-D
TMPA1205SP-6R8MN-D
TMPA1205SP-100MN-D
TMPA1205SP-150MN-D
TMPA1205SP-220MN-D
TMPA1205SP-330MN-D
Note:
1. Test frequency :
Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately
ΔT
of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately
30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
Inductance
L0 A(uH)
±20%
0.47
0.68
1.00
1.50
2.20
3.30
4.70
6.80
10.0
15.0
22.0
33.0
Heat Rating
Current DC
( A ) Irms.
Typ
38
34
30
25
17
15.5
14
12
10
9.4
8.0
6.0
Saturation
Current DC
(A)I sat
Typ
65
50
40
31
26
23
18.5
16.5
13
11
8.5
7.3
Max
34
31
27
22
15.5
14
12.5
11
9.0
8.2
7.0
5.2
Max
58
42
34
28
23
20.5
16
15
10.5
9.2
7.5
6.5
DCR
(mΩ)
Typ
0.77
1.3
1.6
3.2
4.1
6.0
8.8
13
19.2
30
42
66
DCR
(mΩ)
Max
0.9
1.55
1.9
3.8
4.8
7.0
10.2
16
22
36
52
80
Type
non-leadframe
non-leadframe
non-leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
TAI-TECH
6. Material List
4
3
1
2
NO
1
2
Items
Core
Wire
Alloy Powder .
Materials
Polyester Wire or equivalent.
NO
1
2
3
4
Items
Core
Wire
Solder
Ink
Materials
Alloy Powder .
Polyester Wire or equivalent.
100% Pb free solder
Halogen-free ketone
3
4
Clip
Ink
100% Pb free solder(Ni+Sn---Plating)
Halogen-free ketone
7. Reliability and Test Condition
Item
Operating temperature
Storage temperature
Performance
-40~+125℃ (Including self - temperature rise)
1. -10~+40℃,50~60%RH (Product without taping)
2. -40~+125℃(on board)
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
Saturation Current (Isat)
Approximately
△L30%
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation DC Current (Isat) will cause L0
to drop
△L(%)
Heat Rated Current (Irms) will cause the coil temperature rise
△T(℃)
without core loss.
1.Applied the allowed DC current.
2.Temperature measured by digital surface thermometer
Heat Rated Current (Irms)
Approximately
△T40℃
Reliability Test
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles)
Temperature： 125±2℃(Inductor)
Applied current：rated current
Duration：1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Humidity：85±2﹪R.H,
Temperature：85℃±2℃
Duration：1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow
Profiles
1. Baked at50℃ for 25hrs, measured at room temperature after
placing for 4 hrs.
2. Raise temperature to 65
±
2
℃
90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65
±
2
℃
90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25
℃
80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification
Reflow Profiles
Condition for 1 cycle
Step1：-40±2℃ 30±5min
Step2：25±2℃
≦0.5min
Step3：125±2℃ 30±5min
Number of cycles： 500
Measured at room temperature after placing for 24±2 hrs
Life Test
Load Humidity
Moisture Resistance
Appearance：No damage.
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not
exceed the specification value
Thermal
shock
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