Form No:
XXXXXX-7-0000-PBM02-170400173
Specification for Approval
Date:
2017/04/19
Customer :
深圳台慶
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
HPC4030NF-Series
pcs
REMARK:
Customer Approval Feedback
□西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148 FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
Sales Dep.
APPROVED
CHECKED
□Office:
深圳辦公室
11BC,Building B Fortune Plaza,NO.7002, Shennan Avenue, Futian
District Shenzhen
TEL: +86- 755-23972371
FAX: +86-755-23972340
曾詩涵
Angela Tseng
曾詩涵
Angela Tseng
□臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: sales@tai-tech.cn
R&D Center
APPROVED
CHECKED
DRAWN
■慶邦電子元器件(泗洪)有限公司
TAIPAQ ELECTRONICS (SIHONG) CO., LTD
JIN SHA JIANG ROAD , CONOMIC DEVELOPMENT ZONE SIHONG ,
JIANGSU , CHINA.
TEL: +86-527-88601191 FAX: +86-527-88601190
E-mail: sales@taipaq.cn
羅宜春
梁周虎
張光
TAIPAQ
P1
SMD Power Inductor
HPC4030NF-Series
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
17/04/19
新發行
羅宜春
梁周虎
張光
備
注
TAIPAQ
P2
SMD Power Inductor
1. Features
1. Magnetic-resin shielded construction reduces buzz noise to ultra-low levels
2. Metallization on ferrite core results in excellent shock resistance and damage-free durability
3. Closed magnetic circuit design reduces leakage flux and Electro Magnetic Interference (EMI)
4. 30% higher current rating than conventional nductors of equal size
5. Takes up less PCB real estate and save more power
HPC4030NF-Series
Halogen
Halogen-free
Pb
Pb-free
2. Applications
1. LED Lighting
2. Next-generation mobile devices with multifunction such as mobile TV and digital movie cameras
3. Flat-screen TVs, blue-ray disc recorders, set top box
4. Notebooks, desktop computers, servers, graphic cards cards
5. Portable gaming devices, personal navigation systems, personal multimedia devices
6. Automotive systems
7. Telecomm base stations
3. Dimension
Recommendend Land pattern
Series
HPC4030NF
*Dimensions are not including the termination. For maximum overall dimensions
with ternmination , add 0.1mm.
4. Part Numbering
HPC
A
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
100
*A(mm) *B(mm)
4.0±0.2
C(mm)
D(mm)
E(mm)
a(mm)
1.3Typ
b(mm)
1.5Typ
c(mm)
3.7Typ
4.0±0.2 3.0Max.
1.35±0.3 3.4±0.2
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.12mm and above.
4030
B
NF
C
-
100
D
M
E
A/B*C
1R0=1.00uh 100=10uh,101=100uh,102=1000uh
K=±10%, L=±15%,M=±20%,Y=±30%.
marking direction cannot decide polarity. Color: Black, unidirectional.
magnetic shielding
.
TAIPAQ
P3
5. Specification
Part Number
Inductance
L0 (uH)±20%
@0A
0.68
1.00
1.50
2.20
3.30
4.70
5.60
6.80
8.20
10.0
12.0
15.0
18.0
22.0
33.0
47.0
Rated current
Tempetature
current
I rms (A)
4.60
4.20
3.40
3.00
2.40
2.05
1.95
1.80
1.60
1.50
1.30
1.20
1.10
1.00
0.85
0.72
Saturation
current
I sat (A)
6.80
5.30
4.90
4.90
3.30
2.90
2.60
2.75
2.10
2.00
1.80
1.70
1.50
1.30
1.10
0.95
DCR
(mΩ)
@25℃
±20%.
10
14
20
30
40
60
65
90
90
100
135
190
200
225
330
445
HPC4030NF-R68M
HPC4030NF-1R0M
HPC4030NF-1R5M
HPC4030NF-2R2M
HPC4030NF-3R3M
HPC4030NF-4R7M
HPC4030NF-5R6M
HPC4030NF-6R8M
HPC4030NF-8R2M
HPC4030NF-100M
HPC4030NF-120M
HPC4030NF-150M
HPC4030NF-180M
HPC4030NF-220M
HPC4030NF-330M
HPC4030NF-470M
Note:
1. All test data referenced to 25℃ ambient ,
Ls:100KHz/1V.
2. Testing Instrument : HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH502BC MICRO OHMMETER.
3. Heat Rated Current (Irms) will cause the coil temperature rise approximately
Δt
of 40℃.
4. Saturation Current ( Isat ) will cause L0 to drop approximately 30%.
5. The part temperature (ambient + temp rise) should not exceed 125
℃
under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
6. Special inquiries besides the above common used types can be met on your requirement.
TAIPAQ
P4
5. Material List
e
a
c
b
NO
a
b
c
d
d
Items
Core
Wire
Glue
Terminal
Ink
Materials
Ferrite Core
Enameled Copper Wire
Epoxy with magnetic powder
Ag/Ni/Sn+ Sn Solder
Halogen-free ketone
e
6. Reliability and Test Condition
Item
Operating temperature
Storage temperature
Performance
-40~+125℃ (Including self - temperature rise)
1.-10~+40℃,50~60%RH (Product without taping)
2.-40~+125℃ (on board)
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
Saturation Current (Isat)
Approximately
△L30%.
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation DC Current (Isat) will cause L0
to drop
△L(%)
Heat Rated Current (Irms) will cause the coil temperature rise
△T(℃)
without core loss.
1.Applied the allowed DC current.
2.Temperature measured by digital surface thermometer
Heat Rated Current (Irms)
Approximately
△T40℃
Reliability Test
Preconditioning:
Run
through
IR
reflow
for
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles)
Temperature： 125±2℃(Inductor)
Applied current：rated current
Duration：1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Preconditioning:
Run
through
IR
reflow
for
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Humidity：85±2﹪R.H,
Temperature：85℃±2℃
Duration：1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
2
Life Test
2
Load Humidity
Moisture Resistance
Appearance：No damage.
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not
exceed the specification value
Preconditioning:
Run
through
IR
reflow
for
2
times.( IPC/JEDEC J-STD-020DClassification Reflow
Profiles
1. Baked at50℃ for 25hrs, measured at room temperature
after placing for 4 hrs.
2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25℃ 80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning:
Run
through
IR
reflow
for
times.( IPC/JEDEC J-STD-020DClassification
Reflow Profiles
Condition for 1 cycle
Step1：-40±2℃ 30±5min
Step2：25±2℃
≦0.5min
Step3：125±2℃ 30±5min
Number of cycles： 500
Measured at room temperature after placing for 24±2 hrs
Oscillation Frequency: 10½2K½10Hz for 20 minutes
Equipment： Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
2
Thermal
shock
Vibration
ARM技术
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
