Form No:
T00374-2-0000-TBM01-151200873
Specification for Approval
Date:
2019/1/10
Customer :
天誠
Halogen
Halogen-free
Pb
Pb-free
TAI-TECH
P/N:
HCB2012MF-070T60
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
pcs
REMARK:
Customer Approval Feedback
西 北 臺 慶 科 技 股 ½ 有 限 公 司
TAI-TECH Advanced Electronics Co., Ltd
代理商：
■
深圳市天誠科技有限公司
Shenzhen TsaSun Technology Co.,Ltd.
ROOM601,BLOCK F,CULTURE CREATIVE PARK,NO.4001FUQIANG ROAD
FUTIAN DISTRICT,SHENZHEN CHINA
TEL: +86-755-83358885 FAX: +86-0755-83351010
E-mail: sales@tsasun.com
Sales Dep.
APPROVED
CHECKED
□西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148 FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
蒯青榮
王歡
□臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: sales@tai-tech.cn
R&D Center
APPROVED
CHECKED
DRAWN
□慶邦電子元器件(泗洪)有限公司
TAIPAQ ELECTRONICS (SIHONG) CO., LTD
JIN SHA JIANG ROAD , CONOMIC DEVELOPMENT ZONE SIHONG , JIANGSU ,
CHINA.
TEL: +86-527-88601191 FAX: +86-527-88601190
E-mail: sales@taipaq.cn
鄧福興
浦冬生
王俞琴
TAKQ-E4-001
TAI-TECH
TBM01-151200873
P2.
Ferrite Chip Bead(Lead Free)
1.Features
1. Monolithic inorganic material construction.
2. Closed magnetic circuit avoids crosstalk.
3. Suitable for reflow soldering.
4. Shapes and dimensions follow E.I.A. spec.
5. Available in various sizes.
6. Excellent solder ability and heat resistance.
7. High reliability.
8.100% Lead(Pb) & Halogen-Free and RoHS compliant
.
9. Low DC resistance structure of electrode to prevent wasteful electric power consumption.
Halogen
Halogen-free
HCB2012MF-070T60
Pb
Pb-free
2.Dimensions
Chip Size
A
B
C
D
Units: mm
2.00±0.20
1.25±0.20
0.85±0.20
0.50±0.30
3.Part Numbering
HCB
A
2012
B
MF
C
-
070
D
T
E
60
F
A: Series
B: Dimension
C: Material
D: Impedance
E: Packaging
F: Rated Current
LxW
Lead Free Material
070=7Ω
T=Taping and Reel, B=Bulk(Bags)
60=6000mA
4.Specification
Tai-Tech
Part Number
HCB2012MF-070T60
●
●
Impedance (Ω)
7±25%
Test Frequency
(Hz)
60mV/100M
DC Resistance
(Ω) max.
0.01
Rated Current
(mA) max.
6000
Rated current: based on temperature rise test
In compliance with EIA 595
Impedance-Frequency Characteristics
HCB2012MF-070T60
40
IMPEDANCE(Ohm)
30
20
Z
X
10
0
1
10
100
R
1000
FREQUENCY(MHz)
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TAI-TECH
TBM01-151200873
Performance
FCB
FCM
HCB
GHB
FCA
FCI
FHI
FCH
HCI
--
--
P3.
5. Reliability and Test Condition
Item
Series No.
Operating Temperature
Test Condition
-40~+125℃
(Including self-temperature rise)
-40~+125℃
(on board)
-40~+105℃
(Including self-temperature rise)
-40~+105℃
(on board)
Transportation
Storage Temperature
Impedance (Z)
Inductance (Ls)
Q Factor
DC Resistance
Rated Current
For long storage conditions, please see the
Application Notice
Agilent4291
Agilent E4991
Agilent4287
Refer to standard electrical characteristics list
Agilent16192
Agilent 4338
DC Power Supply
Over Rated Current requirements, there will be
some risk
Rated Current < 1A
∆T
20
℃
Max
Temperature Rise Test
Rated Current
≧
1A
∆T
40
℃
Max
1. Applied the allowed DC current.
2. Temperature measured by digital surface
thermometer.
Number of heat cycles: 1
Resistance to Soldering
Heat
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Temperature
(°C)
260 ±5
(solder temp)
Time
(s)
10 ±1
Temperature
ramp/immersion
and emersion rate
25mm/s ±6 mm/s
Depth: completely cover the termination
Preheat: 150
℃
,60sec.
Solder: Sn96.5%-Ag3%-Cu0.5%
Solder temperature: 245±5℃
Flux for lead free: Rosin. 9.5%
Depth: completely cover the termination.
Dip time: 4±1sec.
Preheating Dipping Natural cooling
More than 95% of the terminal
Solderability
245° C
electrode should be covered
with solder.
150° C
60
second
4±1
second
Terminal strength
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not
exceed the specification value
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Component mounted on a PCB apply a force
(>0805:1kg <=0805:0.5kg)to the side of a
device being tested. This force shall be applied
for 60 +1 seconds. Also the force shall be
applied gradually as not to shock the
component being tested.
Bending
Appearance：No damage.
Impedance：within±10% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Shall be mounted on a FR4 substrate of the
following dimensions:>=0805:40x100x1.2mm
<0805:40x100x0.8mm
Bending depth:>=0805:1.2mm
<0805:0.8mm
Duration of 10 sec for a min.
Vibration Test
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Oscillation Frequency: 10½2K½10Hz for 20
minutes
Equipment： Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles
each of 3 orientations)。
Test condition:
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Peak
Type
Value
(g’s)
SMD
Lead
1,500
100
Normal
duration
(D) (ms)
0.5
6
Half-sine
Half-sine
Wave form
Velocity
change
(Vi)ft/sec
15.4
12.3
Shock
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TAI-TECH
Item
Performance
TBM01-151200873
Test Condition
P4.
Life test
Appearance: no damage.
Impedance: within±15%of initial value.
Inductance: within±10%of initial value.
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Load Humidity
Appearance: no damage.
Thermal shock
Impedance: within±15%of initial value.
Inductance: within±10%of initial value.
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Temperature: 125±2℃(bead),
85±2℃(inductor)
Applied current: rated current.
Duration: 1000±12hrs.
Measured at room temperature after placing
for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Humidity: 85±2%R.H.
Temperature: 85±2℃.
Duration: 1000hrs Min. with 100% rated
current.
Measured at room temperature after placing
for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Condition for 1 cycle
Step1: -40±2℃
30±5 min.
Step2: 25±2
℃
≦
0.5min
Step3: +105±2℃ 30±5min.
Number of cycles: 500
Measured at room temperature after placing
for 24±2 hrs.
Chip Inductor Only
Test Voltage:100±10%V for 30Sec.
Insulation Resistance
IR>1GΩ
Derating
**
Derating Curve
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85℃, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
Derated Current(A)
6
5
4
3
2
1
0
6A
5A
4A
3A
2A
1.5A
1A
85
125
Environment Temperature+
△
Temperature(°C)
6.Soldering and Mounting
6-1. Recommended PC Board Pattern
Chip Size
Series
FCB
FCM
HCB
GHB
FCI
FHI
FCH
HCI
2012
3216
3225
4516
4532
Land Patterns For
Reflow Soldering
0.30±0.03 0.15±0.05
0.50±0.10 0.25±0.10
0.80±0.15 0.30±0.20
0.85±0.20 0.50±0.30
1.25±0.20 0.50±0.30
1.10±0.20 0.50±0.30
1.30±0.20 0.50±0.30
1.60±0.20 0.50±0.30
1.50±0.20 0.50±0.30
0.80
1.50
2.60
3.00
4.40
4.40
5.70
5.90
0.30
0.40
0.60
1.00
2.20
2.20
2.70
2.57
0.30
0.55
0.80
0.8
FCA3216
2.8
Land
Solder Resist
Type
0603
1005
1608
A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm)
0.6±0.03
1.0±0.10
1.6±0.15
2.0±0.20
2.0±0.20
3.2±0.20
3.2±0.20
4.5±0.20
4.5±0.20
0.30±0.03
0.50±0.10
0.80±0.15
1.25±0.20
1.25±0.20
1.60±0.20
2.50±0.20
1.60±0.20
3.20±0.20
1.00
1.40
3.40
1.40
4.22
2.2-2.6
0.8
Pitch
0.4
L
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
H
G
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TAI-TECH
TBM01-151200873
P5.
6-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
6-2.1 Lead Free Solder re-flow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)
6-2.2 Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering iron must
be employed the following precautions are recommended. for Iron Soldering in Figure 2.
‧Preheat
circuit and products to 150℃
‧350℃
tip temperature (max)
R eflow S oldering
PRE-HEATING
SO LDER IN G
NATUR AL
CO O LING
‧Never
contact the ceramic with the iron tip
‧1.0mm
tip diameter (max)
‧Use
a 20 watt soldering iron with tip diameter of 1.0mm
‧Limit
soldering time to 4~5sec.
Iron Soldering
PRE-HEATING
SOLDERING
NATURAL
COOLING
TP(260
℃
/ 10s m ax.)
TEMPERATURE(° C)
tp(245° C / 20~40s.)
217
200
150
within 4~5s
TEMPERATURE(° C)
350
60~150s
60~180s
480s m ax.
150
Over 60s
TIM E( sec.)
Gradual cooling
TIME(sec.)
25
Reflow times: 3 times max
Fig.1
6-2.3 Solder Volume:
Accordingly increasing the solder volume, the mechanical stress to
product is also increased. Exceeding solder volume may cause the
failure of mechanical or electrical performance. Solder shall be used
not to be exceed as shown in right side:
Minimum fillet height = soldering thickness + 25% product height
Iron Soldering times：1 times max
Fig.2
Upper limit
Recommendable
t
7.Packaging Information
7-1. Reel Dimension
A
Type
13
.5
±0
.
A(mm)
9.0±0.5
13.5±0.5
B(mm)
60±2
60±2
C(mm)
13.5±0.5
13.5±0.5
D(mm)
178±2
178±2
2±0.5
5
D
B
0 .5
R1
5
R0.
C
R1
.9
7”x8mm
7”x12mm
120°
7"x8mm
7"x12mm
7-2.1 Tape Dimension / 8mm
■
Material of taping is paper
P
0
:4±0.1
E:1.75±0.1
.0
-0
.1
+0
5
1.
D:
W:8.0±0.3
t
Size
060303
100505
Bo(mm) Ao(mm) Ko(mm)
0.70±0.06 0.40±0.06
0.45max
P(mm)
2.0±0.05
2.0±0.05
t(mm)
0.45max
0.60±0.03
F:3.5±0.05
B0
1.12±0.03 0.62±0.03 0.60±0.03
P
A0
Ko
P
2
:2±0.1
E:1.75±0.1
P
0
:4±0.1
05
0.
1-
0.
+
56
1.
D:
W:8.0±0.1
t
Size
160808
201209
P
A0
B0
Bo(mm)
1.80±0.05
2.10±0.05
Ao(mm)
0.96+0.05/-0.03
1.30±0.05
Ko(mm)
0.95±0.05
0.95±0.05
P(mm)
4.0±0.10
4.0±0.10
t(mm)
0.95±0.05
0.95±0.05
F:3.5±0.1
Ko
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