Form No:
T0000X-1-0000-TBM01-130900389
Specification for Approval
Date:
2013/9/10
Customer :
東莞台慶
Halogen
Halogen-free
Pb
Pb-free
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
HCB1608KF-600T30
QUANTITY:
pcs
REMARK:
Customer Approval Feedback
西 北 臺 慶 科 技 股 ½ 有 限 公 司
TAI-TECH Advanced Electronics Co., Ltd
■ 西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148 FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
Sales Dep.
APPROVED
CHECKED
□ 東莞臺慶精密電子有限公司
DONGGUAN TAI-TECH ADVANCED ELECTRONICS CO., LTD
JITIGANG MANAGEMENT DISTRICT, HUANGJIANG, DONGGUAN,
GUANGDONG, CHINA
TEL: +86-769-3365488 FAX: +86-769-3366896
E-mail: twnwe@pub.dgnet.gd.cn
管哲頎
Eric Guan
曾詩涵
Angela Tseng
Office:
金亨國際有限公司
KAMHENG INTERNATIONAL LIMITED
TEL: +86-852-25772033
FAX: +86-852-28817778
R&D Center
APPROVED
CHECKED
DRAWN
□ 臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: hui@tai-tech.com.tw
楊祥忠
Mike Yang
羅培君
Peijun Lo
張嘉玲
Alin Chang
Office:
北欣國際有限公司
NORTH STAR INTERNATIONAL LIMITED
TEL: +86-512-57619396
FAX: +86-512-57619688
TA734003
TAI-TECH
TBM01-130900389
P1.
High Current Ferrite Chip Bead(Lead Free)
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
HCB1608KF-600T30
CHECKED
DRAWN
1.0
13/06/06
變更可靠度條件
楊祥忠
羅培君
張嘉玲
備
註
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TAI-TECH
TBM01-130900389
P2.
High Current Ferrite Chip Bead(Lead Free)
1.Features
1. Monolithic inorganic material construction.
2. Closed magnetic circuit avoids crosstalk.
3. Suitable for reflow soldering.
4. Shapes and dimensions follow E.I.A. spec.
5. Available in various sizes.
6. Excellent solder ability and heat resistance.
7. High reliability.
8. 100% Lead(Pb) & Halogen-Free and RoHS compliant
.
9. Low DC resistance structure of electrode to prevent wasteful electric power consumption.
Halogen
Halogen-free
HCB1608KF-600T30
Pb
Pb-free
2.Dimensions
Chip Size
A
B
C
D
Units: mm
1.60±0.15
0.80±0.15
0.80±0.15
0.30±0.20
3.Part Numbering
HCB
A
1608
B
KF
C
-
600
D
T
E
30
F
A: Series
B: Dimension
C: Material
D: Impedance
E: Packaging
F: Rated Current
LxW
Lead Free Material
600=60Ω
T=Taping and Reel, B=Bulk(Bags)
30=3000mA
4.Specification
Tai-Tech
Part Number
HCB1608KF-600T30
Impedance (Ω)
60±25%
Test Frequency
(Hz)
60mV/100M
DC Resistance
(Ω) max.
0.04
Rated Current
(mA) max.
3000
Impedance-Frequency Characteristics
HCB1608KF-600T30
160
IMPEDANCE(Ohm)
120
Z
80
40
X
R
0
1
10
100
1000
FREQUENCY(MHz)
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TAI-TECH
TBM01-130900389
Performance
FCB
FCM
HCB
GHB
FCA
FCI
FHI
FCH
HCI
--
--
P3.
5. Reliability and Test Condition
Item
Series No.
Operating Temperature
Test Condition
-40~+125℃
(Including self-temperature rise)
-40~+125℃
-40~+105℃
(Including self-temperature rise)
-40~+105℃
Transportation
Storage Temperature
Impedance (Z)
Inductance (Ls)
Q Factor
DC Resistance
Rated Current
For long storage conditions, please see the
Application Notice
Agilent4291
Agilent E4991
Agilent4287
Refer to standard electrical characteristics list
Agilent16192
Agilent 4338
DC Power Supply
Over Rated Current requirements, there will be
some risk
Rated Current < 1A
∆T
20
℃
Max
Temperature Rise Test
Rated Current
≧
1A
∆T
40
℃
Max
1. Applied the allowed DC current.
2. Temperature measured by digital surface
thermometer.
Preheat: 150℃,60sec.
Solder: Sn99.5%-Cu0.5%
Solder tamperature: 260±5℃
Flux for lead free: Rosin. 9.5%
Temperature ramp/immersion and immersion
rate: 25±6 mm/s
Dip time: 10±1sec.
Depth: completely cover the termination.
Preheating Dipping Natural cooling
260° C
Resistance to Soldering
Heat
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
150° C
60
second
10±1.0
second
Preheating Dipping Natural cooling
More than 95% of the terminal
Solderability
245° C
electrode should be covered
with solder.
150° C
60
second
4±1
second
Preheat: 150
℃
,60sec.
Solder: Sn99.5%-Cu0.5%
Solder tamperature: 245±5℃
Flux for lead free: Rosin. 9.5%
Depth: completely cover the termination.
Dip time: 4±1sec.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Component mounted on a PCB apply a force
(>0805:1kg <=0805:0.5kg)to the side of a
device being tested. This force shall be applied
for 60 +1 seconds. Also the force shall be
applied gradually as not to shock the
component being tested.
Terminal strength
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not
exceed the specification value
Bending
Appearance：No damage.
Impedance：within±10% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Shall be mounted on a FR4 substrate of the
following dimensions:>=0805:40x100x1.2mm
<0805:40x100x0.8mm
Bending depth:>=0805:1.2mm
<0805:0.8mm
Duration of 10 sec for a min.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Oscillation Frequency: 10∼2K∼10Hz for 20
minutes
Equipment： Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles
each of 3 orientations)。
Vibration Test
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Test condition:
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Peak
Type
Value
(g’s)
SMD
Lead
1,500
100
Normal
duration
(D) (ms)
0.5
6
Half-sine
Half-sine
Wave form
Velocity
change
(Vi)ft/sec
15.4
12.3
Shock
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TAI-TECH
Item
Performance
TBM01-130900389
Test Condition
P4.
Life test
Appearance: no damage.
Impedance: within±15%of initial value.
Inductance: within±10%of initial value.
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Load Humidity
Appearance: no damage.
Thermal shock
Impedance: within±15%of initial value.
Inductance: within±10%of initial value.
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Temperature: 125±2℃(bead),
85±2℃(inductor)
Applied current: rated current.
Duration: 1000±12hrs.
Measured at room temperature after placing
for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Humidity: 85±2%R.H.
Temperature: 85±2℃.
Duration: 1000hrs Min. with 100% rated
current.
Measured at room temperature after placing
for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Condition for 1 cycle
Step1: -40±2℃
30±5 min.
Step2: 25±2
℃
≦
0.5min
Step3: +105±2℃ 30±5min.
Number of cycles: 500
Measured at room temperature after placing
for 24±2 hrs.
Chip Inductor Only
Test Voltage:100±10%V for 30Sec.
Insulation Resistance
IR>1GΩ
Derating
**
Derating Curve
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85℃, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
Derated Current(A)
6
5
4
3
2
1
0
6A
5A
4A
3A
2A
1.5A
1A
85
125
Environment Temperature+
△
Temperature(°C)
6.Soldering and Mounting
6-1. Recommended PC Board Pattern
Chip Size
Series
FCB
FCM
HCB
GHB
FCI
FHI
FCH
HCI
2012
3216
3225
4516
4532
Land Patterns For
Reflow Soldering
0.30±0.03 0.15±0.05
0.50±0.10 0.25±0.10
0.80±0.15 0.30±0.20
0.85±0.20 0.50±0.30
1.25±0.20 0.50±0.30
1.10±0.20 0.50±0.30
1.30±0.20 0.50±0.30
1.60±0.20 0.50±0.30
1.50±0.20 0.50±0.30
0.80
1.50
2.60
3.00
4.40
4.40
5.70
5.90
0.30
0.40
0.60
1.00
2.20
2.20
2.70
2.57
0.30
0.55
0.80
0.8
FCA3216
2.8
Land
Solder Resist
Type
0603
1005
1608
A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm)
0.6±0.03
1.0±0.10
1.6±0.15
2.0±0.20
2.0±0.20
3.2±0.20
3.2±0.20
4.5±0.20
4.5±0.20
0.30±0.03
0.50±0.10
0.80±0.15
1.25±0.20
1.25±0.20
1.60±0.20
2.50±0.20
1.60±0.20
3.20±0.20
1.00
1.40
3.40
1.40
4.22
2.2-2.6
0.8
Pitch
0.4
L
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
H
G
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