Form No:
T0000X-1-0000-TBM01-150600879
Specification for Approval
Date:
2015/6/25
Customer :
深圳台慶
Halogen
Halogen-free
Pb
Pb-free
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
CPI160809UF-Series
pcs
REMARK:
Customer Approval Feedback
西 北 臺 慶 科 技 股 ½ 有 限 公 司
TAI-TECH Advanced Electronics Co., Ltd
■ 西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148 FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
Sales Dep.
APPROVED
CHECKED
□ 東莞臺慶精密電子有限公司
DONGGUAN TAI-TECH ADVANCED ELECTRONICS CO., LTD
JITIGANG MANAGEMENT DISTRICT, HUANGJIANG, DONGGUAN,
GUANGDONG, CHINA
TEL: +86-769-3365488 FAX: +86-769-3366896
E-mail: twnwe@pub.dgnet.gd.cn
管哲頎
Eric Guan
曾詩涵
Angela Tseng
Office:
金亨國際有限公司
KAMHENG INTERNATIONAL LIMITED
TEL: +86-852-25772033
FAX: +86-852-28817778
R&D Center
APPROVED
CHECKED
DRAWN
□ 臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: hui@tai-tech.com.tw
楊祥忠
Mike Yang
詹偉特
Jack Chan
張嘉玲
Alin Chang
Office:
北欣國際有限公司
NORTH STAR INTERNATIONAL LIMITED
TEL: +86-512-57619396
FAX: +86-512-57619688
TA734003
TAI-TECH
TBM01-150600879
P1.
High Current Ferrite Chip Inductor (Lead Free)
CPI160809UF-Series
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
2.0
3.0
13/11/4
初版發行
14/01/24
變更電鍍錫層厚度
3.0um min.=>3.5um min.
楊祥忠
楊祥忠
楊祥忠
羅培君
羅培君
羅培君
張嘉玲
張嘉玲
張嘉玲
14/08/01
變更
Reflow
圖示
備
註
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TAI-TECH
TBM01-150600879
P2.
High Current Ferrite Chip Inductor (Lead Free)
1.Features
11.6x0.8 mm and 0.95 mm in height (very compact size): CAE and fine
printing technology made this compact size possible
2.Stable minimum DC resistance in the class.
3.High speed mounting: Using SMT mounter makes less than a second
mounting possible.
4Excellent mounting strength by SMD chip making.
5Reduced noise over 2/3 of coil inductor by optimal design of CAD
Completely lead-free product and support lead-free solder.
Halogen
Halogen-free
CPI160809UF-Series
Pb
Pb-free
2. Dimensions
Chip Size
Series
160809
A(mm)
1.6±0.15
B(mm)
0.8±0.15
C(mm)
0.95 max.
D(mm)
0.3±0.2
3. Part Numbering
CPI
160809 U
F
D
-
1R0 M
E
F
-
0A7
G
A
B
C
A: Series
B: Dimension
C:
Category Code
D: Material
E: Inductance
F: Inductance Tolerance
G: Rated Current
LxWxH
Lead Free Material
1R0=1.0uH
M=±20%
4.Specification
Tai-Tech
Inductance(uH)
Part Number
CPI160809UF-R33M-0A3
CPI160809UF-R50M-0A9
CPI160809UF-1R0M-0A7
CPI160809UF-2R2M-0A6
●
●
Test Frequency
(MHz)
0.33±20%
0.50±20%
1.0±20%
2.2±20%
1
1
1
1
Rated Current
(mA) max.
350
900
750
650
DCR (Ω)
max.
0.35
0.15
0.20
0.30
typ.
0.27
0.12
0.17
0.27
Rated current: based on temperature rise test
In compliance with EIA 595
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TAI-TECH
TBM01-150600879
Performance
-40~+85℃ (Including self-temperature rise)
--
P3.
5. Reliability and Test Condition
Item
Operating Temperature
Test Condition
Transportation
Storage Temperature
-40~+85℃ (on board)
For long storage conditions, please see the
Application Notice
Agilent4291
Inductance (Ls)
Agilent E4991
Agilent4287
Refer to standard electrical characteristics list
DC Resistance
Rated Current
Rated Current < 1A
∆T
20
℃
Max
Temperature Rise Test
Rated Current
≧
1A
∆T
40
℃
Max
Agilent16192
Agilent 4338
DC Power Supply
Over Rated Current requirements, there will be
some risk
1. Applied the allowed DC current.
2. Temperature measured by digital surface
thermometer.
Preheat: 150℃,60sec.
Solder: Sn99.5%-Cu0.5%
Solder temperature: 260±5℃
Flux for lead free: Rosin. 9.5%
Temperature ramp/immersion and immersion
rate: 25±6 mm/s
Dip time: 10±1sec.
Depth: completely cover the termination.
Preheating Dipping Natural cooling
260° C
Resistance to Soldering
Heat
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：Shall not exceed the specification value.
150° C
60
second
10±1.0
second
More than 95% of the terminal
Solderability
Preheating Dipping Natural cooling
245° C
electrode should be covered with
solder.
150° C
60
second
4±1
second
Preheat: 150
℃
,60sec.
Solder: Sn99.5%-Cu0.5%
Solder temperature: 245±5℃
Flux for lead free: Rosin. 9.5%
Depth: completely cover the termination.
Dip time: 4±1sec.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Component mounted on a PCB apply a force
(>0805:1kg <=0805:0.5kg)to the side of a
device being tested. This force shall be applied
for 60 +1 seconds. Also the force shall be
applied gradually as not to shock the
component being tested.
Shall be mounted on a FR4 substrate of the
following dimensions:>=0805:40x100x1.2mm
<0805:40x100x0.8mm
Bending depth:>=0805:1.2mm
<0805:0.8mm
Duration of 10 sec for a min.
Terminal strength
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not
exceed the specification value.
Bending
Appearance：No damage.
Impedance：within±10% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Vibration Test
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Oscillation Frequency: 10½2K½10Hz for 20
minutes
Equipment： Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles
each of 3 orientations)。
Test condition:
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Peak
Type
Value
(g’s)
SMD
Lead
1,500
100
Normal
duration
(D) (ms)
0.5
6
Half-sine
Half-sine
Wave form
Velocity
change
(Vi)ft/sec
15.4
12.3
Shock
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TAI-TECH
Item
Performance
TBM01-150600879
Test Condition
P4.
Life test
Appearance: no damage.
Impedance: within±15%of initial value.
Inductance: within±10%of initial value.
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Load Humidity
Appearance: no damage.
Thermal shock
Impedance: within±15%of initial value.
Inductance: within±10%of initial value.
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Temperature: 125±2℃(bead),
85±2℃(inductor)
Applied current: rated current.
Duration: 1000±12hrs.
Measured at room temperature after placing
for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Humidity: 85±2%R.H.
Temperature: 85±2℃.
Duration: 1000hrs Min. with 100% rated
current.
Measured at room temperature after placing
for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Condition for 1 cycle
Step1: -40±2℃
30±5 min.
Step2: 25±2
℃
≦
0.5min
Step3: +105±2℃ 30±5min.
Number of cycles: 500
Measured at room temperature after placing
for 24±2 hrs.
Chip Inductor Only
Test Voltage:100±10%V for 30Sec.
Insulation Resistance
IR>1GΩ
6.Soldering and Mounting
6-1. Recommended PC Board Pattern
Chip Size
Serie Type
CPI
160809
Land Patterns For
Reflow Soldering
C(mm)
0.95 max.
A(mm)
1.6±0.15
B(mm)
0.8±0.15
D(mm)
0.3±0.20
L(mm) G(mm) H(mm)
2.60
0.60
0.80
L
G
6-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
6-2.1 Lead Free Solder re-flow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)
H
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
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