Form No:
T0000X-1-0000-TBM01-170800363
Specification for Approval
Date:
2017/8/17
Customer :
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
Halogen
Halogen-free
Pb
Pb-free
盛泰
HCI1005LF-1N5S-MS8
pcs
REMARK:
Customer Approval Feedback
西 北 臺 慶 科 技 股 ½ 有 限 公 司
TAI-TECH Advanced Electronics Co., Ltd
■西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148
FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
Sales Dep.
APPROVED
CHECKED
□Office:
深圳辦公室
11BC,Building B Fortune Plaza,NO.7002, Shennan Avenue, Futian
District Shenzhen
TEL: +86- 755-23972371
FAX: +86-755-23972340
黃農樺
Eddy Huang
黃農樺
Eddy Huang
□臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: sales@tai-tech.cn
R&D Center
APPROVED
CHECKED
DRAWN
□慶邦電子元器件(泗洪)有限公司
TAIPAQ ELECTRONICS (SIHONG) CO., LTD
JIN SHA JIANG ROAD , CONOMIC DEVELOPMENT ZONE SIHONG ,
JIANGSU , CHINA.
TEL: +86-527-88601191 FAX: +86-527-88601190
E-mail: sales@taipaq.cn
楊祥忠
Mike Yang
詹偉特
Jack Chan
張嘉玲
Alin Chang
TA734003
TAI-TECH
TBM01-170800363
P1.
High Frequency Chip Inductor (Lead Free)
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
HCI1005LF-1N5S-MS8
CHECKED
DRAWN
1.0
17/06/27
初版發行
楊祥忠
詹偉特
張嘉玲
備
註
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TAI-TECH
TBM01-170800363
P2.
High Frequency Chip Inductor (Lead Free)
1.Features
1. Monolithic inorganic material construction.
2. Closed magnetic circuit avoids crosstalk.
3. S.M.T. type.
4. Suitable for reflow soldering.
5. Shapes and dimensions follow E.I.A. spec.
6. Available in various sizes.
7. Excellent solder ability and heat resistance.
8. High SRF up to 6GHz and above.
9. 100% Lead(Pb) & Halogen-Free and RoHS compliant
.
Halogen
Halogen-free
HCI1005LF-1N5S-MS8
Pb
Pb-free
2. Dimensions
D
Chip Size
C
A
A
B
1.00±0.15
0.50±0.15
0.50±0.15
0.25±0.10
B
C
D
Units: mm
3. Part Numbering
HCI
A
1005
B
L
C
F
D
-
1N5
E
S
F
-
MS8
G
A: Series
B: Dimension
C: Category Code
D: Material
E: Inductance
F: Inductance Tolerance
G: marking
LxW
Lead Free Material
1N5=1.5 nH
S=±0.3
4.Specification
Tai-Tech
Part Number
HCI1005LF-1N5S-MS8
●
●
Inductance
(nH)
1.5±0.3
Test
Frequency
(Hz)
100M / 50mV
Q
min.
7
Rated Current
(mA) max
300
DCR (Ω)
max.
0.10
SRF (MHz)
min.
6000
Rated current: based on temperature rise test
In compliance with EIA 595
10000
HCI1005LF Z vs Freq.
1000
HCI1005LF L vs Freq.
120n
100
HCI1005LF Q vs Freq.
2.7n
6.8n
IMPEDANCE(Ohm)
1000
100
10
120n
47n
22n
10n
INDUCTANCE(nH)
100
47n
22n
10n
6.8n
2.7n
Q
10
10n
22n
47n
120n
10
1
0.1
1
10
6.8n
2.7n
1
1000
10000
1
FREQUENCY(MHz)
100
1
10
FREQUENCY(MHz)
100
1000
10000
1
10
FREQUENCY(MHz)
100
1000
10000
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TAI-TECH
TBM01-170800363
Performance
HCI
--
--
P3.
5. Reliability and Test Condition
Item
Series No.
Operating Temperature
Test Condition
-40~+105℃
(Including self-temperature rise)
-40~+105℃
(on board)
Transportation
Storage Temperature
For long storage conditions, please see the
Application Notice
Agilent4291
Agilent E4991
Inductance (Ls)
Q Factor
Agilent4287
Refer to standard electrical characteristics list
DC Resistance
Rated Current
Agilent16192
Agilent 4338
DC Power Supply
Over Rated Current requirements, there will be
some risk
Temperature Rise Test
Rated Current < 1A
Rated Current
≧
1A
ΔT
20℃Max
ΔT
40℃Max
1. Applied the allowed DC current.
2. Temperature measured by digital surface
thermometer.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Temperature: 105±2℃
Applied current: rated current.
Duration: 1000±12hrs.
Measured at room temperature after placing
for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Humidity: 85±2%R.H.
Temperature: 85±2℃.
Duration: 1000hrs Min. with 100% rated
current.
Measured at room temperature after placing
for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Condition for 1 cycle
Step1: -40±2℃
30±5 min.
Step2: 25±2℃
≦0.5min
Step3: +105±2℃ 30±5min.
Number of cycles: 500
Measured at room temperature after placing
for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Oscillation Frequency: 10½ 2K½ 10Hz for 20
minutes
Equipment： Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles
each of 3 orientations)。
Shall be mounted on a FR4 substrate of the
following dimensions:
>=0805inch(2012mm):40x100x1.2mm
<0805inch(2012mm):40x100x0.8mm
Bending depth:
>=0805inch(2012mm):1.2mm
<0805inch(2012mm):0.8mm
Duration of 10 sec for a min.
Life test
Appearance: no damage.
Impedance: within±15%of initial value.
Inductance: within±10%of initial value.
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Load Humidity
Appearance: no damage.
Thermal shock
Impedance: within±15%of initial value.
Inductance: within±10%of initial value.
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Vibration
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Bending
Appearance：No damage.
Impedance：within±10% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Test condition:
Appearance：No damage.
Impedance：within±10% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Peak
Type
Value
(g’s)
SMD
Lead
50
50
Normal
duration
(D) (ms)
11
11
Half-sine
Half-sine
Wave form
Velocity
change
(Vi)ft/sec
11.3
11.3
Shock
Insulation Resistance
IR>1GΩ
Chip Inductor Only
Test Voltage:100±10%V for 30Sec.
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TAI-TECH
Item
Performance
TBM01-170800363
Test Condition
Preheat: 150℃,60sec.
Solder: Sn96.5%-Ag3%-Cu0.5%
Solder temperature: 245±5℃
Flux for lead free: Rosin. 9.5%
Depth: completely cover the termination.
Dip time: 4±1sec.
Number of heat cycles: 1
P4.
Solderability
More than 95% of the terminal electrode should be covered with solder.
Resistance to Soldering
Heat
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Temperature
(°C)
260 ±5
(solder temp)
Time
(s)
10 ±1
Temperature
ramp/immersion
and emersion rate
25mm/s ±6 mm/s
Depth: completely cover the termination
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Component mounted on a PCB apply a force
>0805inch(2012mm):1kg
<=0805inch(2012mm):0.5kg
to the side of a device being tested. This force
shall be applied for 60 +1 seconds. Also the
force shall be applied gradually as not to shock
the component being tested.
Terminal strength
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC： within ±15% of initial value and shall
not
exceed the specification value
6.Soldering and Mounting
6-1. Recommended PC Board Pattern
Chip Size
Series
HCI
Land Patterns For
Reflow Soldering
0.50±0.15 0.25±0.10
0.50
0.40
0.60
Type
1005
A(mm) B(mm) C(mm) D(mm) E(mm) F(mm) G(mm)
1.00±0.15
0.50±0.15
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
6-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
6-2.1 Lead Free Solder re-flow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)
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