Form No:
T0000X-1-0000-TBM01-170300076
Specification for Approval
Date:
2017/3/2
Customer :
友仁達
Halogen
Halogen-free
Pb
Pb-free
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
FCM0603-Series
pcs
REMARK:
Customer Approval Feedback
西 北 臺 慶 科 技 股 ½ 有 限 公 司
TAI-TECH Advanced Electronics Co., Ltd
□ 西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148 FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
Sales Dep.
APPROVED
CHECKED
□
Office:
深圳辦公室
11BC,BUILDING B FORTUNE PLAZA,NO.7002, SHENNAN AVENUE,
FUTIAN DISTRICT SHENZHEN
TEL: +86- 755-23972371 FAX: +86-755-23972340
詹字鈞
Elven Chan
鍾明君
Mandy Chung
■ 臺慶精密電子(昆山)有限公司
TAI-TECHADVANCED ELECTRONICS(KUNSHAN) CO., LTD
No.925,GUOSHI ROAD, KUNJIA HI-TECH INDUSTRIAL PARK,
KUN-SHAN, JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: sales@tai-tech.cn
R&D Center
APPROVED
CHECKED
DRAWN
Office:
北欣國際有限公司
NORTH STAR INTERNATIONAL LIMITED
TEL: +86-512-57619396
FAX: +86-512-57619688
楊祥忠
Mike Yang
詹偉特
Jack Chan
張嘉玲
Alin Chang
□ 慶邦電子元器件(泗洪)有限公司
TAIPAQ ELECTRONICS (SIHONG) CO., LTD
Sihong development zone Suqian City, Jiangsu , CHINA.
TEL: +86-527-88601191 FAX: +86-527-88601190
E-mail: sales@taipaq.cn
TA734003
TAI-TECH
TBM01-170300076
P1.
Ferrite Chip Bead(Lead Free)
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
FCM0603-Series
DRAWN
1.0
2.0
3.0
4.0
5.0
13/06/06
變更可靠度條件
14/01/24
變更電鍍錫層厚度
3.0um min.=>3.5um min.
楊祥忠
楊祥忠
楊祥忠
楊祥忠
楊祥忠
羅培君
羅培君
羅培君
詹偉特
詹偉特
張嘉玲
張嘉玲
張嘉玲
張嘉玲
張嘉玲
14/08/01
變更
Reflow
圖示
16/01/26
增訂可靠度
Thermal shock:
(Bead) Step3：125±2℃ 30±5min
17/02/16
修訂
Recommended PC Board Pattern
備
註
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TAI-TECH
TBM01-170300076
P2.
Ferrite Chip Bead(Lead Free)
1.Features
1. Monolithic inorganic material construction.
2. Closed magnetic circuit avoids crosstalk.
3. S.M.T. type.
4. Suitable for reflow soldering.
5. Shapes and dimensions follow E.I.A. spec.
6. Available in various sizes.
7. Excellent solder ability and heat resistance.
8. High reliability.
9. 100% Lead(Pb) & Halogen-Free and RoHS compliant
.
Halogen
Halogen-free
FCM0603-Series
Pb
Pb-free
2.Dimensions
Chip Size
A
B
C
D
Units: mm
0.60±0.03
0.30±0.03
0.30±0.03
0.15±0.05
3.Part Numbering
FCM
0603
HF
C
-
121
D
T
E
02
F
A
B
A: Series
B: Dimension
C: Material
D: Impedance
E: Packaging
F: Rated Current
LxW
Lead Free Material
121=120Ω
T=Taping and Reel, B=Bulk(Bags)
02=200mA
4.Specification
Tai-Tech
Part Number
FCM0603WF-220T05
FCM0603WF-330T05
FCM0603WF-800T02
FCM0603WF-121T02
FCM0603WF-241T02
FCM0603WF-601T01
FCM0603KF-102T02
FCM0603HF-600T02
FCM0603HF-121T02
FCM0603HF-241T02
FCM0603HF-471T01
FCM0603HF-601T01
FCM0603BF-100T02
FCM0603BF-220T02
FCM0603BF-330T01
FCM0603BF-470T01
FCM0603BF-560T01
FCM0603BF-800T01
FCM0603BF-121T01
●
●
Impedance (Ω)
22±25%
33±25%
80±25%
120±25%
240±25%
600±25%
1000±25%
60±25%
120±25%
240±25%
470±25%
600±25%
10±25%
22±25%
33±25%
47±25%
56±25%
80±25%
120±25%
Test Frequency
(Hz)
60mV/100M
60mV/100M
60mV/100M
60mV/100M
60mV/100M
60mV/100M
60mV/100M
60mV/100M
60mV/100M
60mV/100M
60mV/100M
60mV/100M
60mV/100M
60mV/100M
60mV/100M
60mV/100M
60mV/100M
60mV/100M
60mV/100M
DC Resistance
(Ω) max.
0.065
0.07
0.40
0.45
0.65
1.20
1.15
0.25
0.40
0.80
1.05
1.20
0.25
0.45
0.55
0.70
1.00
1.30
1.50
Rated Current
(mA) max.
500
500
200
200
200
150
220
200
200
200
100
100
200
200
150
150
100
100
100
Rated current: based on temperature rise test
In compliance with EIA 595
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TAI-TECH
TBM01-170300076
Performance
FCB
FCM
HCB
GHB
FCA
--
--
P3.
5. Reliability and Test Condition
Item
Series No.
Operating Temperature
Test Condition
-40~+125℃
(Including self-temperature rise)
-40~+125℃
(on board)
Transportation
Storage Temperature
For long storage conditions, please see the
Application Notice
Agilent4291
Impedance (Z)
Agilent E4991
Agilent4287
Refer to standard electrical characteristics list
DC Resistance
Rated Current
Agilent16192
Agilent 4338
DC Power Supply
Over Rated Current requirements, there will be
some risk
Rated Current < 1A ΔT 20℃Max
Temperature Rise Test
Rated Current
≧
1A ΔT 40℃Max
1. Applied the allowed DC current.
2. Temperature measured by digital surface
thermometer.
Number of heat cycles: 1
Temperature
(°C)
260 ±5
(solder temp)
Time
(s)
10 ±1
Temperature
ramp/immersion
and emersion rate
25mm/s ±6 mm/s
Resistance to Soldering
Heat
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Depth: completely cover the termination
Preheat: 150℃,60sec.
Solder: Sn96.5%-Ag3%-Cu0.5%
Solder temperature: 245±5℃
Flux for lead free: Rosin. 9.5%
Depth: completely cover the termination.
Dip time: 4±1sec.
Preheating Dipping Natural cooling
More than 95% of the terminal
Solderability
245
C
electrode should be covered
with solder.
150
C
60
second
4
∮
1
second
Terminal strength
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not
exceed the specification value
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Component mounted on a PCB apply a force
>0805inch(2012mm):1kg
<=0805inch(2012mm):0.5kg
to the side of a device being tested. This force
shall be applied for 60 +1 seconds. Also the
force shall be applied gradually as not to shock
the component being tested.
Bending
Appearance：No damage.
Impedance：within±10% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Shall be mounted on a FR4 substrate of the
following dimensions:
>=0805inch(2012mm):40x100x1.2mm
<0805inch(2012mm):40x100x0.8mm
Bending depth:
>=0805inch(2012mm):1.2mm
<0805inch(2012mm):0.8mm
Duration of 10 sec for a min
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Oscillation Frequency: 10
½
2K
½
10Hz for 20
minutes
Equipment： Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles
each of 3 orientations)。
Vibration Test
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Test condition:
Appearance：No damage.
Impedance：within±10% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Peak
Type
Value
(g’s)
SMD
Lead
50
50
Normal
duration
(D) (ms)
11
11
Half-sine
Half-sine
Wave form
Velocity
change
(Vi)ft/sec
11.3
11.3
Shock
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TAI-TECH
Item
Performance
TBM01-170300076
Test Condition
P4.
Life test
Appearance: no damage.
Impedance: within±15%of initial value.
Inductance: within±10%of initial value.
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Load Humidity
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Temperature: 125±2℃(Bead)
Applied current: rated current.
Duration: 1000±12hrs.
Measured at room temperature after placing
for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Humidity: 85±2%R.H.
Temperature: 85±2℃.
Duration: 1000hrs Min. with 100% rated
current.
Measured at room temperature after placing
for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Condition for 1 cycle
Step1: -40±2℃
30±5 min.
Step2: 25±2℃
≦0.5min
Step3: +125±2℃
30±5min. (Bead)
Number of cycles: 500
Measured at room temperature after placing
for 24±2 hrs.
Chip Inductor Only
Test Voltage:100±10%V for 30Sec.
Appearance: no damage.
Thermal shock
Impedance: within±15%of initial value.
Inductance: within±10%of initial value.
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Insulation Resistance
IR>1GΩ
Derating
**
Derating Curve
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85℃, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
Derated Current(A)
6
5
4
3
2
1
0
6A
5A
4A
3A
2A
1.5A
1A
6.Soldering and Mounting
6-1. Recommended PC Board Pattern
Chip Size
Series
FCB
FCM
HCB
GHB
FCI
FHI
FCH
HCI
3225
4516
4532
3.2±0.20
4.5±0.20
4.5±0.20
2.50±0.20
1.60±0.20
3.20±0.20
1.30±0.20 0.50±0.30
1.60±0.20 0.50±0.30
1.50±0.20 0.50±0.30
1.05
1.05
1.05
2.20
3.30
3.30
2.70
1.80
3.40
2012
3216
85
125
Environment Temperature+
〉
Temperature(
C)
Land Patterns For
Reflow Soldering
0.30±0.03 0.15±0.05
0.50±0.10 0.25±0.10
0.80±0.15 0.30±0.20
0.85±0.20 0.50±0.30
1.25±0.20 0.50±0.30
1.10±0.20 0.50±0.30
1.05
2.20
1.80
0.35
0.50
0.80
1.05
0.30
0.40
0.85
1.00
0.40
0.60
0.95
0.8
Type
0603
1005
1608
A(mm) B(mm) C(mm) D(mm) E(mm) F(mm) G(mm)
0.6±0.03
1.0±0.10
1.6±0.15
2.0±0.20
2.0±0.20
3.2±0.20
0.30±0.03
0.50±0.10
0.80±0.15
1.25±0.20
1.25±0.20
1.60±0.20
FCA3216
2.8
Land
Solder Resist
1.45
2.2-2.6
0.8
Pitch
0.4
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
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