Form No:
XXXXXX-1-0000-TBM02-141100059
Specification for Approval
Date:
2014/11/04
Customer :
東莞台慶
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
WCM3225F2SF-102T15
pcs
REMARK:
Customer Approval Feedback
西 北 臺 慶 科 技 股 ½ 有 限 公 司
TAI-TECH Advanced Electronics Co., Ltd
■ 西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148 FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
Sales Dep.
APPROVED
CHECKED
□ 東莞臺慶精密電子有限公司
DONGGUAN TAI-TECH ADVANCED ELECTRONICS CO., LTD
JITIGANG MANAGEMENT DISTRICT, HUANGJIANG, DONGGUAN,
GUANGDONG, CHINA
TEL: +86-769-3365488 FAX: +86-769-3366896
E-mail: twnwe@pub.dgnet.gd.cn
管哲頎
Eric Kuan
魏½娟
Donna Wei
Office:
金亨國際有限公司
KAMHENG INTERNATIONAL LIMITED
TEL: +86-852-25772033
FAX: +86-852-28817778
R&D Center
APPROVED
CHECKED
DRAWN
□ 臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: hui@tai-tech.com.tw
楊祥忠
Mikey Yang
林志鴻
Zhi-Hong Lin
林宜蕰
Beryl Lin
Office:
北欣國際有限公司
NORTH STAR INTERNATIONAL LIMITED
TEL: +86-512-57619396
FAX: +86-512-57619688
TA734003
TAI-TECH
P1
Wire Wound Type Common Mode Filter
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
WCM3225F2SF-102T15
CHECKED
DRAWN
1.0
14/11/04
新發行
楊祥忠
林志鴻
林宜蕰
備
註
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TAI-TECH
P2
Wire Wound Type Common Mode Filter
1. Features
1. High common mode impedance at high frequency cause excellent noise
suppression performance.
2.
WCM3225F2SF
series realizes small size and low profile.
3.2x2.5x2.2 mm.
3. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
WCM3225F2SF-102T15
Halogen
Halogen-free
Pb
Pb-free
2. Dimension
A
Recommended PC Board Pattern
C
1
2
E
B
4
3
G2
H
G1
L
D
PC board should be designed so that products can prevent
damage from mechanical stress when warping the board.
Products shall be positioned in the sideway direction against the
mechanical stress to prevent failure.
C(mm)
2.2±0.2
D1(mm)
0.8±0.1
D2(mm)
0.9±0.1
L(mm)
4.4
H(mm)
3.5
G1(mm)
1.6
G2(mm)
0.6
Series
3225F2SF
Units: mm
A(mm)
3.2±0.2
3. Part Numbering
WCM 3225
A
A: Series
B: Dimension
C: Material
D: Number of Lines
E: Type
F: Lead free type
G: Impedance
H: Packaging
I: Rated Current
102=1000Ω
T=Taping and Reel
15=1500mA
Ferrite Core
2=2 lines
S=Shielded , N=Unshielded
B
F
C
D
B(mm)
2.5±0.2
2
D
S
E
F
F
-
102
G
T
H
15
I
4. Specification
TAI-TECH
Part Number
WCM3225F2SF-102T15
DC
Withstand
Common mode
IR
Impedance Test Frequency Resistance Rated Current Rated Volt. Volt. (Vdc)
(Vdc)max.
(Ω) min.
(mA)max.
(MHz)
max.
(Ω)
(Ω) max.
1000±25%
100
0.30
1500
50
125
10M
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TAI-TECH
WCM3225F2SF-102
P3
10000
1000
Common Mode
IMPEDANCE(Ohm)
100
10
1
Normal Mode
0.1
1
10
100
1000
10000
FREQUENCY(MHz)
5.Schematic Diagram
6. Materials
No.
a.
b.
c
d
Description
Upper plate
Core
Termination
Wire
Ferrite
Specification
Ferrite Core
Tin (Pb Free)
Enameled Copper Wire
7. Reliability and Test Condition
Item
Performance
Test Condition
Electrical Characteristics Test
Z(common mode)
DCR
I.R.
Operating Temperature
Agilent-4291A+ Agilent -16197A
Refer to standard electrical characteristics list.
Agilent-4338B
Agilent4339
-40℃~+125℃
Storage Temperature(on board)
1.Applied the allowed DC current.
2.Temperature measured by digital surface thermometer
Temperature Rise Test
Rated Current < 1A
ΔT
20℃Max
Rated Current
≧
1A
ΔT
40℃Max
Mechanical Performance Test
Preheat: 150℃,60sec.。
Solder: Sn99.5%-Cu0. 5%。
Temperature: 245±5℃。
Flux for lead free: Rosin. 9.5%。
Dip time: 4±1sec。
Depth: completely cover the termination
Solderability Test
More than 95% of terminal electrode should be covered with solder.
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TAI-TECH
P4
Item
Performance
Test Condition
Temperature
(°C)
260 ±5
(solder temp)
Time
(s)
Temperature
ramp/immersion
and
emersion
rate
25mm/s ±6 mm/s
Number
of heat
cycles
1
Solder Heat Resistance
10 ±1
Depth: completely cover the termination
Appearance：No damage.
Impedance：within±15% of initial value
RDC：within ±15% of initial value and shall not exceed the specification value
Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
With the component mounted on a PCB with the device to be tested,
apply a force (>0805:1kg , <=0805:0.5kg)to the side of a device
being tested. This force shall be applied for 60 +1 seconds. Also the
force shall be applied gradually as not to apply a shock to the
component being tested.
Terminal Strength
Reliability Test
Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Life Test
Temperature： 85±2℃
Applied current：rated current
Duration：1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Step1：-40±2℃ 30±5min
Step2：25±2℃
≦0.5min
Step3：105±2℃ 30±5min
Number of cycles： 500
Measured at room temperature after placing for 24±2 hrs
Thermal shock
Appearance：No damage.
Impedance：within±15% of initial value
RDC：within ±15% of initial value and shall not exceed the specification value
Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Humidity Resistance Test
Humidity：85±2﹪R.H,
Temperature：85℃±2℃
Duration：1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Oscillation Frequency: 10½2K½10Hz for 20 minutes
Equipment： Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
Vibration Test
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