SPD82581B
SPD82581B
1-Line, 600W, TVS
http//:www.sh-willsemi.com
Descriptions
SPD82581B protect sensitive electronics against
voltage transients induced by inductive load switching
and lightning. Ideal for the protection of I/O interfaces,
V
CC
bus and other integrated circuits.
Features
For surface mount application
Excellent clamping capability
Low profile package
Fast response time: Typically less than
1.0ps from 0V to 64.4V
Low inductance
GPP
Pin1
SMB
Pin2
Schematic Diagram
Mechanical Data
Case: Molded plastic
Mounting position: Any
Weight: 0.093 grams
PIN1
YYWW
NG
YY = Year Code
WW = Week Code
NG = Device Code
Marking (Top View)
PIN2
Order information
Device
SPD82581B-2/TR
Dim (mm)
5.3*3.5*2.3
Shipping
3000/Tape&Reel
Will Semiconductor Ltd.
1
Revision 1.2, 2017/09/18
SPD82581B
Absolute maximum ratings
Rating
Peak Pulse Power on 10/1000µs waveform
Peak Pulse Current of on 10/1000µs waveform
Peak Forward Surge Current , 8.3ms Single Half Sine-wave Superimposed on
Rated Load,(JEDEC Method)
Junction Temperature
Operating Temperature
Storage Temperature Range
Symbol
P
PPM
I
PPM
I
FSM
T
J
T
OP
T
STG
Value
600
6.4
100
-55
~
150
-40
~
125
-55
~
150
Units
W
A
A
℃
℃
℃
Notes:
1. Mounted on 5.0mm2 (0.03mm thick) Copper Pads to each terminal
Electrical characteristics
(T
A
=25
o
C, unless otherwise noted)
Reverse
Stand off
Part Number
Voltage
V
R
(V)
SPD82581B
58
MIN
64.4
MAX
74.1
Breakdown Voltage
V
BR
@ I
T
(V)
Test
Current
I
T
(mA)
1
Maximum
Clamping
Voltage V
C
@I
PP
(V)
93.6
Maximum
Peak Pulse
Current
I
PP
(A)
(A)
6.4
Maximum
Reverse
Leakage
I
R
@ V
R
(μA)
1
Typical characteristics
(T
A
=25
o
C, unless otherwise noted)
100
Non-repetitive pulse waveform
100
P
PPM
– Peak Pulse Power – (kW)
10/1000µs
75
% Of Rated Power
10
50
1
25
0.1
0.1µs
1µs
10µs
100µs
1ms
10ms
td - Pulse Width (sec.)
0
0
25
50
75
100
125
T
A
– Ambient Temperature (
℃
)
150
Fig. 1 Peak Pulse Power
Will Semiconductor Ltd.
2
Fig. 2 Pulse Derating Curve
Revision 1.2, 2017/09/18
SPD82581B
Package outline dimensions (Unit: mm)
SMB
Symbol
A
B
C
D
E
F
G
H
I
Dimensions in millimeter
Min.
4.06
3.30
1.95
5.08
0.13
0.76
0.20 Max.
2.10
1.78
2.30
2.00
2.50
2.20
Typ.
Max.
4.57
3.94
2.62
5.59
0.31
1.52
Recommended land pattern (Unit: mm)
Notes:
This recommended land pattern is for reference
purposes only. Please consult your manufacturing
group to ensure your PCB design guidelines are met.
Will Semiconductor Ltd.
3
Revision 1.2, 2017/09/18
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