GLZ2.0 SERIES
SURFACE MOUNT ZENER DIODES
VOLTAGE
2.0 to 56 Volt
POWER
500 mWatt
FEATURES
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2.0
0.063(1.6)
0.055(1.4)D IA .
0.020(0.5)
0.012(0.3)
0.146(3.7)
0.130(3.3)
0.020(0.5)
0.012(0.3)
MECHANICAL DATA
• Case: Molded Glass MINI-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 0.001 ounces, 0.03 grams.
• Polarity : Color band denotes cathode end
• Packing information
T/R - 2.5K per 7" plastic Reel
T/R - 10K per 13" plastic Reel
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter
Power Dissipation at T
A
= 25
O
C
Junction Temperature Range
Storage Temperature Range
Symbol
Value
500
-55 to + 175
-65 to + 175
Units
mW
O
P
TOT
T
J
T
STG
C
C
O
Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.
Parameter
Thermal Resistance Junction to Ambient Air
Forward Voltage at I
F
= 100mA
Symbol
Min.
--
--
Typ.
Max.
0.3
1
o
Units
C/mW
V
R
Θ
JA
V
F
--
--
Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.
October 2,2017-REV.06
PAGE . 1
GLZ2.0 SERIES
RATING AND CHARACTERISTIC CURVES
POWER DISSIPATION, mWatts
500
400
300
200
100
0
50
100
150
200
O
250
AMBIENT TEMPERATURE, C
FIG. 1 POWER DERATING CURVE
Vz (V)
Iz (mA)
50
40
30
20
10
0
5
10
15
20
25
30
Test Current
Iz = 20mA
24
20
15
12
11
9.1
6.8
6.2
5.6
5.1
4.7
4.3
3.9
October 2,2017-REV.06
2.7
Fig.2 BREAKDOWN CHARACTERISTICS
PAGE . 4
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