MKESD0402MS05
1.
1 Channel Ultra-low Capacitance ESD Protection
2.
0402
Datasheet
Features
Ultra-Low capacitance:0.05pF(typ.)
Low leakage current(<10nA)
Fast response time(<1ns)
Bi-directional,single line protection
IEC 61000-4-2 (ESD Air): 15kV
IEC 61000-4-2 (ESD Contact): 8kV
Pin Description
3.
Applications
USB 3.0/3.1
HDMI 1.3/1.4/2.0
RF Antenna
SATA and eSATA Interface
4.
Schematic Diagram
5.
Order Information
Type
MKESD0402MS05
Package
0402
Size (mm)
1.00x0.52x0.38
Delivery Form
7” T&R
Delivery Quantity
10,000
6.
Limiting Values(T
A
= 25 °C, unless otherwise specified)
Symbol
V
ESD
T
A
T
stg
Parameter
Electrostatic Discharge Voltage
Operating Temperature Range
Storage Temperature Range
Conditions
IEC 61000-4-2; Contact Discharge
IEC 61000-4-2; Air Discharge
-
-
Min
-
-
-55
-40
Max
8
15
125
85
Unit
kV
kV
℃
℃
7.
Electrical Characteristics(T
A
= 25 °C unless otherwise specified)
Symbol
V
DC
V
T
V
C
I
L
C
J
Parameter
Continuous Operating Voltage
Trigger Voltage
Clamping Voltage
Leakage Current
Capacitance
discharge
IEC61000-4-2 8kV contact
discharge
DC 5V shall be applied
on component
Measured at 10MHz
Conditions
-
IEC61000-4-2 8kV contact
Min
-
-
-
-
-
Typ.
-
450
40
-
0.05
Max
5.0
-
-
10
-
Unit
V
V
V
nA
pF
Product Datasheet
1
www.mkfounder.com
08-Mar-2018
© mkfounder Co., LTD. All right reserved
Reversion:0.1
MKESD0402MS05
8.
1 Channel Ultra-low Capacitance ESD Protection
0402
Datasheet
Typical Characteristics
Time (ns)
Fig.1 Typical ESD Response
（IEC
61000-4-2, 8kV contact discharge）
Fig.2 Typical Device Capacitance VS. Frequency
Fig.3 HDMI 2.0 Mask at 6.0 Gbps
Product Datasheet
2
www.mkfounder.com
08-Mar-2018
© mkfounder Co., LTD. All right reserved
Reversion:0.1
MKESD0402MS05
9.
1 Channel Ultra-low Capacitance ESD Protection
0402
Datasheet
ESD Protection for Signal Line
The MKESD is designed for the protection of one bidirectional data line from ESD damage.
Place the MKESD as close to the input terminal or connector as possible.
Minimize the path length between the MKESD and the protected signal line.
Use ground planes whenever possible.
MKSD0402MS05
Product Datasheet
3
www.mkfounder.com
08-Mar-2018
© mkfounder Co., LTD. All right reserved
Reversion:0.1
MKESD0402MS05
10.
1 Channel Ultra-low Capacitance ESD Protection
0402
Datasheet
Package Dimension
Recommended Solder Pad Footprint
*Sizes in mm
Notes：
This solder pad layout is for reference purposes only.
Dimension
L
W
p
H
Unit: Millimeters
Min.
0.90
0.42
0.15
0.25
Max.
1.10
0.62
0.35
0.45
Product Datasheet
4
www.mkfounder.com
08-Mar-2018
© mkfounder Co., LTD. All right reserved
Reversion:0.1
MKESD0402MS05
11.
1 Channel Ultra-low Capacitance ESD Protection
0402
Datasheet
Soldering Parameters
FIG.5:
Reflow condition
T
P
Ramp-up
T
L
tp
Critical Zone
T
L
to T
P
t
L
Ramp-down
Preheat
Temperature
T
S(max)
T
S(min)
t
s
time to peak temperatue
(t 25℃ to peak)
25
Time
Reflow Condition
-Temperature Min (T
s(min)
)
Pre-heat
-Temperature Max(T
s(max)
)
-Time (Min to Max) (ts)
Average ramp up rate (Liquid us Temp (T
L
) to peak)
T
s(max)
to T
L
- Ramp-up Rate
Reflow
-Temperature(T
L
)(Liquid us)
-Temperature(t
L
)
Pb-Free Assembly
+150°C
+200°C
60-180 secs.
3°C/sec. Max
3°C/sec. Max
+217°C
60-150 secs.
+260(+0/-5)°C
30 secs. Max
6°C/sec. Max
8 min. Max
+260°C
Peak Temp (T
p
)
Time within 5°C of actual Peak Temp (t
p
)
Ramp-down Rate
xTime 25°C to Peak Temp (T
P
)
Do not exceed
Product Datasheet
5
www.mkfounder.com
08-Mar-2018
© mkfounder Co., LTD. All right reserved
Reversion:0.1
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