1. Scope
This specification applies to the MPIT series of SMD power inductors.
2. Product Identification
MPIT
①
5040 –
②
100
③
M
④
- LF
⑤
①
Series name
②
Product dimensions
③
Inductance Value： (6R3:6.3uH 100: 10uH; 101:100uH)
④
Inductance Tolerance：(K:10% ; M:20% ; N:30%)
⑤
Lead free products
3. Construction
3.1 Shape and dimensions
100
Model
MPIT5040
A
5.0±0.3
Dimensions in mm
B
C
5.0±0.3
4.0 Max.
D
1.4 ref.
E
3.7 ref.
F
4.2 ref.
3.2 Material List
No.
1
2
3
4
Item
DR Core
Wire
Solder
Epoxy
Material
Ferrite
Enameled Copper Wire
Sn99.7-Cu0.3
Epoxy Adhesive
1
4.Testing Conditions
Unless otherwise specified
Temperature : Ordinary Temperature
( 5 to 35℃)
Humidity : Ordinary Humidity
(25 to 85% RH)
Atmospheric Pressure : 86 to 106 kPa
In case of doubt
Temperature : 20±2℃
Humidity
: 60 to 75% RH
Atmospheric Pressure : 86 to 106 kPa
5. Electrical Characteristics And Test Instruments
Operating temperature:-40~85℃
Storage temperature and Humidity Range: -40~125℃ & 30% to 70%
Part No.
MPIT5040-1R0N-LF
MPIT5040-1R5N-LF
MPIT5040-2R2N-LF
MPIT5040-3R3N-LF
MPIT5040-4R7M-LF
MPIT5040-5R6M-LF
MPIT5040-6R8M-LF
MPIT5040-100M-LF
MPIT5040-150M-LF
MPIT5040-220M-LF
MPIT5040-330M-LF
MPIT5040-470M-LF
MPIT5040-680M-LF
MPIT5040-101M-LF
MPIT5040-221M-LF
1.
2.
L,IDC: LCR Meter HP4263A, CH3302+1310 ,or equivalent
RDC:CH3302,or equivalent.
Customer Part No.
Inductance
(uH)
1.0±30%
1.5±30%
2.2±30%
3.3±30%
4.7±20%
5.6±20%
6.8±20%
10±20%
15±20%
22±20%
33±20%
47±20%
68±20%
100±20%
220±20%
DCR
(mΩ)max
13
15
19
24
30
33
49
64
86
129
188
270
400
560
1030
Isat
(A) max
7.35
6.30
4.90
3.95
3.50
3.2
3.0
2.85
2.5
1.8
1.5
1.25
0.96
0.82
0.55
Irms
(A) max
4.9
4.2
3.7
3.4
3.0
2.5
2.3
2.1
2.0
1.4
1.2
1.0
0.77
0.66
0.45
3. Isat: DC current (A) that will cause L0 to drop 30% Max.
4. Irms: DC current (A) that will cause an approximate
ΔT:
40℃.Max
5．Operating temperature range from -25℃ to 85℃
2
6. Reliability and Test Condition
Item
Specifications
Test Method/Condition
Operating
temperature range
–25℃ ~ +85℃
Including tempeature rise due to
self-generated heat
Terminal
strength-pull test
Terminal shall not be loosened
or ruptured
A 5N. load shall be applied to both
terminals in the axis direction for 60 sec.
Solderability test
The terminal shall be at least
90% covered with solder.
After fluxing, Inductor shall be dipped in
a melted solder bath at 230±5
℃
for 5
seconds.
Resistance to
solvent test
There shall be no case
deformation change
in appearance obliteration of
marking.
MIL-STD-105E
Ⅱ
Vibration test (low
frequency)
Shock test
Resistance to
soldering heat
1.Inductors shall be no
evidence of
electrical and mechanical
damage.
2.Inductance shall not chance
more
than=5%.
3.Q shall not change more
than=20%
1.Amplitude:1.5mm.
2.Frequency:10~55~10Hz/min.
3.Direction:X.Y.Z.
4.Duration:2 hrs/X.Y.Z.
Inductors shall be dropped 10from a
height of 1m
onto 3cm wooden board.
Temp:260±5℃,Time:10±1sec
High temperature
load life test
There shall be no evidence of
Short or open circuiting.
Humidity load life
1. temp:85±2℃.
2. time: 1000±12 hours.
3. load: allowed DC current.
1. temp: 40±2℃.
2. R.H: 90-95%.
3. time: 1000±12 hours.
4. load: allowed DC current.
3
Item
Required Characteristics
Test Method/Condition
Temperature
characteristic
–25℃ ~ +85℃
Humidity test
1. Temp:40±2℃.
2. R.H:90-95%.
3. Time:96±2 hours.
Cold test
1. Inductors shall be no
evidence
of electrical and mechanical
danage
2. Inductance shall not
change more
than±5%.
3. Q shall not change more
than ±30%.
1. Temp:-40±2℃.
2. Time:96±2 hours.
Thermal shock
test
Dry heat test
1. temp:85±2℃
2. time: 96±2 hours
4
7. Recommended Soldering Conditions
Product can be applied to flow and reflow soldering.
⑴
Flux, Solder
①
Use rosin-based flux. Don’t use highly acidic flux with halide content exceeding 0.2wt% (chlorine
conversion value).
②
Use Sn solder.
⑵
Flow soldering conditions
①
Pre-heating should be in such a way that the temperature difference between solder and product surface
is limited to 150℃ max. Cooling into solvent after soldering also should be in such a way that
temperature difference is limited to 100℃ max. Unwrought pre-heating may cause cracks on the product,
resulting in the deterioration of products quality.
②
Standard soldering profile.
Pre-heating
Peak
150℃,1 minute min
260℃,10 seconds max
(3)Reflow soldering conditions
Profile Feature
Average Ramp-Up Rate ( Ts max. to Tp )
– Temperature Min (Ts min.)
Preheat
– Temperature Max (Ts max.)
– Time ( ts min to ts max.)
Time maintained – Temperature (TL)
above
– Time (tL)
Peak/Classification Temperature (Tp)
Peak/Classification Time (Tp)
Time within 5 °C of actual Peak
Temperature (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
Lead-Free Assembly
3℃ C/second max.
150
℃
200
℃
60-180 seconds
217
℃
60-150 seconds
260
℃
3-4 seconds
20-40 seconds
6°C/second max.
8 minutes max.
Note 1: All temperatures refer to topside of the package, measured on the package body surface.
5
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