CHIP DIODE
Switching Diode
CD4148WP
1:6
Switching Diode
CD4148WP
FEATURES
Silicon epitaxial planar diode
SMD chip pattern, available in various dimension included 0805 & 0603
Leadfree and RoHS compliance components
For small signal switching and operating ambient temperature less than 55
o
C and voltage withstand
less than 60V; not suitable for AC switching input as rectified circuit and high reverse voltage
location. CD4148WN is suitable for those application
MECHANICAL CHARACTERISTICS
Size: 1206
Weight: approx. 10mg
Marking: Cathode terminal
DIMENSIONS
Dimension/mm
L
W
T
C
1206
3.2±0.2
1.5±0.2
0.85±0.1
0.55±0.2
THERMAL CHARACTERISTICS
1)
Parameter at T
amb
=25
o
C
1)
Forward Power Dissipation
Power derating above 25
o
C
Junction Temperature
Thermal Resistance Junction to Ambient air
Operating& Storage Temperature range
1) Valid provided that electrodes are kept at ambient temperature.
Symbol
P
tot
T
j
R
θJA
T
stg
Value
400
3.2
150
375
-55 to 150
Unit
mW
mW/
o
C
o
C
C/W
o
C
o
www.lizgroup.com
Ref No: CD4148WP
V3.2
NOV 25, 2010
CHIP DIODE
Switching Diode
MAXIMUM RATING
1)
Parameter at T
amb
=25
o
C
1)
Repetitive Peak Reverse Voltage
Average rectified current sin half wave
rectification with resistive load
Repetitive Peak Forward Current at T
amb
=25°C
Non-Repetitive Surge Forward Current
at t<1s and T
j
=25
o
C
at t≦8.3ms and T
j
=25
o
C
1) Valid provided that electrodes are kept at ambient temperature.
CD4148WP
2:6
Symbol
V
RRM
I
F(AV)
I
FRM
I
FSM
Value
75
150
300
500
1000
Unit
V
mA
mA
mA
mA
ELECTRICAL CHARACTERISTICS
1)
Parameter at T
amb
=25
o
C
1)
Forward Voltage at I
F
=10mA
at I
F
=100mA
Leakage Current at V
R
=20V
Leakage Current at V
R
=75V
Capacitance at V
R
=0V, f=1MHz
Reverse Recovery Time at I
F
=I
R
=10mA,R
L
=
100Ω
1) Valid provided that electrodes are kept at ambient temperature.
Symbol
V
F
I
R
C
tot
t
rr
Value
1.0
MAX
1.25
MAX
0.025
MAX
5
MAX
4
MAX
4
MAX
Unit
V
V
uA
uA
pF
ns
TYPICAL CHARACTERISTICS
Figure 1. Forward Characteristic
Figure 2. Power De-rating
500
400
Ptot-Admissible Power
300
Dissipation/ mW
200
100
0
0
20
40
60
80
100 120
140 160 180 200
Tamb-Ambient Temperature/oC
www.lizgroup.com
Ref No: CD4148WP
V3.2
NOV 25, 2010
CHIP DIODE
Switching Diode
Figure 3. Forward Current De-rating
500
200
CD4148WP
Figure 4. Reverse Voltage De-rating
3:6
400
150
300
IF/ mA
.
.
50
0
0
200
100
0
0
20
40
60
80
100 120
140 160 180 200
VR/ V
100
20
40
60
80
100 120
140 160 180 200
Tamb-Ambient Temperature/oC
Tamb-Ambient Temperature/oC
TEST CHARACTERISTICS
Test Item
Solderability
Resistance to Soldering Heat
Humidity Steady State
Continue Forward Operating Life
Thermal Shock
Bending Strength
Test Condition
Sn bath at 245±5
o
C for 2±0.5s
Sn bath at 260±5
o
C for 10±2s
At 85
o
C 85%RH for 168hrs
At 25
o
C I
F
=1.1I
F
for 1000hrs
-55 ±5
o
C/5min to 150±5
o
C/5min
for 10cycles
Bending up to 2mm for 1cycle
Requirement
>95% area tin covered
V
F
,V
R
& I
R
within spec;
no mechanical damage
V
F
,V
R
& I
R
within spec
V
F
,V
R
& I
R
within spec
V
F
,V
R
& I
R
within spec
V
F
,V
R
& I
R
within spec;
no mechanical damage
www.lizgroup.com
Ref No: CD4148WP
V3.2
NOV 25, 2010
CHIP DIODE
Switching Diode
APPLICATIONS
Function: suit for small signal switching application
Typical Application circuit:
CD4148WP
4:6
Typical Product field: General application except high reverse voltage location
Soldering Condition:
Soldering Condition & Caution
■
Recommended Soldering Condition
(Refer to IPC/JEDEC J-STD-020D 4-1&5.2)
Recommended Profile Condition
Ramp-up rate (from pre-heat stage)
Pre-heat Temperature & Time
Soldering Temperature & Time
Peak Temperature
Time within 5
o
C of peak temperature
Ramp-down rate
Time 25
o
C to peak temperature
Sn-Pb Soldering
<3
o
C/s
100-150
o
C
60-120s
183
o
C
60-150s
230±5
o
C
<260
o
C
10-20s
<6
o
C/s
<6min
Leadfree
Soldering
<3
o
C/s
150-200
o
C
60-120s
217
o
C
60-150s
245±5
o
C
<260
o
C
20-30s
<6
o
C/s
<8min
Wave Soldering
△T<150
o
C
100-150
o
C
60-120s
260±5
o
C
5±2s
260±5
o
C
-
<6 C/s
-
o
Manual Soldering: Approx. 350
o
C for 3s, avoid solder iron tip direct touch the components body
www.lizgroup.com
Ref No: CD4148WP
V3.2
NOV 25, 2010
CHIP DIODE
Switching Diode
Recommended Soldering Profile
T/ C
o
CD4148WP
5:6
t/s
Fig1: Reflow soldering profile for
lead-free
solder (SnAgCu)
o
T/ C
t/s
Fig2: Wave soldering profile
*1. The recommended profiles are referring to IPC/JEDEC J-STD-020D & IEC-60068-2-58
*2. Chip diodes are able to stand maximum soldering temperature up to 260
o
C max for 10s, and the
soldering cycles with max 3 times, referring to IEC-60068-2-58
www.lizgroup.com
Ref No: CD4148WP
V3.2
NOV 25, 2010
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