INPAQ
Global RF/Component Solutions
MCE 1012 E Series
Specification
Product Name
Series
Size
Chip Common Mode Filter plus ESD Function
MCE E Series Low Profile Type
EIAJ 1012
INPAQ
Global RF/Component Solutions
MCE1012E SERIES LOW PROFILE TYPE
(Chip Common Mode Filter plus ESD function) Engineering Specification
Features and Application
.Powerful
components with composite co-fired material to solve EMI problem for high speed
differential signal transmission line as USB, and LVDS, without distortion to high speed signal
transmission.
.Common
mode filter plus ESD function.
.MIPI,
MHL serial interface in mobile device.
1.PRODUCT DETAIL
Imp. Com.
DCR
Rated
Current
Max.(mA)
Working
Voltage
(V)
Insulation
Resistance
Min.(MΩ)
Capacitance Leakage Trigger
(pF) @0.5V Current Voltage
1MHz
Max(pF)
MCE1012E
360F06BP
MCE1012E
900F06BP
@5V
Max(μA)
Typ.
(V)
Clamping
Voltage
Typ.
(V)
Part No.
(Ω)±25% Max. (Ω)
@100MHz
36
90
0.5
0.6
300
300
10
10
200
200
0.7
0.7
1
1
400
400
50
50
•Meet
IEC61000-4-2 level 4: Contact Discharge 8KV、Air Discharge 15KV
•Agilent
E4991A RF IMPEDANCE / MATERIAL ANALYZER
•HP4338B
MILLIONMMETER
Test
•Agilent
E5071C S-PARAMETER NETWORK ANALYZER
Instrume
•HP4285A
PRECISION LCR METER
•Agilent
4339B HIGH RESISTANCE METER
nts
•Keithley
2410 1100V SOURCE METER
•Celestron
TLP
2.PART NUMBER CODE
MCE 1012 E 90 0 F 06 B P
1
2
3 4 5 6 7 8 9
1:Series name
2:Dimensions L*W
3:Material code
4:Impedance value
(ex:900=90Ω)
5:Fixed decimal point
A=50mA
B=80mA
C=100mA D=150mA E=200mA F=300mA
6:Rated Current Code
G=400mA H=500mA I =600mA J =700mA K=800mA
7:Dimension T (ex:06=0.60mm)
8:Soldering: Green Parts: A— Soldering Lead-Free B— Lead-Free for whole chip
9:Packaging: P – Embossed paper tape, 7”reel.
MCE 1012 E Series Low Profile Type Engineer Specification
All Specifications are subject to change without notice.
Version: A0
Page 1 of 8
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INPAQ
Global RF/Component Solutions
3.TYPICAL CHARACTERISTIC
MCE1012E360F06BP
IMPEDANCE vs. FREUQENCY CHARACTERISTICS
1000
INSERTION LOSS vs. FREUQENCY CHARACTERISTICS
0
Impedance (ohm)
Insertion loss (dB)
-5
Differential Mode
100
Common Mode
-10
10
Common Mode
-15
Differential Mode
1
1
10
100
1,000
10,000
-20
1
10
100
1,000
10,000
Frequency (MHz)
Frequency (MHz)
MCE1012E900F06BP
IMPEDANCE vs. FREUQENCY CHARACTERISTICS
1000
INSERTION LOSS vs. FREUQENCY CHARACTERISTICS
0
Impedance (ohm)
Differential Mode
Insertion loss (dB)
-5
100
Common Mode
-10
10
-15
Differential Mode
1
1
10
100
1,000
10,000
-20
1
10
Common Mode
100
1,000
10,000
Frequency (MHz)
Frequency (MHz)
MCE 1012 E Series Low Profile Type Engineer Specification
All Specifications are subject to change without notice.
Version: A0
Page 2 of 8
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INPAQ
Global RF/Component Solutions
Eye pattern USB 2.0 high speed
ESD Wave forms
IEC 8KV_ESD Contact
1,000
900
800
700
V o lta g e (V )
600
500
400
300
200
100
-
-30
0
30
60
90
120
150
180
210
240
270
300
Time(ns)
Without Device
With CMF+ESD
MCE 1012 E Series Low Profile Type Engineer Specification
All Specifications are subject to change without notice.
Version: A0
Page 3 of 8
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INPAQ
Global RF/Component Solutions
4.SHAPES AND DIMENSIONS
TYPE
L
W
T
P
C1
C2
G1
G2
Dimension
1.25±0.10
1.00±0.10
0.60±0.10
0.50±0.10
0.30±0.10
0.20±0.15
0.30±0.15
0.20±0.15
Unit:mm
5.CIRCUIT CONFIGURATION & LAYOUT PAD
MCE 1012 E Series Low Profile Type Engineer Specification
All Specifications are subject to change without notice.
Version: A0
Page 4 of 8
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