(
)
B-2
DIN SOCKET DIN
LI JIAN
DC50V 1A
TYPE
APVD
CONSTRUCTION DIMENSION
HY-WI-32
2008-07-23
1
3
HAOYU (HONG KONG) LIMITED
SPECIFICATION
SERIES
DRAWN
1
2
RATING
Apply to the appended drawing.
OPERATING TEMPERATURE RANGE
-20 ~70
PRESERVATIVE TEMPERATURE RANGE
15 ~35
ITEM
3
TEST CONDITIONS
SPECIFICATIONS
ELECTRICAL PERFORMANCE
MEASURED BY THE CONTACT RESISTANCE APPARATUS OR m
CONTACT
METER AT 0.1A DC5V .THE RESULT IS THE AVERAGE OF5
SUCCESSIVE MEASUREMENTS.
5V
5
A VOLTAGE OF250V DC SHALL BE APPLIED
FOR 1 MIN. AFTER WHICH MEASUREMENT SHALL BE MADE.
INSULATION
BETWEEN TERMINALS
BETWEEN INDIVIDUAL TERMINALS AND FRAME
250V DC
(1)
(2)
1
,
100M
100
min
.
0.1A
50m
50
max
3A
RESISTANCE
3B
RESISTANCE
A VOLTAGE OF250V AC SHALL BE APPLIED
FOR 1 MIN. AFTER WHICH MEASUREMENT SHALL BE MADE.
DIELECTRIC
3C
STRENGTH
BETWEEN TERMINALS
BETWEEN INDIVIDUAL TERMINALS AND FRAME
250V AC
(3)
(4)
4.MECHANICAL PERFORMANCE(
INSERTION
AND
WITHDRAW
FORCE
)
Insertion and extraction force
5-35N
5-35
ELECTRICAL
SHALL
BE
CHARACTERISTICS
SATISFIED.WITHOUT
WITHOUT DAMAGE
TO PARTS ARCING
OR BREAKDOWN ETC
.
1
,
4A
Being measure at across spring piece and across matching plug for
ergometer
(
)
TERMINAL
4B
STRENGTH
A STATIC LOAD OF 5 N(500gf) SHALL BE APPLIED TO THE TIP OF
THE TERMINALS FOR 60 SEC. IN ANY DIRECTION
5N(500gf)60
DAMAGE OR EXCESSIVE LOOSEN-ESS
OF ACTUATOR
\
.
UNLESS OTHERWISE SPECIFIED. THE STANDRD RANGE
STANDARD
4C
ATMOSPHEIC
CONDITIONS
OF ATMOSPHERIC CONDITIONS FOR MAKING MEASUREMENTS
AND TESTS ARE AS FOLLOWS:
AMDIENT TEMPERATURE: 15
RELATIVE HUMIDITY
AIR PRESSURE
TO 35
1
2
3
15 ~35
25%~75%RH
80Kpa ~106Kpa
:25%TO75%RH
:80Kpa TO 106Kpa
(
)
B-2
HY-WI-32
2008-07-23
2
3
HAOYU (HONG KONG) LIMITED
SPECIFICATION
5
DURABILITY
THE TOP OF THE TERMINALS SHALL BEDIPPED 2mm IN
THE SOLDER BATH OF220
SOLDERABILITY
5A
TEST
5
FOR 3
0.5
1
SOLDER WETTING TIME
SHALL BE 3 SEC OR LESS
3
THE AREA
OF SOLDERABILITY
SHOULD BE OVER 90%
90%
SECONDS. THE PLASTIC BODY IS 1.6mm ABOVE THE
TIN LIGUID.
3
0.5
.
1.6mm
2mm
350 5
220 5
2 0.5
2
RESISTANCE
TO
5B
SOLDERING
HEAT
TEST
WITHOUT DEFORMATION OF CASE
THE TOP OF THE TERMINALS SHALL BEDIPPED 2mm .
THE PLASTIC BODY IS 1.6mm ABOVE THE TIN LIGUID.
2mm ,
1.6mm
Wave-soldering is to be performed within 3seconds at 260 +/-5
260 +/-5
3
Hand weilding to be performed within 3 seconds at 380 or
below.
380
3 0.5
OREXCESSIVE
LOOSENESS
OF
TERMINALSELECTRICAL
CHARACTERISTICS SHALL
BE SATISFIED.
5C
LIFE TEST.
WITHOUT LOAD IT IS TESTED BY MACHINE ACTING
FORCE MUST BE PARALLED TO THE WAY OF
PUSHING
AN ACTUATOR SHALL BE SUBIECT TO 1000 CYCLES AT
A SPEED OF30 CYCLES FOR 1 MIN
30
1000
1
2
1
2
CONTACT
RESISTANCE
SHALLBE 100m max
MECHANICAL
AND
ELECTRICAL
CHARACTERISTICS SHALL
BESATISFIED
100m
85 2
5D
HEAT TEST.
FOR 48 HOURS AFTER TEST KEEP IN NORMAL
30
THERE SHALL BE NO DAMAGE ON
APPEARANCE
MECHANICAL AND ELECTRICAL
CHARACTERISTICS
SATISFIED
for 48 HRS. AFTER TEST KEEP IN NORMAL
SHALL
BE
CONDITION FOR 30 MINUTES.
85 2
48
,
40
2
90-96%RH FOR 48 HOURS, TEST AFTER
5E
HUMIDITY TEST.
KEEPING IN NORMAL CONDITION FOR 30 MIN.
40 2
30
At –40 2
90
96 RH
48
CONDITION FOR 30 MIN.
5F
COLD TEST.
-40 2
48
,
30
SALT SPRAY TEST
5G
AT 5% NACL LIQUOR FOR 24HOURS, AFTER WASHING,
KEEP IN NORMAL CONDITION FOR 30 MIN.
5% Nacl
24
30
WITHOUT EXCESSIVE CORROSION
OR CRACK IN APPEARANCE
(
)
B-2
HY-WI-32
2008-07-23
3
3
HAOYU (HONG KONG) LIMITED
SPECIFICATION
6
APPLICATION NOTES:
,
ROSIN AND OTHER INSULATING AND CAUSTIC MATERIAL CAN NOT BE DIPPED INTO THE ROCKET DURING
SOLDERING.
2
PRODUCTS CAN NOT BE BLOWN WITH AIR GUN OR CLEANED WITH A SOLVENT AFTER SOLDERING.)
3
ALL PARTS OF THE PRODUCTS CAN NOT BE DISSOLVED BEFORE SOLDERING.
4
AVOID STORING THE PRODUCTS IN A PLACE AT HIGH TEMPERATURE, HIGH HUMIDITY AND
IN CORROSIVE GASES.)
5
:
,
180
.
,
,
SHELF LIFE IS LESS THAN 180 DAYS SINCE THE GOODS WARE SENT OUT FROM OUR FACTORY. OUR COMPANY
DOESN’T ACCEPT RESPONSIBILITY FOR REJECTS IF THE SHELF LIFE OF GOODS EXCEEDS 180 DAYS.
6
PLEASE FEEL FREE TO REPORT TO US IF YOU DISCOVER THE INFERIOR GOODS, SO THAT WE CAN TAKE NOTE,
CHECK, TRACK AND IMPROVE THEM. THANKS.
(
)
HAOYU (HONG KONG) LIMITED
微控制器 MCU
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