GT24C32B
Advanced
GT24C32B
2-WIRE
32K Bits
Serial EEPROM
Copyright © 2014 Giantec Semiconductor Inc. (Giantec). All rights reserved. Giantec reserves the right to make changes to this specification and its products at any time without
notice. Giantec products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for critical medical or surgical equipment,
aerospace or military, or other applications planned to support or sustain life. It is the customer's obligation to optimize the design in their own products for the best performance
and optimization on the functionality and etc. Giantec assumes no liability arising out of the application or use of any information, products or services described herein. Customers
are advised to obtain the latest version of this device specification before relying on any published information and prior placing orders for products.
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GT24C32B
Table of Contents
1.
2.
3.
4.
Features
.....................................................................................................................................................................
3
General Description
.............................................................................................................................................
3
Functional Block Diagram
................................................................................................................................
4
Pin Configuration...................................................................................................................................................
5
4.1 8-Pin SOIC, TSSOP, PDIP and MSOP ................................................................................................... 5
4.2 8-Lead UDFN and XDFN ........................................................................................................................ 5
4.3 5-Pin SOT23 ........................................................................................................................................... 5
4.4 Pin Definition ........................................................................................................................................... 5
4.5 Pin Descriptions ...................................................................................................................................... 6
5. Device Operation
...................................................................................................................................................
7
5.1 2-WIRE Bus ............................................................................................................................................ 7
5.2 The Bus Protocol .................................................................................................................................... 7
5.3 Start Condition ........................................................................................................................................ 7
5.4 Stop Condition......................................................................................................................................... 7
5.5 Acknowledge ........................................................................................................................................... 7
5.6 Reset ....................................................................................................................................................... 7
5.7 Standby Mode ......................................................................................................................................... 7
5.8 Device Addressing .................................................................................................................................. 7
5.9 Write Operation ....................................................................................................................................... 7
5.10 Read Operation..................................................................................................................................... 8
5.11 Diagrams ............................................................................................................................................. 10
5.12. Timing Diagrams ................................................................................................................................ 13
6. Electrical Characteristics
..............................................................................................................................
14
6.1 Absolute Maximum Ratings .................................................................................................................. 14
6.2 Operating Range................................................................................................................................... 14
6.3 Capacitance .......................................................................................................................................... 14
6.4 DC Electrical Characteristic .................................................................................................................. 15
6.5 AC Electrical Characteristic .................................................................................................................. 16
7. Ordering Information
.........................................................................................................................................
17
8. Top Markings
.........................................................................................................................................................
18
8.1 SOIC package ....................................................................................................................................... 18
8.2 TSSOP package ................................................................................................................................... 18
8.3 PDIP package ....................................................................................................................................... 18
8.4 UDFN package ..................................................................................................................................... 18
8.5 MSOP Package .................................................................................................................................... 19
8.6 XDFN Package ..................................................................................................................................... 19
8.7 SOT23 Package.................................................................................................................................... 19
9. Package Information
.........................................................................................................................................
20
9.1 SOIC ..................................................................................................................................................... 20
9.2 TSSOP .................................................................................................................................................. 21
9.3 PDIP ...................................................................................................................................................... 22
9.4 UDFN .................................................................................................................................................... 23
9.5 MSOP.................................................................................................................................................... 24
9.6 XDFN .................................................................................................................................................... 25
9.7 SOT23 ................................................................................................................................................... 26
10. Revision History
................................................................................................................................................
27
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GT24C32B
1. Features
Two-Wire Serial Interface, I C
2
TM
Compatible
–
–
Bi-directional data transfer protocol
–
–
Partial page writes allowed
Addition write lockable page (Identification
Page)
Wide-voltage Operation
V
CC
= 1.7V to 5.5V
Self timed write cycle: 5 ms (max.)
Noise immunity on inputs, besides Schmitt trigger
High-reliability
Speed: 400 KHz (1.7V) and 1 MHz (2.5V~5.5V)
Standby current (max.): 1
A,
5.5V
Read current (max.): 0.5 mA, 5.5V
Write current (max.): 0.8 mA, 5.5V
Hardware Data Protection
–
–
Endurance: 1 million cycles
Data retention: 100 years
ESD Protection > 4000V
Industrial grade
Packages: SOIC, TSSOP, PDIP, UDFN, MSOP,
XDFN and SOT23
Lead-free, RoHS, Halogen free, Green
–
Write Protect Pin
Sequential & Random Read Features
Memory organization: 32Kb (4,096 x 8)
Page Size: 32 bytes
Page write mode
2. General Description
The GT24C32B is an industrial standard electrically
erasable programmable read only memory (EEPROM)
device that utilizes the industrial standard 2-wire interface
for communications. The GT24C32B contains a memory
array of 32K bits (4,096x8), which is organized in 32-byte
per page.
The EEPROM operates in a wide voltage range from 1.7V
to 5.5V, which fits most application. The product provides
low-power operations and low standby current. The device
is offered in Lead-free, RoHS, halogen free or Green
package. The available package types are 8-pin SOIC,
TSSOP, PDIP, UDFN, MSOP, XDFN and SOT23.
The GT24C32B is compatible to the standard 2-wire bus
protocol. The simple bus consists of Serial Clock (SCL) and
Serial Data (SDA) signals. Utilizing such bus protocol, a
Master device, such as a microcontroller, can usually
control one or more Slave devices, alike this GT24C32B.
The bit stream over the SDA line includes a series of bytes,
which identifies a particular Slave device, an instruction, an
address within that Slave device, and a series of data, if
appropriate. The GT24C32B also has a Write Protect
function via WP pin to cease from overwriting the data
stored inside the memory array.
In order to refrain the state machine from entering into a
wrong state during power-up sequence or a power toggle
off-on condition, a power on reset circuit is embedded.
During power-up, the device does not respond to any
instructions until the supply voltage (V
CC
) has reached an
acceptable stable level above the reset threshold voltage.
Once V
CC
passes the power on reset threshold, the device
is reset and enters into the Standby mode. This would also
avoid any inadvertent Write operations during power-up
stage. During power-down process, the device will enter
into standby mode, once V
CC
drops below the power on
reset threshold voltage. In addition, the device will be in
standby mode after receiving the Stop command, provided
that no internal write operation is in progress. Nevertheless,
it is illegal to send a command unless the V
CC
is within its
operating level.
This product offers an additional page (Identification Page)
of 32 bytes. The Identification Page can be used to store
sensitive application parameters which can be (later)
permanently locked in Read-only mode.
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GT24C32B
3. Functional Block Diagram
VCC
8
HIGH VOLTAGE
GENERATOR
TIMING &
CONTROL
SDA
SCL
WP
5
7
SLAVE ADDRESS
REGISTER &
COMPARATOR
CONTROL LOGIC
X DECODER
6
EEPROM ARRAY
A0
A1
A2
1
2
3
WORD ADDRESS
COUNTER
Y DECODER
ACK
GND 4
nMOS
CLOCK
DI/O
DATA REGISTER
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GT24C32B
4. Pin Configuration
4.1 8-Pin SOIC, TSSOP, PDIP and MSOP
Top View
4.2 8-Lead UDFN and XDFN
Top View
A0
A1
A2
GND
1
2
3
4
8
7
6
5
V
CC
WP
SCL
SDA
A0
A1
A2
GND
1
2
3
4
8
7
6
5
V
CC
WP
SCL
SDA
4.3 5-Pin SOT23
Top View
SCL
GND
SDA
1
2
3
5
WP
4
V
CC
4.4 Pin Definition
Pin No.
1
2
3
4
5
6
7
8
Pin Name
A0
A1
A2
GND
SDA
SCL
WP
V
CC
I/O
I
I
I
-
I/O
I
I
-
Device Address Input
Device Address Input
Device Address Input
Ground
Serial Address, Data input and Data output
Serial Clock Input
Write Protect Input
Power Supply
Definition
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