FUZETEC
TECHNOLOGY CO., LTD.
NO.
PQ04-01ER
Page
1/5
Product Specification and Approval Sheet
Version A6
Surface Mountable PTC Resettable Fuse: FSMD Series
1. Summary
(a)
RoHS Compliant & Halogen Free
(b) Applications: All high-density boards
(c) Product Features: Small surface mountable, Solid state, Faster time to trip than
standard SMD devices, Lower resistance than standard SMD devices
(d) Operation Current: 0.10A~3.00A
(e) Maximum Voltage: 6V~60V
DC
(f) Temperature Range : -40℃ to 85℃
2. Agency Recognition
UL:
C-UL:
TÜ V:
File No. E211981
File No. E211981
File No. R50004084, R50090556
3. Electrical Characteristics (23℃)
Hold
Part
Number
I
H
, A
FSMD010-R
FSMD014-R
FSMD020-R
FSMD020-60-R
FSMD030-R
FSMD035-R
FSMD035-30-R
FSMD050-R
FSMD050-30-R
FSMD075-R
FSMD075-24R
FSMD075-33R
FSMD110-R
FSMD110-16-R
FSMD110-24R
FSMD125-R
FSMD125-16R
FSMD150-R
FSMD150-12R
FSMD150-24R
FSMD160-R
FSMD160-12R
FSMD160-16R
FSMD200R
FSMD200-16R
FSMD260R
FSMD260-13R
FSMD260-16R
FSMD300R
0.10
0.14
0.20
0.20
0.30
0.35
0.35
0.50
0.50
0.75
0.75
0.75
1.10
1.10
1.10
1.25
1.25
1.50
1.50
1.50
1.60
1.60
1.60
2.00
2.00
2.60
2.60
2.60
3.00
I
T
, A
0.30
0.30
0.40
0.40
0.60
0.70
0.70
1.00
1.00
1.50
1.50
1.50
2.20
2.20
2.20
2.50
2.50
3.00
3.00
3.00
3.20
3.20
3.20
3.50
3.50
5.00
5.00
5.00
5.00
V
MAX
, V
DC
60
60
30
60
30
16
30
16
30
16
24
33
8
16
24
6
16
8
12
24
8
12
16
8
16
8
13.2
16
6
I
MAX
, A
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
Pd, W
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
1.0
1.0
0.8
0.8
1.0
0.8
0.8
0.8
1.0
1.0
0.8
1.0
1.0
1.0
1.0
1.0
1.3
1.3
1.0
Current
Trip
Current
Rated
Voltage
Max
Current
Typical
Power
Max Time to Trip
Current
Amp
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Time
Sec
0.020
0.008
0.020
0.020
0.100
0.100
0.100
0.150
0.150
0.200
0.200
0.200
0.300
0.500
0.500
0.400
0.400
0.500
0.500
1.500
0.500
1.000
1.000
2.000
5.000
2.500
5.000
5.000
4.000
Resistance
R
MIN
Ohms
1.600
1.200
0.800
0.800
0.200
0.320
0.320
0.150
0.150
0.110
0.110
0.110
0.040
0.060
0.060
0.050
0.050
0.040
0.040
0.040
0.030
0.030
0.030
0.020
0.020
0.015
0.015
0.015
0.012
R1
MAX
Ohms
15.000
6.500
5.000
5.000
1.750
1.500
1.500
1.000
1.000
0.450
0.290
0.400
0.210
0.180
0.200
0.140
0.140
0.110
0.110
0.120
0.100
0.100
0.100
0.070
0.085
0.047
0.050
0.050
0.040
NOTE : Specification subject to change without notice.
2014/9/19
FUZETEC
TECHNOLOGY CO., LTD.
NO.
PQ04-01ER
Page
2/5
Product Specification and Approval Sheet
Version A6
I
H
=Hold current-maximum current at which the device will not trip at 23℃still air.
I
T
=Trip current-minimum current at which the device will always trip at 23℃ still air.
V
MAX
=Maximum voltage device can withstand without damage at it rated current.(I
MAX
)
I
MAX
= Maximum fault current device can withstand without damage at rated voltage (V
MAX
).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment.
R
MIN
=Minimum device resistance at 23℃ prior to tripping.
R
1
MAX
=Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure Tin
4. FSMD Product Dimensions (Millimeters)
Part
Number
FSMD010-R
FSMD014-R
FSMD020-R
FSMD020-60-R
FSMD030-R
FSMD035-R
FSMD035-30-R
FSMD050-R
FSMD050-30-R
FSMD075-R
FSMD075-24R
FSMD075-33R
FSMD110-R
FSMD110-16-R
FSMD110-24R
FSMD125-R
FSMD125-16R
FSMD150-R
FSMD150-12R
FSMD150-24R
FSMD160-R
FSMD160-12R
FSMD160-16R
FSMD200R
FSMD200-16R
FSMD260R
FSMD260-13R
FSMD260-16R
FSMD300R
A
Min
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
Max
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
Min
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
B
Max
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
Min
0.60
0.60
0.60
0.60
0.40
0.40
0.40
0.35
0.45
0.35
0.80
0.80
0.25
0.25
0.80
0.25
0.50
0.25
0.60
0.60
0.25
0.60
0.60
0.55
0.60
0.55
0.80
0.80
0.80
C
Max
0.90
0.90
0.90
0.90
0.70
0.70
0.70
0.65
0.75
0.65
1.55
1.55
0.55
0.90
1.30
0.55
1.00
0.55
1.10
1.55
0.90
1.35
1.35
1.20
1.55
1.20
1.55
1.55
1.55
Min
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.25
0.25
0.30
0.30
0.25
0.30
0.30
0.30
0.25
0.25
0.30
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
D
Max
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
Min
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
E
Max
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
0.65
NOTE : Specification subject to change without notice.
2014/9/19
FUZETEC
TECHNOLOGY CO., LTD.
5. Thermal Derating Curve
FSMD Series
200%
NO.
PQ04-01ER
Page
3/5
Product Specification and Approval Sheet
Version A6
Percent of Rated Hold and Trip Current
150%
100%
50%
0%
-40
-20
0
20
40
60
80
A=
FSMD075-R, 075-24R, 075-33R,
110-R, 110-16-R, 110-24R,
125-R, 125-16R, 150-R,
150-12R, 150-24R, 160-R,
160-12R, 160-16R, 200R,
200-16R, 260R, 260-13R,
260-16R, 300R
B=
FSMD010-R, 014-R, 020-R,
020-60-R, 030-R,
035-R,035-30-R,050-R,
050-30-R
Ambient Temperature (℃)
6. Typical Time-To-Trip at 23℃
A = FSMD010-R
B = FSMD014-R
C = FSMD020-R / 020-60-R
D = FSMD030-R
E = FSMD035-R / 035-30-R
F = FSMD050-R / 050-30-R
G = FSMD075-R / 075-24R /
075-33R
H = FSMD110-R / 110-16-R /
110-24R
I = FSMD125-R / 125-16R
J = FSMD150-R / 150-12R /
150-24R
K = FSMD160-R / 160-12R /
160-16R
L = FSMD200R / 200-16R
M = FSMD260R / 260-13R /
260-16R
N = FSMD300R
AB
100
C
DE F
G
HIJ K LM N
10
Time-to-trip (S)
1
0.1
0.01
0.001
0.1
1
10
100
Fault Current (A)
NOTE : Specification subject to change without notice.
2014/9/19
FUZETEC
TECHNOLOGY CO., LTD.
7. Material Specification
NO.
PQ04-01ER
Page
4/5
Product Specification and Approval Sheet
Version A6
Terminal pad material: Pure Tin
Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3
8. Part Numbering and Marking System
Part Numbering System
FSMD
□ □ □ –
R
Part Marking System
F
□ □ □
Part Identification
Example
F110
Current Rating
Fuzetec Logo
OR
FSMD
□ □ □ – □ □ –
R
Voltage Rating
Current Rating
Example
F
110
16
F
□ □ □
□ □
Part Identification
Fuzetec Logo
Warning:
-Operation beyond the specified maximum ratings or improper use may result in damage and possible
electrical arcing and/or flame.
-PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent
condition and/or prolonged trip are not anticipated.
-Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device
performance.
NOTE : Specification subject to change without notice.
2014/9/19
FUZETEC
TECHNOLOGY CO., LTD.
NO.
PQ04-01ER
Page
5/5
Product Specification and Approval Sheet
Version A6
9. Pad Layouts、Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD1812 device
Pad dimensions (millimeters)
A
B
Device
Nominal
Nominal
All 1812 Series
3.45
1.78
C
Nominal
3.50
Solder reflow
※
Due to “Lead Free” nature, Temperature and
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat :
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
Pb-Free Assembly
3
℃/second
max.
150
℃
200
℃
60-180 seconds
Dwelling time for the soldering zone is higher
than those for Regular. This may cause
damage to other components.
1. Recommended max past thickness > 0.25mm.
2. Devices can be cleaned using standard
methods and aqueous solvent.
3. Rework use standard industry practices.
4. Storage Envorinment : < 30℃ / 60%RH
Caution:
1. If reflow temperatures exceed the
recommended profile, devices may not meet
the performance requirements.
2. Devices are not designed to be wave soldered
to the bottom side of the board.
Time maintained above:
Temperature(T
L
)
217
℃
Time (t
L
)
60-150 seconds
Peak/Classification Temperature(Tp) :
260
℃
Time within 5℃ of actual Peak :
20-40 seconds
Temperature (tp)
Ramp-Down Rate :
6
℃/second
max.
8 minutes max.
Time 25
℃
to Peak Temperature :
Note 1: All temperatures refer to of the package,
measured on the package body surface.
Reflow Profile
NOTE : Specification subject to change without notice.
2014/9/19
微控制器 MCU
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