PRODUCT SPECIFICATION
SPEC. NO: T-0602-102D
新弘智
CUSTOMER'S PRODUCT NAME:
DATE: Nov.27,2018
EMTEK PRODUCT NAME:
CMF4532F-Series
THIS SPECIFICATION IS:
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FULLY ACCEPTED
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DENIED
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ACCEPTED UNDER THE FOLLOWING CONDITIONS
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All rights reserved.This document or parts thereof,may
not be reproduced by any means or used in any manner
witout written permission of EMTEK CO.,LTD.
FACTORY:
39,Chingao Rd.,(305)Hsinpu,
Hsinchu Hsien,Taiwan,R.O.C
TEL: 03-5894-433
FAX: 03-5894-523
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SPEC. NO.
PRODUCT SPECIFICATION
1. Scope
T-0602-102D
This specification applies ferrite Chip common mode filters CMF4532F-Series
to be delivered to user.
2. Product Identification
CMF 4532 F - 601 - 2P - T
(1) (2) (3) (4) (5) (6)
(1) Product name
(2) Shapes and dimensions
(3) Application
(4) Impedance【 at 100MHz】
601:600Ω
(5) Number of Line
2P:2-Line
(6) Taping Type
3. Shapes and Dimensions [Dimensions in mm]
A
B
Epoxy
C
A:4.5
±
0.2 mm
B:3.2
±
0.2 mm
C:2.8
±
0.2 mm
D1:1.0
±
0.1 mm
D2:1.2
±
0.1 mm
Termination
Wires
(D2)
(D2)
(D1)
(D1)
Drawn by
Checked by
Approved by
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SPEC. NO.
PRODUCT SPECIFICATION
4-3 Test Equipment
4-3-1 Impedance
Measured by using Agilent E4991A RF Impedance Analyzer.
T-0602-102D
Measurement terminal
①
②
④
③
4-3-2 DC Resistance
Measured by using Chroma 16502 mill ohm meter.
Measurement terminal
①
②
④
③
Measurement terminal
4-3-3 Insulation Resistance
Measured by using Chroma 19073
Measurement voltage : 50v .
Measurement terminal
①
②
④
③
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PRODUCT SPECIFICATION
5.Reliability Test
Operating temperature : -40 to +125℃
SPEC. NO.
T-0602-102D
Storage temp and humidity : 20~25℃ ,60%RH max.
Item
Specifications
Solderability
It can be connected on the
Test conditions
Apply cream solder to the test circuit board .
Dip pads in flux and dip in solder pot( 96.5 Sn/3.5 Ag
solder) at 255°C ±5°C.
Recommendation soldering condition. It is mounted on the recommendation soldering condition.
Solder Heat
Components should have not
Resistance
evidence of electrical and
mechannical damage
Impedance:within ±15% of
initial value
The device should be reflow soldered on PCB
Preheating: 150℃, 60 secs
Solder temperature: Peak 260±5℃ for 10secs
Solder Composition: 96.5Sn/3.5Ag
Terminal
strength
The terminal electrode and the ferrite
must not be damaged.
Solder a chip to test substrate , and then laterally apply a
load 1.8Kg in the arrow direction.
High
Appearance : Ferrite shall not be
temperature
damaged.
resistance
initial value.
Temperature : +125±2℃
Testing time : 168±12 hours
Measurement : After placing for 24 hours min.
Temperature : +60±2℃
Humidity : 90 to 95%RH
Testing time : 168±12 hours
Measurement : After placing for 24 hours min.
Temperature : -40℃,+125℃
kept stabilized for 30 minutes each.
Cycle : 10 cycle
Measurement : After placing for 24 hours min.
1 cycle
+125℃
30 min.
3 min.
Humidity
resistance
insulation resistance: >10(MΩ)
DC resistance : standard value
inside.
Thermal
cycle
-40℃
30 min.