Power Inductors
1.
External Dimensions (Unit:m/m)
Type
ABG10A50
A
10.0±0.2
B
10.0±0.2
C
5.1Max
D
4.2Ref
E
1.7Ref
a
6.2Ref
b
2.0Ref
c
5.5Ref
Q’TY/Reel
700
2.
Part Number Code
ABG
A
A:
B:
C:
D:
E:
F:
10
B
A
C
50
D
M
E
330
F
3.
Electrical Characteristics
Part Number
ABG10A50M330
Inductance Test Frequency DC Resistance
(µH)
(KHz)
(mΩ)±30%
33.0
100KHz/1V
71.0
Notes:
a. All test data is referenced to 25
ambient.
to +125 .
d. lsat: DC current(A)that will cause Lo to drop approximately 40%.
conditions. Circuit design,component placement, PWB trace size and thickness,airflow and other
cooling provisions all affect the part temperature Part temperature should be verified in the end
application.
Http://www.coilank.com
E-mail:sales@coilank.com
℃
e. The part temperature(ambient + temp rise)should not exceed 125
℃
c. Irms: DC current(A)that will cause an approximate T of 40
△
，
℃
℃
b. Operating Temperature Range-40
℃
：
：
Series Name
Dimensions(mm)
Materials
Thickness(mm)
Tolerance
Inductance
Power Inductors
10 10.0x10.0
NO use
50 5.1 Max
M:±20%
330=33uH
Heat Rating
Current
Irms (A)
3.5
Saturation
Current
lsat (A)
5.2
.
under worst case operating
Power Inductors
4. Material List
No
1
2
3
Item
CORE
WIRE
Epoxy
Material
N401H SDR-10-4.8-5.2-2.6S
UEWH/U2
DA-1001BK/E-500AH(BLACK)
Supplier
CYOR EQUIVALENT
PEWC OR
EQUIVALENT
CHOR EQUIVALENT
UL NO.
N/A
E201757
N/A
5. Test Data
ELECTRICAL CHARCTERISTIC
SPEC
TOL
NO
1
2
3
4
5
6
7
8
9
10
L(uH)
33.0
±20%
30.83
30.96
30.58
31.12
31.29
30.54
30.65
31.13
31.07
31.19
DCR(mΩ)
71.0
±30%
68.83
69.07
70.65
71.74
71.94
68.17
70.89
71.04
69.66
71.79
CD1320
CD1068
Isat(uH)
5.2A
(L0A-L5.2A)
/L0A≤40%
20.95
20.92
21.88
21.27
21.13
20.95
20.89
21.17
21.18
21.12
502BC
A(mm)
10.0
±0.2
10.01
10.02
10.01
10.03
9.99
10.00
10.03
10.02
10.00
9.98
MECHANICAL DIMENSIONS
B(mm)
10.0
±0.2
10.03
9.98
10.00
10.03
9.99
10.03
9.96
10.00
10.02
10.06
C(mm)
5.1
Max
4.86
4.88
4.89
4.88
4.87
4.87
4.88
4.86
4.89
4.86
D(mm)
4.2
Ref
OK
OK
OK
OK
OK
OK
OK
OK
OK
OK
Curve：
Inductance VS Temperature
001
05
Indutance(uH)
Current(A)
Http://www.coilank.com
E-mail:sales@coilank.com
)℃(TΔ
)Hu(L
Tenperature(℃
)
08
06
04
02
0
7
6
5
4
3
、
2
、
1
、
Test Equipmets:CD1063
0
04
03
02
01
0
Power Inductors
6.
Test and Measurement Procedures
6.1 Test Conditions
6.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a. Ambient Temperature: 20±15
b. Relative Humidity: 65%±20%
c. Air Pressure: 86KPa to 106KPa
6.1.2 If any doubt on the results, measurements/tests should be made within the following limits:
a. Ambient Temperature: 20±2
b. Relative Humidity: 65%±5%
c. Air Pressure: 86KPa to 106Kpa
6.2 Visual Examination
a. Inspection Equipment: 10X magnifier
6.3 Electrical Test
6.3.1 Inductance (L)
a. Refer to the third item.
b. Test equipment: CD1063 LCR meter or equivalent.
c. Test Frequency and Voltage: Refer to the third item
6.3.2 Direct Current Resistance (DCR)
a. Refer to the third item
b. Test equipment: 502BC or equivalent.
6.3.3 Saturation Current (Isat)
a. Refer to the third item
b. Test equipment: Saturation current meter
c. Definition of saturation current (Isat): DC current at which the inductance drops approximate
40% from its value without current.
6.3.4 Temperature rise current (Irms)
a. Refer to the third item.
b. Test equipment (see Fig.5.3.4-1): Electric Power, Electric current meter, Thermometer.
c. Measurement method (see Fig. 6.3.4-1):
1. Set test current to be 0mA.
2. Measure initial temperature of choke surface.
3. Gradually increase current and measure choke temperature for corresponding current.
4. Definition of Temperature rise current: DC current that causes the temperature rise ( T
=40°C) from 20°C ambient (see Fig. 6.3.4-2).
Fig.6.3.4-1
Fig.6.3.4-2
Http://www.coilank.com
E-mail:sales@coilank.com
△
℃
℃
Power Inductors
6.4Reliability Test
Items
Requirements
No removal or split of the termination
or other defects shall occur.
Solder the inductor to the testing jig (glass epoxy
board shown in Fig.6.4.1-1) using eutectic solder.
Then applya force in the direction of the arrow.
17.7N force.
Keep time: 5s
Test Methods and Remarks
Fig.6.4.1-1
No visible mechanical damage.
Solder the chip to the test jig (glass epoxy board)
usingeutectic solder. Then apply a force in the
directionshown as Fig.6.4.2-1.
Flexure: 2mm
Pressurizing Speed: 0.5mm/sec
Keep time: 30±1s
Test board size: 100X40X1.0
6.4.2
Resistance to
Flexure
Fig.6.4.2-1.
Inductance change: Within ±20%
6.4.5
Solderability
90% or more of electrode area shall be
Coated by new solder.
The test samples shall be dipped in flux, and then
immersed in molten solder.
Solder temperature: 245±5
Duration: 5±1 sec.
Solder: Sn/3.0Ag/0.5Cu
Flux: 25% resin and 75% ethanol in weight
Immersion depth: all sides of mounting terminal
shallbe immersed
Http://www.coilank.com
E-mail:sales@coilank.com
℃
6.4.4
Temperature
coefficient
℃
℃
℃
③
②
①
⑥
⑤
④
③
②
①
②
①
6.4.3
Vibration
No visible mechanical damage.
Inductance change: Within ±10%
Solder the chip to the testing jig (glass epoxy board
shown as the following figure) using eutectic solder.
Thechip shall be subjected to a simple harmonic
motion having total amplitude of 1.5mm, thefrequency
beingvaried uniformly between the approximate
limitsof 10 and 55 Hz.
The frequency range from 10 to 55 Hz and return to
10Hz shall be traversed in approximately 1 minute.
Thismotion shall be applied for a period of 2 hours
in each3mutually perpendicular directions (total of
6hours).
①
⑤
④
③
②
③
②
②
①
6.4.1
Terminal
Strength
①
Temperature: -40 ~+125
With a reference value of +20
becalculated
, change rate shall
Power Inductors
Items
Requirements
Test Methods and Remarks
Re-flowing Profile: Please refer to Fig. 6.4.6-1
Test board thickness: 1.0mm
Test board material: glass epoxy resin
The chip shall be stabilized at normal condition for
1~2hours before measuring
6.4.7
Thermal Shock
Http://www.coilank.com
①
②
6.4.12
Loading at High
Temperature
No mechanical damage.
Inductance change: Within ±10%
E-mail:sales@coilank.com
④
③
②
①
①
②
6.4.11
Loading Under
Damp Heat
No mechanical damage.
Inductance change: Within ±10%
⑤
④
③
②
①
②
6.4.10
Damp Heat
No mechanical damage.
Inductance change: Within ±10%
Temperature: 85±2℃
Humidity: 80% to 85% RH
Applied current: Irms
Duration: 1000±24 hours
The chip shall be stabilized at normal condition for
1~2 hours before measuring
Temperature: 85±2℃
Applied current: Irms
Duration: 1000±24 hours
The chip shall be stabilized at normal condition for
1~2 hours before measuring
℃
④
③
②
①
①
①
②
6.4.9
Resistance to
HighTemperature
No mechanical damage.
Inductance change: Within ±10%
Temperature: 85±2
Humidity: 80% to 85%RH
Duration: 1000±24 hours
The chip shall be stabilized at normal condition for
1~2 hours before measuring
℃
③
②
①
①
②
6.4.8
Resistance to Low
Temperature
No mechanical damage.
Inductance change: Within ±10%
Temperature: -40±3
Duration: 1000±24 hours
The chip shall be stabilized at normal condition for
1~2 hours before measuring
Temperature: 125±2
Duration: 1000±24 hours
The chip shall be stabilized at normal condition for
1~2 hours before measuring.
℃
℃
℃
④
③
②
①
③
②
①
①
②
①
②
6.4.6
Resistance to
Soldering Heat
No visible mechanical damage.
Inductance change: Within ±10%
No visible mechanical damage.
Inductance change: Within ±10%
Temperature and time: -40±3 for
30±3min→125 for 30±3min
Transforming interval: Max. 20 sec
Tested cycle: 100 cycles
The chip shall be stabilized at normal condition for
1~2 hours before measuring
④
③
②
①
Fig. 6.4.6-1
电子竞赛
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
