RoHS & Halogen Free & REACH Compliance.
SPECIFICATION FOR APPROVAL
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CPY160808T-SERIES-NP
SPECIFICATION
ACCEPTED BY:
COMPONENT
ENGINEER
ELECTRICAL
ENGINEER
MECHANICAL
ENGINEER
APPROVED
REJECTED
Chilisin Electronics (Henan) Co., Ltd.
XiuWu Xian, industry gathering area
JiaoZuo, Henan China
Postal Code:454350
TEL:+86-391-717-0682
FAX:+86-391-717-0666
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傑明邱
傑明邱
傑明邱
傑明邱
Drawn by
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Checked by
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司 公 限 有) 州 蘇( 子 電 新 力 奇
司 公 限 有) 州 蘇( 子 電 新 力 奇
司 公 限 有) 州 蘇( 子 電 新 力 奇
司 公 限 有) 州 蘇( 子 電 新 力 奇
Chilisin Electronics (Suzhou) Co., Ltd.
No.143,Song Shan Rd., Suzhou New District,
Suzhou,China
Postal Code:215129
TEL:+86-512-6841-2350
FAX:+86-512-6841-2356
E-mail suzhou@chilisin.com.tw
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Chilisin Electronic sCorp
No. 29, Alley 301, Tehhsin Rd.,
Hukou,Hsinchu 303, Taiwan
TEL +886-3- 599-2646
FAX +886-3- 599-9176
E-mail sales@chilisin.com.tw
http //www.chilisin.com.tw
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司公限有子電新力奇莞東
司公限有子電新力奇莞東
司公限有子電新力奇莞東
司 公 限 有) 南 河( 子 電 新 力 奇
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司 公 限 有) 南 河( 子 電 新 力 奇
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司公限有½股子電新力奇
司公限有½股子電新力奇
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Chilisin Electronics (Dongguan) Co., Ltd.
No. 78, Puxing Rd., Yuliangwei Administration
Area, Qingxi Town, Dongguan City,
Guangdong,China
TEL +86-769-8773-0251~3
FAX +86-769-8773-0232
E-mail cect@chilisin.com.tw
Approved by
JACKY jacky.chung
CPY160808T Series Specification
1 Scope:
This specification applies to Multilayer Ferrite chip inductors
2 Part Numbering:
3 Rating:
Operating Temperature:
－４０℃½１０５℃(Including
self - temperature rise)
Storage Temperature:
－４０℃½８５℃(after
PCB)
－５℃½４０℃,Humidity ４０％½７０％(before
PCB)
4 Marking:
5 Standard Testing Condition
Unless otherwise specified
Ordinary Temperature(15 to 35 )
Ordinary Humidity(25 to 85% RH)
In case of doubt
20±2
60 to 70 % RH
℃
Temperature
Humidity
℃
CPY160808T Series Specification
6 Configuration and Dimensions:
7 Electrical Characteristics:
Part No.
CPY160808T-1R0□-NP
CPY160808T-2R2□-NP
CPY160808T-4R7□-NP
CPY160808T-100□-NP
Inductance
(uH)
1
2.2
4.7
10
Test Freq.
1 MHz,200 mV
1 MHz,200 mV
1 MHz,200 mV
1 MHz,200 mV
RDC
( )Max.
0.12
0.2
0.25
0.9
Rated
Current
(mA)Max.
1500
1000
800
90
Tolerance
(±%)
20,30
20,30
20,30
20,30
NOTE:
□-tolerance
M=±20% / T=±30%
"-N" FOR COMPLETELY LEAD FREE TYPE(INCLUDING FERRITE BODY & SOLDER)
℃
2.Rate Current : Applied the current to coils, the temperature rise shall not be more than 30
℃５０１½℃０４－
1.Operating temperature range
(Including self - temperature rise)
CPY160808T Series Specification
8 CPY160808T Series
8.1 Construction:
8.2 Material List:
CPY160808T Series Specification
9
Reliability Of Ferrite Multilayer Chip Inductor
1-1.Mechanical Performance
No
Item
1-1-1 Flexure Strength
Specification
Test Method
The forces applied on the right
Test device shall be soldered on the substrate
conditions must not damage Substrate Dimension: 100x40x1.6mm
the terminal electrode and the Deflection: 2.0mm
ferrite
Keeping Time: 30sec
*For 100505, substrate dimension is 100x40x0.8mm
1-1-2 Vibration
Test device shall be soldered on the substrate
Oscillation Frequency: 10 to 55 to 10Hz for 1min
Amplitude: 1.5mm
Time: 2hrs for each axis (X, Y & Z), total 6hrs
1-1-3 Resistance to Soldering Heat Appearance: No damage
Pre-heating: 150 , 1min
More than 75% of the terminal.Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)
electrode should be covered Solder Temperature: 260±5
with solder.
Immersion Time: 10±1sec
Inductance: within ±20% of
initial value
1-2.Environmental Performance
No
Item
1-2-1 Temperature Cycle
Specification
Test Method
One cycle:
Step
Time (min)
Temperature ( )
1
-40±3
30
2
25±2
3
3
105±3
30
4
25±2
3
Total: 100cycles
Measured after exposure in the room condition for 24hrs
Temperature: 40±2
Relative Humidity: 90 ~ 95% / Time: 1000hrs
Measured after exposure in the room condition for 24hrs
Temperature: 85±3
Relative Humidity: 20%
Applied Current: Rated Current / Time: 1000hrs
Measured after exposure in the room condition for 24hrs
Temperature: -40±3
Relative Humidity: 0% / Time: 1000hrs
Measured after exposure in the room condition for 24hrs
℃
1-2-4 Low
Temperature Resistance
℃
1-2-3 High
Temperature Resistance
℃
1-2-2 Humidity Resistance
℃
Appearance: No damage
Inductance:within±20% of
initial value
℃
℃
1-1-4 Solder ability
The electrodes shall be at
least 95% covered with new
solder coating
Pre-heating: 150 , 1min
Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)
Solder Temperature: 245±5 (Pb-Free)
Immersion Time: 4±1sec
℃
℃
FPGA/CPLD
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