SMCJ-AT SERIES
Transient Voltage Suppressors (TVS) Data Sheet
Features
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For surface mounted applications in order to optimize board space
Low profile package
Built-in strain relief
Glass passivated junction
Low inductance
Excellent clamping capability
1500W peak pulse power capability at 10/1000μs waveform,
repetition rate (duty cycle): 0.01%
Fast response time
Typical I
R
less than 1μA above 10V
High Temperature soldering: 260℃/10 seconds at terminals
Plastic package has underwriters laboratory flammability 94V-0
Meets MSL level 1, per J-STD-020
Safety certification: UL: E244458
AEC-Q101 qualified
Mechanical Data
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Case: JEDEC DO-214AB. Molded plastic over glass passivated junction
Terminal: Solder plated, solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes cathode except bi-directional models
Standard Packaging: 16mm tape (EIA STD RS-481)
Weight: 0.26g
Applications
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I/O interface
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AC/DC power supply
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Low frequency signal transmission line (RS232, RS485, etc.)
Maximum Ratings and Characteristics
Ratings at 25℃ ambient temperature unless otherwise specified.
Rating
Peak pulse power dissipation at 10/1000μs waveform
(Note1, Note2, Fig.1)
Peak pulse current of at 10/1000μs waveform (Note 1, Fig.3)
Steady state power dissipation at T
A
=50℃ (Fig.5)
Peak forward surge current, 8.3ms single half sine-wave
superimposed on rated load, (JEDEC Method) (Note3, Fig.6)
Operating junction and Storage Temperature Range.
Typical thermal resistance junction to lead
Typical thermal resistance junction to ambient
Symbol
P
PPM
I
PPM
P
M(AV)
I
FSM
T
J
,T
STG
R
θJL
R
θJA
Value
Minimum 1500
See Table
6.5
200
-55 to +150
15
75
Units
Watts
Amps
Watts
Amps
℃
℃/W
℃/W
Notes: 1. Non-repetitive current pulse, per Fig.3 and derated above T
A
=25℃ per Fig.2.
2. Mounted on 8.0mm×8.0mm copper pads to each terminal.
3. 8.3ms single half sine-wave, or equivalent square wave, duty cycle=4 pulses per minutes maximum.
Revision:TVS-SMCJ-AT SERIES-001(A1)
1/6
http://brightking.pulseelectronics.com
SMCJ-AT SERIES
Ratings and Characteristic Curves (T
A
=25℃ unless otherwise noted)
Figure 1. Peak Pulse Power Rating Curve
Figure 2. Pulse Derating Curve
Peak Pulse Power (P
PP
) or Current (I
PP
)
Derating in Percentage %
100
100
P
PPM
- Peak Pulse Power (kW)
80
10
60
40
1
0.2×0.2″(5.0×5.0mm)
Copper Pad Area
20
0
0
25
50
75
100
125
150
175
T
A
-Ambient Temperature (℃)
0.1
1
10
100
1000
t
d
-Pulse Width (µs)
Figure 3. Pulse Waveform
150
Figure 4. Typical Junction Capacitance
100000
I
PPM
- Peak Pulse Current, %I
RSM
t
r
=10µs
T
J
=25℃
Pulse Width(t
d
) is defined as
the point where the peak
current decays to 50% of I
PPM
Bi-directional V=0V
10000
Uni-directional V=0V
Cj (pF)
100
Peak Value I
PPM
1000
Uni-directional @V
R
Half Value I
PPM
(I
PPM
/2)
50
10/1000µs Waveform
as defined by R.E.A
100
10
1
T
J
=25℃
f=1.0MHz
Vsig=50mVp-p
Bi-directional @V
R
0
0
t
d
1.0
2.0
t-Time (ms)
3.0
4.0
1
10
100
1000
V
BR
-Reverse Breakdown Voltage (V)
Figure 5. Steady State Power Dissipation Derating
Curve
7
6
5
4
3
2
1
0
0
25
50
75
100
125
150
175
T
A
-Ambient Temperature (℃)
Figure 6. Maximum Non-Repetitive Forward
Surge Current Uni-Directional Only
200
P
M(AV)
, Steady State Power Dissipation (W)
I
FSM
- Peak Forward Surve Current (A)
180
160
140
120
100
80
60
40
20
0
1
10
Number of Cycles at 60Hz
100
Revision:TVS-SMCJ-AT SERIES-001(A1)
4/6
http://brightking.pulseelectronics.com
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