SET23AXXL02 SERIES
Electrostatic Discharged Protection Devices (ESD) Data Sheet
Description
Brightking’s SET23AXXL02 series of transient voltage suppressor (TVS)
are designed to protect components which are connected to data and
transmission lines from voltage surges caused by electrostatic discharge
(ESD), electrical fast transients (EFT) and lightning.
TVS diodes are characterized by their high surge capability, low operating
and clamping voltages, and fast response time. This makes them ideal for
use as board level protection of sensitive semiconductor components.
The low profile SOT-23 package allows flexibility in the design of crowded
circuit boards.
Features
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IEC61000-4-2 ESD 15KV Air, 8KV contact compliance
SOT-23 surface mount package
Protects one bidirectional line or two unidirectional lines
Working voltage: 3.3V, 5V, 12V, 15V, 24V and 36V
Low leakage current
Low operating and clamping voltages
Solid-state silicon avalanche technology
Lead Free/RoHS compliant
Solder reflow temperature: Pure Tin-Sn, 260~270℃
Flammability rating UL 94V-0
Meets MSL level 1, per J-STD-020
Pin Configuration
Applications
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Cellular handsets and accessories
Personal digital assistants (PDA’s)
Portable instrumentation
Set Top Box (STB)
Servers, notebook, and desktop PC
Wireless bus protection
RS-232, RS-422, RS-423 protection
LINE 1
SET23AXXL02
LINE 2
Bidirectional Protect Line
LINE 1
LINE 2
X
LINE 1
LINE 2
LINE 1
LINE 2
SET23AXXL02
Unidirectional Protect Lines
Revision：31-Jul-15
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SET23AXXL02 SERIES
Maximum Ratings
Rating
ESD voltage (Contact discharge)
V
ESD
ESD voltage (Air discharge)
Storage & operating temperature range
T
STG
,T
J
±15
-55~+150
℃
Symbol
Value
±8
kV
Unit
Electrical Characteristics (T
J
=25℃)
SET23A03L02 (Marking: B 03C)
Parameter
Reverse stand-off voltage
Reverse breakdown voltage
Reverse leakage current
Clamping voltage (tp=8/20μs)
Clamping voltage (tp=8/20μs)
Symbol
V
RWM
V
BR
I
R
V
C
V
C
I
BR
=1mA
V
R
=3.3V
Each I/O pin
I
PP
=1A
I
PP
=10A
0Vdc,f=1MHz
Between I/O
pins and GND
4
5
7.5
15
Condition
Min.
Typ.
Max.
3.3
Unit
V
V
μA
V
V
Off state junction capacitance
C
J
200
pF
SET23A05L02 (Marking: B 05C)
Parameter
Reverse stand-off voltage
Reverse breakdown voltage
Reverse leakage current
Clamping voltage (tp=8/20μs)
Clamping voltage (tp=8/20μs)
Symbol
V
RWM
V
BR
I
R
V
C
V
C
I
BR
=1mA
V
R
=5V
Each I/O pin
I
PP
=1A
I
PP
=15A
0Vdc,f=1MHz
Between I/O
pins and GND
6
5
9.8
20
Condition
Min.
Typ.
Max.
5
Unit
V
V
μA
V
V
Off state junction capacitance
C
J
220
pF
Revision：31-Jul-15
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SET23AXXL02 SERIES
Electrical Characteristics (T
J
=25℃)
SET23A12L02 (Marking: B 12C)
Parameter
Reverse stand-off voltage
Reverse breakdown voltage
Reverse leakage current
Clamping voltage (tp=8/20μs)
Clamping voltage (tp=8/20μs)
Off state junction capacitance
Symbol
V
RWM
V
BR
I
R
V
C
V
C
C
J
I
BR
=1mA
V
R
=12V
Each I/O pin
I
PP
=1A
I
PP
=10A
0Vdc,f=1MHz
Between I/O
pins and GND
100
13.3
1
19
25.9
Condition
Min.
Typ.
Max.
12
Unit
V
V
μA
V
V
pF
SET23A15L02 (Marking: B 15C)
Parameter
Reverse stand-off voltage
Reverse breakdown voltage
Reverse leakage current
Clamping voltage (tp=8/20μs)
Clamping voltage (tp=8/20μs)
Off state junction capacitance
Symbol
V
RWM
V
BR
I
R
V
C
V
C
C
J
I
BR
=1mA
V
R
=15V
Each I/O pin
I
PP
=1A
I
PP
=10A
0Vdc,f=1MHz
Between I/O
pins and GND
90
16.7
1
24
30
Condition
Min.
Typ.
Max.
15
Unit
V
V
μA
V
V
pF
SET23A24L02 (Marking: B 24C)
Parameter
Reverse stand-off voltage
Reverse breakdown voltage
Reverse leakage current
Clamping voltage (tp=8/20μs)
Clamping voltage (tp=8/20μs)
Off state junction capacitance
Symbol
V
RWM
V
BR
I
R
V
C
V
C
C
J
I
BR
=1mA
V
R
=24V
each I/O pin
I
PP
=1A
I
PP
=5A
0Vdc,f=1MHz
Between I/O
pins and GND
80
26.7
1
43
49
Condition
Min.
Typ.
Max.
24
Unit
V
V
μA
V
V
pF
Revision：31-Jul-15
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SET23AXXL02 SERIES
Electrical Characteristics (T
J
=25℃)
SET23A36L02 (Marking: B 36C)
Parameter
Reverse stand-off voltage
Reverse breakdown voltage
Reverse leakage current
Clamping voltage (tp=8/20μs)
Clamping voltage (tp=8/20μs)
Off state junction capacitance
Symbol
V
RWM
V
BR
I
R
V
C
V
C
C
J
I
BR
=1mA
V
R
=36V
each I/O pin
I
PP
=1A
I
PP
=5A
0Vdc,f=1MHz
Between I/O
pins and GND
70
40
1
51
76.8
Condition
Min.
Typ.
Max.
36
Unit
V
V
μA
V
V
pF
Typical Characteristics Curves
Figure 1. Power Derating Curve
100
Figure 2. Pulse Waveforms
110
100
90
80
70
60
50
40
30
20
10
0
t
d
=t|I
PP
/2
Peak Power Dissipation (%)
90
80
70
60
50
40
30
20
10
0
0
25
50
75
100
125
150
175
t
r
Peak value Ipp
Waveform
Parameters:
t
r
=8µs
t
d
=20µs
0
5
10
15
20
25
30
T
A
-Ambient Temperature (℃)
t-Time (μs)
Figure 3. Forward Voltage vs. Forward Current
Figure 4. ESD Clamping(8kV Contact IEC61000-4-2)
Revision：31-Jul-15
Forward Voltage (V)
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SET23AXXL02 SERIES
Recommended Soldering Conditions
Reflow Soldering
Recommended Conditions
Profile Feature
Average ramp-up rate (T
L
to T
P
)
Preheat
-Temperature Min (T
S min
)
-Temperature Max (T
S max
)
-Time (min to max) (ts)
T
S max
to T
L
-Ramp-up Rate
Time maintained above:
-Temperature (T
L
)
-Time (t
L
)
Peak Temperature (T
P
)
Time within 5℃ of actual Peak Temperature (t
P
)
Ramp-down Rate
Time 25℃ to Peak Temperature
Pb-Free Assembly
3℃/second max.
150℃
200℃
60-180 seconds
3℃/second max.
217℃
60-150 seconds
260℃
20-40 seconds
6℃/second max.
8 minutes max.
Revision：31-Jul-15
www.brightking.com
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