BK2-M SERIES
Spark Gap (SPG) Data Sheet
Features
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Approximately zero leaking current before clamping voltage
Less decay at on/off state.
High capability to withstand repeated lightning strikes.
Low electrode capacitance(≤0.8pF) and high isolation(≥100MΩ).
RoHS compliant.
Bilateral symmetrical.
Temperature, humidity and lightness insensitive.
Operating temperature: -40
℃
~ +85
℃
Storage temperature: -40℃ ~ +125℃
Meets MSL level 1, per J-STD-020
Safety certification: UL: E244458
Applications
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Power Supplies
Motor sparks eliminating
Relay switching spark absorbing
Data line pulse guarding
Electronic devices requiring UL497A and UL497B compliant
Telephone/Fax/Modem
High frequency signal transmitters/receivers
Satellite antenna
Radio amplifiers
Alarm systems
Cathode ray tubes in Monitors/TVs
Dimensions
Symbol
2.0
Dimension (mm)
5.0±0.5
Φ2.8±0.5
Φ2.6±0.5
0.4±0.1
L
D
d
t
Revision：12-Aug-14
www.brightking.com
BK2-M SERIES
Electrical Characteristics
DC
Spark-over
Voltage
Vs(V)
BK2XX00702-M
BK2XX01002-M
BK2XX01102-M
BK2XX01502-M
BK2XX02002-M
BK2XX02502-M
BK2XX03002-M
BK2XX03502-M
BK2XX05002-M
Note：① Vs±XX%
140
200
220
300
400
500
600
700
1000
Minimum
Insulation Resistance
Test Voltage(V)
50
100
100
100
250
250
250
250
500
IR
OHM
(MΩ)
100
100
100
100
100
100
100
100
100
Maximum
Capacitance
(1KHz-6V
MAX
)
C(pf)
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
Surge current
capacity
(8/20μs)
1000A
1000A
1000A
1000A
1000A
1000A
1000A
1000A
1000A
Part Number
①
Test Methods and Results
Items
DC Spark-over
Voltage
Insulation
Resistance
Capacitance
Static Life
Test Method
Measure starting discharge voltage (Vs) by
gradually increasing applied DC voltage. Test
current is 0.5mA max. And the DC voltage
ascends up within 100V/s(Vs＜1000V) or
500V/s(Vs≥1000V).
Measure the insulation resistance across the
terminal at regular voltage. But the test voltage
doesn’t over the DC spark-over voltage.
Measure the electrostatic capacitance by
applying a voltage of less than 6V (at 1KHz)
between terminals.
10KV with 1500pf condenser is discharged
through 0Ω resistor. 200 times at an interval of
10sec.
1.2/50μs & 8/20μs, 1000A, electrically
connected with a resistor (1~2Ω), ±5 times,
each time interval 60 seconds. Thereafter,
outer appearance shall be visually examined.
Measurement after -40℃/1000 HRS & normal
temperature/2 HRS.
Measurement after 125℃/1000 HRS & normal
temperature/2 HRS.
Measurement after humidity 90~95℃(45℃)
/1000 HRS & normal temperature/2 HRS.
10 times repetition of cycle -40℃/30min
→normal,
temp/2 min
→125℃/30min,
measurement after normal temp/2 HRS.
Apply flux and immerse in molten solder
230±5℃ for 3sec up to the point of 1.5mm
from body. Check for solder adhesion.
Measurement after lead wire is dipped up to
the point of 1.5mm from body into 260±5℃
solder for 10sec.
Standard
Meet specified value.
Rate-of-change, within
±30%
insulation resistance & capacitance,
conformed to rated spec.
No crack and no failures
Surge Current
Capacity
Cold Resistance
Heat Resistance
Humidity Resistance
Temperature Cycle
Solder Ability
Solder Heat
Features are conformed to rated
spec.
Lead wire is evenly covered by solder.
Conformed to rated spec.
Revision：12-Aug-14
www.brightking.com
BK2-M SERIES
Recommended Soldering Conditions
Flow Soldering Conditions
Reflow Soldering Conditions
1) Time shown in the above figures is measured from the point when chip surface reaches temperature.
2) Temperature difference in high temperature part should be within 110
℃
.
3) After soldering, do not force cool, allow the parts to cool gradually.
Hand Soldering
Solder iron temperature: 350±5℃
Heating time: 3 seconds max.
General attention to soldering
●
High soldering temperatures and long soldering times can cause leaching of the termination, decrease in
adherence strength, and the change of characteristic may occur.
●
For soldering, please refer to the soldering curves above. However, please keep exposures to temperatures
exceeding 200℃ to fewer than 50 seconds.
●
Please use a mild flux (containing less than 0.2wt% CI). Also, if the flux is water soluble, be sure to wash
thoroughly to remove any residue from the underside of components that could affect resistance.
Cleaning
When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can
cause cracking or a decrease in the adherence of the termination, we recommend that you use the conditions
below.
Frequency: 40kHz max.
Output power: 20W/liter
Cleaning time: 5 minutes max.
Revision：12-Aug-14
www.brightking.com
BK2-M SERIES
Packaging
Tape
Symbol
W
P0
P1
P2
D0
D1
E
F
A0
B0
K0
T
Reel
D
d
L
Quantity: 1500PCS
Dimension (mm)
12.00±0.20
4.00±0.10
4.00±0.10
2.00±0.10
Φ1.5±0.10
Φ1.5±0.10
1.75±0.10
5.50±0.05
3.00±0.10
6.00±0.10
3.00±0.10
0.30±0.05
178.0
13.0
15.0
Revision：12-Aug-14
www.brightking.com
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