ACX
LF 1608 Series
Multilayer Chip Low-Pass Filters
Features
Monolithic
structure replacing one inductor and three
capacitors.
RoHS
compliant
Advanced Ceramic X
Applications
0.5-6GHz
wireless communication systems, including DECT /
PACS / PHS / GSM / DCS / PCS phones, WLAN card,
Bluetooth modules, etc.
Specifications
Part Number
Freq. Range
(MHz)
699 ~ 787
787 ~ 960
Insertion Loss
@ BW (dB)
0.6 max.@25℃
Return Loss
@ BW(dB)
Frequency
( MHz)
1427~1920
Attenuation
(dB)
30 min.
30 min.
LF1608-
LR83KAA_
0.8 max.@-40~85℃
0.7 max.@25℃
0.9 max.@-40~85℃
10 min.
2097~2880
Q’ty/Reel (pcs)
: 4,000
Operating Temperature Range
: -40 ~ +85
o
C
Storage Temperature Range
: -40 ~ +85
o
C
Storage Period
: 12 months max.*
*12 months in vacuum sealed bag and 1 week after opened. Please keep unused parts in vacuum sealed bags.
Solder Paste
: SAC 305 type is recommended.
Power Capacity
: 3W max.
Part Number
LF
Type
Material Code
Specification Code
Soldering
1608
- L R83
KAA
/LF
1.6 × 0.8 mm
R83=830MHz
T: Tape & Reel
B: Bulk
LF : Low Pass Filter
Dimensions ( L × W )
L
KAA
/LF=lead-free
Frequency Range
Packaging
LF1608-LR83KAAT/LF
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ACX
Terminal Configuration
Advanced Ceramic X
No.
Terminal Name
GND
NC
GND
No.
Terminal Name
OUT
GND
IN
Dimensions and Recommended PC Board Pattern
Unit : mm
a
W
c
L
g
p
T
b
Mark
Dimensions
L
1.6
0.1
W
0.8
0.1
T
0.6
0.1
a
0.2
0.1
b
0.2+0.1
/-0.15
c
0.15
0.1
g
0.3
0.1
p
0.50
0.05
0.25
Solder Resist
0.4
*
*
0.5
Through-hole (
0.2)
Through-hole (
0.55)
0.25
*
Line width should be designed to match 50 characteristic impedance, depending on PCB
material and thickness.
Land
LF1608-LR83KAAT/LF
REV:1 PAGE:2/5
ACX
Measuring Diagram
Port 1
(50)
Advanced Ceramic X
Network
analyzer
Port 2
(50)
GND
NC
GND
GND
Typical Electrical Characteristics (T=25
o
C)
0
-10
dB(S(2,2))
dB(S(2,1))
dB(S(1,1))
-20
-30
-40
-50
-60
-70
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
freq, GHz
Notes
The
contents of this data sheet are subject to change without notice. Please confirm the specifications
and delivery conditions when placing your order.
LF1608-LR83KAAT/LF
REV:1 PAGE:3/5
ACX
Mechanical & Environmental Characteristics
Item
Requirements
1. No apparent damage
Solderability
2. More than 75% of the terminal
electrode shall be covered with
new solder.
Soldering strength
(Termination
Adhesion)
1. 1kg minimum
1. Solder specimen onto test jig.
1. Preheat: 120 5
o
C
2. Solder: 245 5
o
C for 5 1 sec
Procedure
Advanced Ceramic X
2. Apply push force at 0.5mm/s until electrode pads are
peeled off or ceramic are broken. Pushing force is
applied to longitude direction.
1. Solder specimen onto test jig (FR4, 0.8mm) using the
recommend soldering profile.
2. Apply a bending force of 2mm deflection
Pressure Rod
Deflection
(Substrate
Bending)
1. No apparent damage
2. Fulfill the electrical specification
R230
90mm
Heat/Humidity
Resistance
1. No apparent damage
2. Fulfill the electrical specification
after test
1. Temperature: 85 2
o
C
2. Humidity: 90% ~ 95% RH
3. Duration: 1000±48hrs
4. Recovery: 1-2hrs
1. One cycle/step 1：125 ± 5C for 30 min
step 2：- 40 ± 5C for 30 min
2. No of cycles：100
3. Recovery:1-2 hrs
1. Temperature: -40 5
o
C
2. Duration: 500 ±24hrs
3. Recovery: 1-2hrs
Thermal shock
(Temperature
Cycle)
1. No apparent damage
2. Fulfill the electrical specification
after test
1. No apparent damage
2. Fulfill the electrical specification
after test
Low Temperature
Resistance
LF1608-LR83KAAT/LF
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ACX
Soldering Conditions
Typical
Soldering Profile for Lead-free Process
Reflow Soldering :
Advanced Ceramic X
Temperature (
o
C)
250
o
C
217
o
C
150-200
o
C
10s max.
Pre-heating
60-180s
Time (s.)
60-90s.
Notes
The
contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery
conditions when placing your order.
Advanced Ceramic X Corp.
16 Tzu Chiang Road, Hsinchu Industrial District Hsinchu Hsien 303, Taiwan
TEL:886-3-5987008 FAX:886-3-5987001
E-mail:
acx@acxc.com.tw
http://www.acxc.com.tw
LF1608-LR83KAAT/LF
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