TAK CHEONG
®
SEMICONDUCTOR
Flat Lead Plastic Package
Schottky Barrier Diode
Absolute Maximum Ratings
Symbol
P
D
T
STG
T
J
V
RM
I
O
I
FSM
I
FRM
Power Dissipation
T
A
= 25°C unless otherwise noted
Value
500
-55 to +150
+150
40
1
9
1.5
Units
mW
°C
°C
V
A
A
A
Parameter
Storage Temperature Range
Operating Junction Temperature
Repetitive Peak Reverse Voltage
Average Rectified Output Current
Peak Forward Surge Current
(t=8.3ms Single Half Sine-wave)
Repetitive Peak Forward Current
These ratings are limiting values above which the serviceability of the diode may be impaired.
Specification Features:
For use in low voltage, high frequency inverters, free wheeling & polarity protection…
Flat Lead SOD-123 Small Outline Plastic Package
Surface Device Type Mounting
RoHS Compliant
Green EMC
Matte Tin(Sn) Lead Finish
Band Indicates Cathode
Weight: approx. 0.01g
DEVICE MARKING CODES:
Device Type
Device Marking
B5819W
SL
Electrical Characteristics
Symbol
V
BR
I
R
V
F
T
A
= 25°C unless otherwise noted
Parameter
Test Condition
Min
I
R
=1mA
V
R
=40V
I
F
=1A
I
F
=3A
40
--
--
Limits
Typ
--
--
--
0.90
--
--
120
pF
Max
-
1
0.60
Volts
Volts
mA
Unit
Reverse Breakdown Voltage
Reverse Leakage Current
Forward Voltage
Cd
Diode Capacitance
V
R
=4V
f= 1MHz
Number: DB-237
Aug. 2012 Revision A
Page 1
B5819W
SOD-123 SURFACE MOUNT
TAK CHEONG
®
SEMICONDUCTOR
RATING AND CHARACTERISTIC CURVES
600
POWER PASSIPATION,mW
500
400
300
200
100
0
0
25
50
75
100
125
150
175
200
TEMPERATURE [
℃
]
Fig.3 POWER DISSIPATION VS. AMBIENT TEMP.
1000.0
f = 1MHz
Ta = 25
℃
Typical Junction Capacitance
[pF]
100.0
10.0
0
5
10
15
20
25
30
35
40
Reverse Voltage [V]
Number: DB-237
Aug. 2012 Revision A
Page 2