THD1015
Series
▓
Pitch=1.0mm , H=1.5mm FPC Connector (Front–Flip lower contact)
■
Scope
This specification covers the 0.5 mm Pitch FPC Connector
THD1015
series.
■
Ordering information
THD1015 - xx CL - XX
❶
❶
❷
❸
❷
❸
❹
Plating：
GF= 1µ”~3µ” Gold Flash
G3= 3µ” Gold over Nickel
G5= 5µ” Gold over Nickel
SN= Tin(Lead Free) over Nickel
Series name：THD1015
Number of contacts：4 TO 60
Contact type：CL:Lower contact
❹
■
Rating
Item
Voltage Rating(Max.)
Current Rating(Max.)
Operating Temperature Range
Standard
50V AC
0.5A DC
-55°C
½
+85°C (Including terminal temperature rise)
■
Material
Housing
L.C.P (UL94V-0)
Color：White
Actuator
L.C.P (UL94V-0)
Color： Black
Terminal
Copper alloy
Solder pin
Copper alloy
Plating
1µ”~3µ” Gold Flash
■
Performance
Item
Contact Resistance
Test Condition
Specification
Mate applicable FPC and measure by dry circuit, 20mV
100 mΩ Max.
Max, 1mA.
Mate applicable FPC and apply 500V DC between adjacent
50 MΩ Min.
Insulation Resistance
terminal or ground.
Mate applicable FPC, apply 250V AC(rms) for
No Breakdown
Dielectric Strength
1 minute between adjacent terminal or ground.
Insert the actuator, pull the FPC at a rate of 25±3mm
Per pin x 0.15N Min.
FPC Retention Force
per minute.
Terminal Retention
Apply axial pull out force at the rate of 25±3 mm/minute
Per pin x 0.06Kgf {0.6N} Min.
Force
on the terminal assembled in the housing.
Mate connectors and subject to the following vibration
Appearance
No Damage
conditions, for period of 2 hours in each of 3 mutually
perpendicular axes, passing DC 1mA during the test.
Contact
100 mΩ Max.
Vibration
Resistance
Amplitude : 1.5mm P-P
Frequency : 10½55½10 Hz in 1 minute.
Discontinuity
1
μsec
Max.
Duration : 2 hours in each of X,Y,Z axes.
Mate applicable FPC and subject to the following shock
Appearance
No Damage
conditions. 3 times of shocks shall be applied for each
Contact
6 directions along 3 mutually perpendicular axes,
100 mΩ Max.
Shock
Resistance
passing DC 1 mA current during the test.
Peak value : 490m/s
2
{50G}
Mate applicable FPC and expose to the following salt
mist conditions. Upon completion of the exposure
period, salt deposits shall be removed by a gentle wash
or dip in running water, after which the specified
measurements shall be performed.
NaCl solution
Concentration
: 5 ± 1%
Spray time
:48 ± 4 hours
Ambient temperature : 35 ± 2°C
Discontinuity
1
μsec
Max.
Appearance
No Damage
Salt Spray
Contact
Resistance
100 mΩ Max.
2/3
THD1015
Series
▓
Pitch=1.0mm , H=1.5mm FPC Connector (Front–Flip lower contact)
Item
Test Condition
Mate applicable FPC and expose to 85±2°C for 96 hours.
Upon completion of the exposure period, the test
specimens shall be conditioned at ambient room
conditions for 1 to 2 hours, after which the specified
measurements shall be performed.
Mate applicable FPC and expose to -40±2°C for 96 hours.
Upon completion of the exposure period, the test
specimens shall be conditioned at ambient room
conditions for 1 to 2 hours, after which the specified
measurements shall be performed.
Specification
Appearance
Contact
Resistance
Appearance
Contact
Resistance
Appearance
No Damage
100 mΩ Max.
No Damage
100 mΩ Max.
No Damage
100 mΩ Max.
No Breakdown
50 MΩ Min.
Heat Resistance
Cold Resistance
Humidity
Mate applicable FPC and expose to 60 ± 2°C, relative
humidity 90 to 95% for 96 hours. Upon completion of
the exposure period, the test specimens shall be
conditioned at ambient room conditions for 1 to 2
hours, after which the specified measurements shall
be performed.
Contact
Resistance
Dielectric
Strength
Insulation
Resistance
Temperature Rise
Mate applicable FPC and measure the temperature rise
of contact when the maximum AC rated current is passed.
Temperature
rise
30°C Max.
Temperature Cycling
Mate applicable FPC and subject to the following
conditions for 5 cycles.
Upon completion of the exposure period, the test
specimens shall be conditioned at ambient room
conditions for 1 to 2 hours, after which the specified
measurements shall be performed.
1 cycle
a) -55±3°C
30minutes
b) +85±3°C
30minutes
(Transit time shall be with in 3 minutes)
Tip of solder tails and fitting nails into the molten
solder (held at 245±5°C) up to 0.1mm from the bottom
of the housing for 3±0.5 seconds.
Appearance
No Damage
Contact
Resistance
100 mΩ Max.
Solderability
Solder
Wetting
95% of immersed
area must show no
voids, pin holes.
When reflowing refer to Infrared reflow condition
Soldering iron method
Resistance to Soldering 0.2mm from terminal tip and fitting nail tip.
Soldering time
: 5 seconds Max.
Solder temperature : 370½400°C
Appearance
No Damage
■
Recommended Temperature Profile
250°C MAX(Peak Temp)3sec or less
230°C MIN/20~40sec
(60sec)
Start (Pre-Heat 150°C MAX)
(60~90sec)
(30sec)
Emperature Condition Graph
(Temperature On Board Pattern Side)
3/3
模拟电子
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
