MXD8642
SP4T Switch for 3G/4G Application
VED
APPRO
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Company Limited (Maxscend) and may not be reproduced in any form without express written consent of
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Page 1 of 7
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MXD8642 – SP4T Switch for 3G/4G Application
General Description
The MXD8642 is a SOI SP4T switch suitable for
LTE/UMTS/CDMA application. The MXD8642
features very low insertion loss, high isolation
and excellent linearity performance down to
1.0V control voltage at high frequency up to
2.7GHz. In addition, this switch is able to
handle high power signals up to 36dBm. The
MXD8642 has internal ESD protection devices
to achieve excellent ESD performances. No DC
Blocking capacitors are required for all RF
ports unless DC is biased externally. And the
compact QFN-12L 1.8mm × 1.8mm × 0.55mm
package is adopted.
Applications
LTE,UMTS,CDMA application
General Purpose Switching applications
Features
Low voltage logic control:1.8V typical
Low insertion loss:
0.35dB @ 0.9GHz
0.40dB @ 1.9GHz
0.45dB @ 2.7GHz
P0.1dB 36dBm
Ultra small package,
QFN-12L (1.8mm × 1.8mm × 0.55mm)
Functional Block Diagram and Pin Function
GND
RF2
GND
12
11
10
9
RF1
Decoder
V2
1
2
8
7
GND
V1
ANT
3
VDD
4
RF4
5
GND
6
RF3
Page 2 of 7
Figure 1 Functional Block Diagram and pin out
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MXD8642 – SP4T Switch for 3G/4G Application
Application Circuit
12
GND
11
RF2
10
GND
9
RF1
V2
1
2
8
7
GND
ANT
Decoder
V1
3
VDD
4
RF4
5
GND
6
RF3
Figure 2 MXD8642 Pin Diagram
Table 1. Pin Description
Pin No.
1
2
3
4
5
6
Name
V2
V1
VDD
RF4
GND
RF3
Description
Control Logic #2
Control Logic #1
Power Supply
RF Input / Output
RF and DC Ground
RF Input / Output
Pin No.
7
8
9
10
11
12
Name
ANT
GND
RF1
GND
RF2
GND
Description
RF signal in Antenna
RF and DC Ground
RF Input / Output
RF and DC Ground
RF Input / Output
RF and DC Ground
Table 2.Truth Table
V
1
H
L
H
L
V
2
L
H
H
L
Path
ANT-RF1
ANT-RF2
ANT-RF3
ANT-RF4
Page 3 of 7
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MXD8642 – SP4T Switch for 3G/4G Application
Absolute Maximum Ratings
Table 3. Maximum ratings
Parameters
Supply voltage
Digital control voltage
RF input power
Operating temperature
Storage temperature
Electrostatic Discharge
Human body model (HBM),
Class 1C
Machine Model (MM),
Class A
Charged device model (CDM),
Class III
Symbol
V
DD
V
CTL
P
IN
T
OP
T
STG
ESD_HBM
ESD_MM
ESD_CDM
Minimum
+2.5
0
–20
–55
Maximum
+3.0
+3.0
+36
+85
+150
1000
100
500
V
Units
V
V
dBm
℃
℃
Note:
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no
damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value.
Exceeding any of the limits listed here may result in permanent damage to the device.
Recommended Operation Range
Table 4. Recommended operation condition
Parameters
Operation Frequency
Power supply
Supply current,
Control voltage – High
Control voltage – Low
Control current - High
Control current - Low
Symbol
f1
V
DD
I
DD
V
CTLH
V
CTLL
I
CTLH
I
CTLL
Min
0.1
2.5
-
1.0
0
Typ
-
2.8
50
1.8
0
Max
3.0
3.0
70
V
DD
0.3
5
5
Units
GHz
V
μA
V
V
μA
μA
Page 4 of 7
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MXD8642 – SP4T Switch for 3G/4G Application
Specifications
Table 5. Electrical Specifications
Nominal conditions unless otherwise specified. V
DD
= 2.8 V, V
1
& V
2
= 1.8V / 0V, Temp = 25°C, 50Ω.
Parameter
Switching Time
Start-up time
ON Switching speed
OFF Switching speed
Supply current
Sym
Specification
Min.
Typ
Max.
Units
Test Condition
t
start-up
T
on
T
off
I
DD
-
-
-
-
1
1
1
50
10
5
5
70
μs
μs
μs
μA
50% V
DD
to large signal fully compliant
50% control to 90% RF ON
50% control to 90% RF ON
V
DD
= 2.8 V, V
CTL
= V
CTL_H
RF Specifications
Insertion loss 1/2/3/4
IL
-
35
30
25
-
-
-
+65
+63
0.35
0.40
0.45
40
35
28
+36
-80
-75
+70
+65
dB
dB
dB
dB
dB
dB
dBm
dBc
dBc
dBm
900 MHz
1900 MHz
2700 MHz
900 MHz
1900 MHz
2700 MHz
0.7 GHz to 3 GHz
900MHz, +34dBm
900MHz, +34dBm
829+849 MHz , Pin = +24dBm
1870+1910 MHz , Pin = +24dBm
-
Isolation 1/2/3/4
Pin at 0.1dB
compression point
2
nd
Harmonic
3
rd
Harmonic
3rd intercept point1
3rd intercept point2
ISO
P
0.1dB
2f0
3f0
IIP3(1)
IIP3(2)
-
-70
-70
-
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