MXD8638C
0.1-3.0GHz SP3T Switch
VED
APPRO
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Company Limited (Maxscend) and may not be reproduced in any form without express written consent of
Maxscend. No transfer or licensing of technology is implied by this document.
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Maxscend Microelectronics Company Limited. All rights reserved.
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MXD8638C – 0.1-3.0GHz SP3T Switch
General Description
The MXD8638C is a CMOS silicon-on-insulator
(SOI), single-pole, triple-throw (SP3T) transmitting
and
receiving
switch.
The
high
linearity
Applications
GSM/WCDMA/LTE receive and transmit
802.11b/g/n WLANs
performance and low insertion loss makes the
device an ideal choice for GSM/WCDMA/LTE
handset and data card applications.
The MXD8638C SP3T switch is provided in a
compact QFN 9-pin 1.15mm x 1.15mm x 0.45mm
package. A functional block diagram is shown in
Figure 1. The pin configuration and package are
shown in Figure 2. Signal pin assignments and
functional pin descriptions are provided in Table 1.
Features
Broadband frequency range: 0.1 to 3.0 GHz
Low insertion: 0.45 dB @ 2.7 GHz
High isolation: 25 dB up to 2.7 GHz
P0.1dB of 36dBm
No external DC blocking capacitors required
Positive low voltage control: VC = 1.6 to 3.00
V, VDD = 2.5 to 3.0 V
Small, QFN (9-pin, 1.15mm x 1.15mm x
0.45mm) package
Functional Block Diagram and Pin Function
RF1
RF2
RF3
1
V1
8
V2
7
VDD
ANT
2
RF3
9
GND
6
GND
Logic and Supply
3
RF1
4
ANT
5
RF2
VDD
V1 V2
Figure 2 Pin-out (Top View)
Figure 1 Functional Block Diagram
Page 2 of 6
Maxscend Microelectronics Company Limited. All rights reserved.
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MXD8638C – 0.1-3.0GHz SP3T Switch
Application Circuit
V1
V2
VDD
C1
100pF
C2
100pF
C3
100pF
1
V1
8
V2
7
VDD
RF3
2
RF3
9
GND
6
GND
3
RF1
4
ANT
5
RF2
RF1
ANT
RF2
Figure 3 MXD8638C Application Circuit
Table 1. Pin Description
Pin No.
Name
Description
Pin No.
Name
Description
1
2
3
4
5
V1
RF3
RF1
ANT
RF2
Control Pin 1
RF-Port 3
RF-Port 1
Antenna
RF-Port 2
6
7
8
9
GND
VDD
V2
GND
Ground
Power Supply
Control Pin 2
Ground
Truth Table
Table 2.
V1
V2
Active Path
0
1
0
1
0
0
1
1
OFF
ANT to RF1
ANT to RF2
ANT to RF3
Note:
“1” = 1.0 V to 3.00 V. “0” = 0 V to +0.3 V.
Recommended Operation Range
Table 3.
Parameters
Operation Frequency
Power supply
Switch Control Voltage High
Switch Control Voltage Low
Symbol
f1
V
DD
V
CTL_H
V
CTL_L
Min
0.1
2.5
1.6
0
Typ
-
2.8
1.8
0
Max
3.0
3.0
3.0
0.3
Units
GHz
V
V
V
Page 3 of 6
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MXD8638C – 0.1-3.0GHz SP3T Switch
Specifications
Table 4.Electrical Specifications
Parameter
DC Specifications
Control voltage:
Low
High
Supply voltage
Supply current
Control current
RF Specifications
Insertion loss
IL
30
25
20
0.30
0.37
0.45
35
30
25
15
+70
0.35
0.40
0.50
dB
dB
dB
dB
dB
dB
dB
dBm
0.1 to 1.0 GHz
1.0 to 2.2 GHz
2.2 to 3.0 GHz
0.1 to 1.0 GHz
1.0 to 2.2 GHz
2.2 to 3.0 GHz
0.1 to 3.0 GHz
0.1 to 3.0 GHz,
ΔF
= 1 MHz,
PIN = +20 dBm/tone
0.1 to 3.0 GHz,
ANT to RF1,RF2 and RF3
0.1~3GHz,
PIN = +26 dBm
0.1~3GHz,
PIN = +26 dBm
50% VCTL to 10/90% RF
50% VCTL to 90/10% RF
Shutdown state to any RF
switch state
Symbol
Specification
Min.
Typical
Max.
Units
Test Condition
V
CTL_L
V
CTL_H
V
DD
I
DD
I
CTL
0
1.6
2.5
0
+1.8
2.8
35
1
0.3
3.0
3.0
60
V
V
V
μA
μA
VDD = 2.8 V
VC= 1.8 V
Isolation
Return loss
3rd Order Input
Intercept Point
Input 0.1 dB
compression
point
2nd harmonic
3rd harmonic
Switching on
time
Switching off
time
Startup time
ISO
|S11|
IIP3
+60
P0.1dB
2fo
3fo
+36
+90
+90
1
1
5
dBm
dBc
dBc
μs
μs
μs
Absolute Maximum Ratings
Table 5. Maximum ratings
Parameters
Supply voltage
Digital control voltage
RF input power
Operating temperature
Storage temperature
Electrostatic
discharge:
Human Body Model
(HBM), Class 1C
Machine Model (MM),
Class A
Symbol
V
DD
V
CTL
P
IN
T
OP
T
STG
Minimum
+2.5
0
–30
–55
Maximum
+3.3
+3.3
+36.5
+85
+150
Units
V
V
dBm
℃
℃
ESD
1000
100
V
V
Note:
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with
only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed
here may result in permanent damage to the device.
Page 4 of 6
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MXD8638C – 0.1-3.0GHz SP3T Switch
Package Outline Dimension
M
1
PIN 1 CORNER
M
TOP VIEW
DESCRIPTION
SYMBOL
A
A1
PIN 1 I.D.
MIN
0.40
0.00
MILLIMETER
NOM
0.45
---
0.30
MAX
0.50
0.05
0.35
0.30
1.20
TOTAL THICKNESS
STAND OFF
7
8
1
MOLD THICKNESS
L/F THICKNESS
A2
A3
0.25
0.10
1.10
0.150 REF
0.20
1.15
LEAD WIDTH
6
9
b
X
Y
2
BODY SIZE
D
E
1.10
0.10
1.15
0.40 BSC
0.20
0.1
1.20
0.30
LEAD PITCH
LEAD LENGTH
PACKAGE EDGE TOLERANCE
5
4
3
e
L
aaa
MOLD FLATNESS
COPLANARITY
LEAD OFFSET
bbb
ccc
ddd
0.1
0.08
0.1
EXPOSED PAD OFFSET
eee
0.1
BOTTOM VIEW
VIEW M-M
Figure 4. Package outline dimension
Page 5 of 6
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