Jk-SMD 0805 Series Surface Mount PTC Devices
Performance Specification
Maximum
Model
Mar
king
(V dc)
JK-SMD 010SF
JK-SMD 020SF
JK-SMD 035SF
JK-SMD 050SF
JK-SMD 075SF
JK-SMD 100SF
JK-SMD 110SF
JK-SMD 125SF
V max
I max
I hold
I trip
Pd
R1max
1
2
3
5
7
0
0
12
15.0
9.0
6.0
6.0
6.0
6.0
6.0
6.0
(A)
100
100
100
100
40
100
100
100
V
max
I
max
I
hold
@25°C
(A)
0.10
0.20
0.35
0.50
0.75
1.00
1.10
1.25
I
trip
@25°C
(A)
0.30
0.50
0.75
1.00
1.50
1.95
2.20
2.50
P
d
Typ.
(W)
0.5
0.5
0.5
0.5
0.6
0.6
0.6
1.5
Time To Trip
Current
(A)
0.5
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Time
(Sec)
1.50
0.02
0.10
0.10
0.20
0.30
0.30
0.60
Resistance
R i
min
()
1.000
0.650
0.250
0.150
0.090
0.060
0.060
0.030
R1
max
()
6.000
3.500
1.200
0.850
0.385
0.230
0.210
0.140
= Maximum operating voltage device can withstand without damage at rated current (Imax).
= Maximum fault current device can withstand without damage at rated voltage (V max).
= Hold Current. Maximum current device will not trip in 25°C still air.
= Trip Current. Minimum current at which the device will always trip in 25°C still air.
= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
= Maximum device resistance is measured one hour post reflow.
Ri min/max = Minimum/Maximum device resistance prior to tripping at 25°C.
CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Resistance to solvent
Vibration
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C
Conditions
+85°C, 1000 hrs.
+85°C, 85% R.H. , 168 hours
+85°C to -40°C, 20 times
MIL-STD-202,Method 215
MIL-STD-202,Method 201
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
Agency Approval and Environmental Complianc
Agency
UL
TUV
File Number
E217453
pending
Regulation
Standard
2011/65/EU
EN14582
http:// www.jksemi.com
-1-
2016-12-01
版次:
c
2- 1 -
Jk-SMD 0805 Series Surface Mount PTC Devices
Thermal Derading Chart
Recommended Hold Current(A) at Ambient Temperature(°C)
Model
JK-SMD 010SF
JK-SMD 020SF
JK-SMD 035SF
JK-SMD 050SF
JK-SMD 075SF
JK-SMD 100SF
JK-SMD 110SF
JK-SMD 125SF
Ambient Operation Temperature
-40°C
0.14
0.28
0.47
0.68
1.00
1.35
1.45
1.65
-20°C
0.12
0.25
0.44
0.62
0.90
1.25
1.35
1.53
0°C
0.11
0.23
0.39
0.55
0.79
1.15
1.20
1.36
25°C
0.10
0.20
0.35
0.50
0.75
1.00
1.10
1.25
40°C
0.08
0.17
0.30
0.40
0.63
0.82
0.92
1.05
50°C
0.07
0.14
0.27
0.37
0.57
0.74
0.84
0.95
60°C
0.06
0.12
0.24
0.33
0.53
0.65
0.75
0.85
70°C
0.05
0.10
0.20
0.29
0.41
0.55
0.65
0.74
85°C
0.03
0.07
0.14
0.23
0.34
0.42
0.52
0.59
Thermal Derating Curve
Derating Curves for SMD0805 HF Series
Percentage of Derated
Current
160
140
120
100
80
60
40
20
0
-40
-20
0
20
40
60
80
Temperature (°C)
Average Time-Current Curve
Average Time Current Curves
100
0.10A
0.20A
0.35A
Time In Seconds
10
1
0.50A
0.75A
0.1
1.00A
1.25A
0.01
0.1
1
10
Current In Amperes
http:// www.jksemi.com
-2-
2016-12-01
版次:
c
2- 2 -
Jk-SMD 0805 Series Surface Mount PTC Devices
Soldering Parameters
TP 20~40 S
TP
260
Ramp-up
Critical Zone
TL to TP
TL
217
Tsmax
tL
60~150 s
200
Tsmin
Ramp-down
150
ts
Preheat 60~180 s
25
t 25°C to peak
Time
Profile Feature
Average Ramp-Up Rate(Ts max to T p)
Preheat
-Temperature Min(Ts min)
-Temperature Max(Ts max)
-Time(Ts min to Ts max)
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(Tp)
Ramp-Down Rate
Time 25℃ to Peak Temperature
Storage Condition
Recommended maximum paste thickness is 0.25mm
Pb-Free Assembly
3℃/second
mac.
150℃
200℃
60~180 seconds
217℃
60~150 seconds
260℃
6℃/second max.
8 minutes max
0℃~35℃,≤70%RH
Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free
Devices can be cleaned using standard industry methods and solvents.
Note 1:All temperature refer to topside of the package, measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
http:// www.jksemi.com
-3-
2016-12-01
版次:
c
2- 3 -
Jk-SMD 0805 Series Surface Mount PTC Devices
Physical Dimensions(mm.)
A
B
2
D
A
B
Max.
2.20
2.20
2.20
2.20
2.20
2.20
2.20
2.20
Min.
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
Max.
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
Min.
0.50
0.45
0.45
0.30
0.40
0.50
0.50
0.50
E
C
C
Max.
1.00
1.00
1.00
0.60
1.00
1.10
1.20
1.20
D
Min.
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.20
E
Min.
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
Model
JK-SMD 010SF
JK-SMD 020SF
JK-SMD 035SF
JK-SMD 050SF
JK-SMD 075SF
JK-SMD 100SF
JK-SMD 110SF
JK-SMD 125SF
Termination Pad Characteristics
Min.
2.00
2.00
2.00
2.00
2.00
2.00
2.00
2.00
Terminal pad materials：Tin-plated Nickel-Copper
Terminal pad solder ability：Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
Recommended Pad Layout (mm.)
1.0
士
0.1
1.0
士
0.1
1.2
士
0.1
Packaging Quantity
Part Number
JK-SMD 010.020.035.050.SF
JK-SMD 075.100.110.125.SF
Tape & reel packaging per EIA481-1
Quantity
5,000 pcs/reel
4,000 pcs/reel
http:// www.jksemi.com
-4-
1.5
士
0.1
2016-12-01
版次:
c
2- 4 -
Jk-SMD 0805 Series Surface Mount PTC Devices
Tape And Reel Specifications (mm)
Governing
Specifications
W
P0
P1
P2
A0
B0
B1max.
D0
F
E1
E2min.
T
T1max.
K0
Leader min.
Trailer min.
Reel Dimensions
A max.
N min.
W1
W2
178
60
9.0 ± 0.5
12.0 ± 0.05
EIA 481-1
8.0 ± 0.3
4.0 ± 0.10
4.0 ± 0.10
2.0 ± 0.05
1.45 ± 0.10
2.30 ± 0.10
4.35
1.55 + 0.1, -0
3.5 ± 0.05
1.75 ± 0.10
6.25
0.25
0.1
0.74 ± 0.1
390
160
Cover tape
Carrier tape
Embossed cavity
W1(measured at hub)
T
P1
B
K0
EIA Tape Component Dimensions
T
Cover
A
B0
D
P0
Embossment
P2
E1
F
W
E2
EIA Reel Dimensions
W2(measured at hub)
A
N(hub dia.)
Storage And Handling
‧
Storage conditions：35°C max, 70% R.H.
‧
Devices may not meet specified performance
if storage conditions are exceeded.
Part Number System
JK -
SMD
口口口
S F
口口
V
special voltage Rating(Optional)
Lead-Free
Tin-plated Nickel-Copper
Holding Current Rating
Device Dimensions: Length/width(Unit:1/100 inch) Size 2012 mm / 0805 inch
JKSEMI
http:// www.jksemi.com
-5-
2016-12-01
版次:
c
2- 5 -
创意市集
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
